电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

HNA028-71T

产品描述IC Socket, SIP28, 28 Contact(s),
产品类别连接器    插座   
文件大小1MB,共4页
制造商Advanced Interconnections Corp
下载文档 详细参数 全文预览

HNA028-71T概述

IC Socket, SIP28, 28 Contact(s),

HNA028-71T规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称Advanced Interconnections Corp
Reach Compliance Codenot_compliant
ECCN代码EAR99
联系完成终止Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
设备插槽类型IC SOCKET
使用的设备类型SIP28
外壳材料GLASS FILLED THERMOPLASTIC
JESD-609代码e0
制造商序列号HNA
触点数28
Base Number Matches1

文档预览

下载PDF文档
ADVANCED
®
INTERCONNECTIONS
®
Board to Board
Interconnections
5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850 / 401-823-5200 • Fax 401-823-8723 • Email advintcorp@aol.com • Internet http://www.advintcorp.com
.100" (2.54 mm) Pitch Board to Board Interconnections
NB/LNB - Single Row
Molded Female
DRS - Dual Row
Molded Female
NA - Single Row
Molded Male
DRA - Dual Row
Molded Male
KSS - Single Row
Peel-A-Way
®
Female
DKS - Dual Row
Peel-A-Way
®
Female
NEW PHOTO
Low Profile
Board to Board
KSA - Single Row
Peel-A-Way
®
Male
DKA - Dual Row
Peel-A-Way
®
Male
Features:
!
High reliability method of
interconnecting.
!
Reliable mechanical support.
!
Complete flexibility. If the board to
board spacing you need is not shown
on pages 54 - 55 , consult factory.
Terminals and Contacts:
Terminal: Brass - Copper Alloy 360,
ASTM-B-16
Contact: Beryllium Copper - Copper
Alloy 172, ASTM-B-194
Plating:
Terminal: Gold over Nickel or
Tin-Lead over Nickel
Contact: Gold over Nickel or
Tin-Lead over Nickel
Body Material:
Molded -
Glass filled thermoplastic
Polyester (P
.B.T.) U.L. Rated 94V-O,
-60
°
C to 140
°
C (-76
°
F to 284
°
F)
High Temp Molded
- High temp. glass
filled thermoplastic, U.L. Rated 94V-O,
-60
°
C to 260
°
C (-76
°
F to 500
°
F)
Peel-A-Way
®
- Polyimide Film - Temp.
range -269
°
C to 400
°
C(-452
°
F to 752
°
F)
Page 52
How To Order
Single and Dual RowFemale
NB
010
-01
T
G
Contact Plating
G - Gold
T - Tin-Lead
Terminal Plating
G - Gold
T - Tin-Lead
Terminal Type
See page 53 for available
terminal types.
Body Type
NB/LNB - Single Row Molded
HNB/HLNB - Single Row High Temp Molded
KSS - Single Row Peel-A-Way
®
DRS - Dual Row Molded
HDRS - Dual Row High Temp Molded
DKS - Dual Row Peel-A-Way
®
Number of Pins
NB/LNB - 3 - 32, KSS - 2 - 100
DRS - 20 - 70, DKS - 4 - 200
How To Order
Single and Dual Row Male
NA
Body Type
NA - Single Row Molded
HNA - Single Row High Temp Molded
KSA - Single Row Peel-A-Way
®
DRA - Dual Row Molded
HDRA - Dual Row High Temp Molded
DKA - Dual Row Peel-A-Way
®
010
-68
T
Terminal Plating
G - Gold
T - Tin-Lead
Terminal Type
See page 53 for available
terminal types.
Number of Pins
NA/HNA - 3 - 32, KSA - 2 - 100
DRA/HDRA - 20 - 70, DKA - 4 - 200
Peel-A-Way® covered by patent rights issued and or pending.
inch/(mm)
出售火牛STM32开发板+3.2"TFT,带MP3,以太网,USB host,NAND FLASH
板上资源: ● CPU:意法半导体公司(ST)基于ARM Cortex-M3的32位处理器芯片 STM32F103VCT6 LQFP100脚,片内具有256KB FLASH,48KB RAM ( 片上集成12Bit A/D、D/A、PWM、CAN、USB、SDIO、FSM ......
qixiangyujj 淘e淘
BGA过孔
各位前辈,小弟现在要花一个PCB,上面有一颗BGA封装的芯片。球是0.25mm,球距是0.4mm。因此在BGA区域走线扇出时,盲孔只能打在BGA的球形焊盘上。我看过有的板子上这样的盲孔大小为4/10mil,基本 ......
takeshower PCB设计
EEWORLD大学堂----在实验室中测试多相调节器
在实验室中测试多相调节器:https://training.eeworld.com.cn/course/5014...
wanglan123 聊聊、笑笑、闹闹
PID经验总结
本帖最后由 paulhyde 于 2014-9-15 03:04 编辑 PID经验分享 ...
bluelool1 电子竞赛
面试求助
我在大学生就业中心招聘会上投的简历,我应聘的是数控系统维修与测试,一家数控公司第二天通知我面试,面试中先是笔试(数电模电自控原理),然后给我介绍薪资以及住宿,之后就让我等周一的消息 ......
宋佳佳 工作这点儿事
寻求芯片---升压型 LED 驱动芯片 带有2路输出且输出电压不一样
具体要求: dc-dc 输入5v led升压芯片(也可用降压,我输入端做一个升压电路) Vout1 4颗5-7V,Io1=100mA 可串可并 Vout2 4颗3.0-3.3V,Io2=20mA 可串可并 总功率 3W 封装没要求 ......
sud0 LED专区

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 347  2332  2268  560  875  7  47  46  12  18 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved