Hermetically Sealed, High Speed,
High CMR, Logic Gate
Optocouplers
Technical Data
6N134*
81028
HCPL-563X
HCPL-663X
HCPL-565X
5962-98001
HCPL-268K
HCPL-665X
5962-90855
HCPL-560X
*See matrix for available extensions.
Features
• Dual Marked with Device
Part Number and DSCC
Drawing Number
• Manufactured and Tested on
a MIL-PRF-38534 Certified
Line
• QML-38534, Class H and K
• Five Hermetically Sealed
Package Configurations
• Performance Guaranteed
over -55
°
C to +125
°
C
• High Speed: 10 M Bit/s
• CMR: > 10,000 V/
µ
s Typical
• 1500 Vdc Withstand Test
Voltage
• 2500 Vdc Withstand Test
Voltage for HCPL-565X
• High Radiation Immunity
• 6N137, HCPL-2601, HCPL-
2630/-31 Function
Compatibility
• Reliability Data
• TTL Circuit Compatibility
•
•
•
•
•
•
Line Receiver
Voltage Level Shifting
Isolated Input Line Receiver
Isolated Output Line Driver
Logic Ground Isolation
Harsh Industrial
Environments
• Isolation for Computer,
Communication, and Test
Equipment Systems
Truth Table
(Positive Logic)
Multichannel Devices
Input
On (H)
Off (L)
Output
L
H
Single Channel DIP
Input
On (H)
Off (L)
On (H)
Off (L)
Enable
H
H
L
L
Output
L
H
H
H
Description
These units are single, dual and
quad channel, hermetically sealed
optocouplers. The products are
capable of operation and storage
over the full military temperature
range and can be purchased as
either standard product or with
full MIL-PRF-38534 Class Level H
or K testing or from the appropri-
ate DSCC Drawing. All devices are
manufactured and tested on a
MIL-PRF-38534 certified line and
are included in the DSCC Quali-
fied Manufacturers List QML-
38534 for Hybrid Microcircuits.
Quad channel devices are
available by special order in the
16 pin DIP through hole
packages.
Functional Diagram
Multiple Channel Devices
Available
V
CC
V
E
V
OUT
Applications
• Military and Space
• High Reliability Systems
• Transportation, Medical, and
Life Critical Systems
GND
The connection of a 0.1
µ
F bypass capacitor between V
CC
and GND is recommended.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation which may be induced by ESD.
2
Each channel contains a GaAsP
light emitting diode which is
optically coupled to an integrated
high speed photon detector. The
output of the detector is an open
collector Schottky clamped
transistor. Internal shields
provide a guaranteed common
mode transient immunity
specification of 1000 V/µs. For
Isolation Voltage applications
requiring up to 2500 Vdc, the
HCPL-5650 family is also
available. Package styles for
these parts are 8 and 16 pin DIP
through hole (case outlines P and
E respectively), and 16 pin
surface mount DIP flat pack
(case outline F), leadless ceramic
chip carrier (case outline 2).
Devices may be purchased with a
variety of lead bend and plating
options. See Selection Guide
Table for details. Standard
Microcircuit Drawing (SMD)
parts are available for each
package and lead style.
Because the same electrical die
(emitters and detectors) are used
for each channel of each device
listed in this data sheet, absolute
maximum ratings, recommended
operating conditions, electrical
specifications, and performance
characteristics shown in the figures
are identical for all parts.
Occasional exceptions exist due to
package variations and limitations,
and are as noted. Additionally, the
same package assembly processes
and materials are used in all
devices. These similarities give
justification for the use of data
obtained from one part to
represent other parts’ performance
for reliability and certain limited
radiation test results.
Selection Guide–Package Styles and Lead Configuration Options
Package
Lead Style
Channels
Common Channel
Wiring
Withstand Test Voltage
Agilent Part # & Options
16 Pin DIP
8 Pin DIP
8 Pin DIP
8 Pin DIP
16 Pin Flat Pack 20 Pad LCCC
Through Hole Through Hole Through Hole Through Hole Unformed Leads Surface Mount
2
V
CC
, GND
1500 Vdc
6N134*
HCPL-268K
Gold Plate
Option #200
Option #100
Option #300
None
8102801EX
8102801EC
8102801EA
8102801UC
8102801UA
8102801TA
5962-
1
None
1500 Vdc
HCPL-5600
HCPL-5601
HCPL-560K
Gold Plate
Option #200
Option #100
Option #300
5962-
9085501HPX
9085501HPC
9085501HPA
9085501HYC
9085501HYA
9085501HXA
5962-
2
V
CC
, GND
1500 Vdc
HCPL-5630
HCPL-5631
HCPL-563K
Gold Plate
Option #200
Option #100
Option #300
None
8102802PX
8102802PC
8102802PA
8102802YC
8102802YA
8102802ZA
5962-
5962-
9800104KFX
9800104KFC
9800103K2A
5962-
9800103K2X
None
8102805PX
8102805PC
8102805PA
None
8102804FX
8102804FC
81028032A
None
81028032X
Gold Plate
Option #200
2
V
CC
, GND
2500 Vdc
HCPL-5650
HCPL-5651
4
V
CC
, GND
1500 Vdc
HCPL-6650
HCPL-6651
HCPL-665K
Gold Plate
2
None
1500 Vdc
HCPL-6630
HCPL-6631
HCPL-663K
Solder Pads
Commercial
MIL-PRF-38534, Class K
Standard Lead Finish
Solder Dipped
Butt Cut/Gold Plate
Gull Wing/Soldered
Class H SMD Part #
Prescript for all below
Either Gold or Solder
Gold Plate
Solder Dipped
Butt Cut/Gold Plate
Butt Cut/Soldered
Gull Wing/Soldered
Class K SMD Part #
Prescript for all below
Either Gold or Solder
Gold Plate
Solder Dipped
Butt Cut/Gold Plate
Butt Cut/Soldered
Gull Wing/Soldered
*JEDEC registered part.
MIL-PRF-38534, Class H 6N134/883B
9800101KEX 9085501KPX 9800102KPX
9800101KEC 9085501KPC 9800102KPC
9800101KEA 9085501KPA 9800102KPA
9800101KUC 9085501KYC 9800102KYC
9800101KUA 9085501KYA 9800102KYA
9800101KTA 9085501KXA 9800102KZA
3
Functional Diagrams
16 Pin DIP
Through Hole
2 Channels
1
2
3
4
5
6
7
8
GND
VO2
VCC
VO1
16
15
14
13
12
11
10
9
3
4
1
2
V
CC
V
E
V
OUT
6
5
8
7
1
V
CC
V
O1
V
O2
8
8 Pin DIP
Through Hole
1 Channel
8 Pin DIP
Through Hole
2 Channels
16 Pin Flat Pack
Unformed Leads
4 Channels
1
2
3
4
6
20 Pad LCCC
Surface Mount
2 Channels
15
V
CC2
19
20
V
O2
GND
2
V
O1
GND
1
7
8
V
CC1
13
12
16
VCC
VO1
VO2
VO3
VO4
GND
15
14
13
12
11
10
9
2
3
2
3
4
7
5
GND
5
10
6
7
8
GND
Note:
All DIP and flat pack devices have common V
CC
and ground. Single channel DIP has an enable pin 7. LCCC (leadless ceramic
chip carrier) package has isolated channels with separate V
CC
and ground connections. All diagrams are “top view.”
Outline Drawings
16 Pin DIP Through Hole, 2 Channels
20.06 (0.790)
20.83 (0.820)
0.89 (0.035)
1.65 (0.065)
4.45 (0.175)
MAX.
8.13 (0.320)
MAX.
0.51 (0.020)
MIN.
3.81 (0.150)
MIN.
0.20 (0.008)
0.33 (0.013)
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MAX.
7.36 (0.290)
7.87 (0.310)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
Leaded Device Marking
Agilent DESIGNATOR
Agilent P/N
DSCC SMD*
DSCC SMD*
PIN ONE/
ESD IDENT
A QYYWWZ
XXXXXX
XXXXXXX
XXX XXX
•
50434
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX (IF NEEDED)
COUNTRY OF MFR.
Agilent CAGE CODE*
Leadless Device Marking
Agilent DESIGNATOR
Agilent P/N
PIN ONE/
ESD IDENT
COUNTRY OF MFR.
A QYYWWZ
XXXXXX
•
XXXX
XXXXXX
XXX 50434
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX (IF NEEDED)
DSCC SMD*
DSCC SMD*
Agilent CAGE CODE*
* QUALIFIED PARTS ONLY
* QUALIFIED PARTS ONLY
4
Outline Drawings (continued)
8 Pin DIP Through Hole, 1 and 2 Channels
8 Pin DIP Through Hole, 2 Channels
2500 Vdc Withstand Test Voltage
9.40 (0.370)
9.91 (0.390)
0.76 (0.030)
1.27 (0.050)
8.13 (0.320)
MAX.
7.16 (0.282)
7.57 (0.298)
9.40 (0.370)
9.91 (0.390)
0.76 (0.030)
1.27 (0.050)
4.32 (0.170)
MAX.
8.13 (0.320)
MAX.
7.16 (0.282)
7.57 (0.298)
5.08 (0.200)
MAX.
0.51 (0.020)
MIN.
3.81 (0.150)
MIN.
0.20 (0.008)
0.33 (0.013)
0.51 (0.020)
MIN.
3.81 (0.150)
MIN.
0.20 (0.008)
0.33 (0.013)
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
7.36 (0.290)
7.87 (0.310)
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MAX.
7.36 (0.290)
7.87 (0.310)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
16 Pin Flat Pack, 4 Channels
7.24 (0.285)
6.99 (0.275)
20 Terminal LCCC Surface Mount,
2 Channels
2.29 (0.090)
MAX.
1.78 (0.070)
2.03 (0.080)
8.70 (0.342)
9.10 (0.358)
4.95 (0.195)
5.21 (0.205)
1.02 (0.040) (3 PLCS)
1.14 (0.045)
1.40 (0.055)
11.13 (0.438)
10.72 (0.422)
1.27 (0.050)
REF.
8.70 (0.342)
9.10 (0.358)
4.95 (0.195)
5.21 (0.205)
TERMINAL 1 IDENTIFIER
2.16 (0.085)
METALLIZED
CASTILLATIONS (20 PLCS)
0.64
(0.025)
(20 PLCS)
0.51 (0.020)
1.78 (0.070)
2.03 (0.080)
0.46 (0.018)
0.36 (0.014)
2.85 (0.112)
MAX.
8.13 (0.320)
MAX.
0.31 (0.012)
0.23 (0.009)
1.52 (0.060)
2.03 (0.080)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
SOLDER THICKNESS 0.127 (0.005) MAX.
0.89 (0.035)
0.69 (0.027)
5.23
(0.206)
MAX.
0.88 (0.0345)
MIN.
9.02 (0.355)
8.76 (0.345)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
5
Hermetic Optocoupler Options
Option
100
Description
Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This
option is available on commercial and hi-rel product in 8 and 16 pin DIP (see drawings below
for details).
4.32 (0.170)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.14 (0.045)
1.40 (0.055)
0.51 (0.020)
MAX.
4.32 (0.170)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.14 (0.045)
1.40 (0.055)
0.51 (0.020)
MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
0.20 (0.008)
0.33 (0.013)
7.36 (0.290)
7.87 (0.310)
200
300
Lead finish is solder dipped rather than gold plated. This option is available on commercial
and hi-rel product in 8 and 16 pin DIP. DSCC Drawing part numbers contain provisions for
lead finish. All leadless chip carrier devices are delivered with solder dipped terminals as a
standard feature.
Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This
option is available on commercial and hi-rel product in 8 and 16 pin DIP (see drawings below
for details). This option has solder dipped leads.
4.57 (0.180)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.40 (0.055)
1.65 (0.065)
0.51 (0.020)
MAX.
4.57 (0.180)
MAX.
0.20 (0.008)
0.33 (0.013)
9.65 (0.380)
9.91 (0.390)
4.57 (0.180)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.40 (0.055)
1.65 (0.065)
0.51 (0.020)
MAX.
5° MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
模拟与混合信号
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
