RS3A thru RS3K
Vishay General Semiconductor
Surface Mount Fast Switching Rectifier
FEATURES
• Low profile package
• Ideal for automated placement
• Glass passivated chip junction
• Fast switching for high efficiency
• High forward surge capability
• Meets MSL level 1, per J-STD-020, LF maximum
peak of 260 °C
DO-214AB (SMC)
• Solder dip 260 °C, 40 s
• Component in accordance to RoHS 2002/95/EC
and WEEE 2002/96/EC
TYPICAL APPLICATIONS
For use in fast switching rectification of power supply,
inverters, converters, and freewheeling diodes for
consumer, automotive and telecommunication.
3.0 A
PRIMARY CHARACTERISTICS
I
F(AV)
V
RRM
I
FSM
t
rr
V
F
T
J
max.
50 V to 800 V
100 A
150 ns, 250 ns, 500 ns
1.3 V
150 °C
MECHANICAL DATA
Case:
DO-214AB (SMC)
Epoxy meets UL 94V-0 flammability rating
Terminals:
Matte tin plated leads, solderable per
J-STD-002 and JESD22-B102
E3 suffix for consumer grade, meets JESD 201 class
1A whisker test, HE3 suffix for high reliability grade
(AEC Q101 qualified), meets JESD 201 class 2
whisker test
Polarity:
Color band denotes cathode end
MAXIMUM RATINGS
(T
A
= 25 °C unless otherwise noted)
PARAMETER
Device marking code
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current at T
L
= 75 °C
Peak forward surge current 8.3 ms single half sine-wave
superimposed on rated load
Operating junction and storage temperature range
V
RRM
V
RMS
V
DC
I
F(AV)
I
FSM
T
J
, T
STG
SYMBOL
RS3A
RA
50
35
50
RS3B
RB
100
70
100
RS3D
RD
200
140
200
3.0
100
- 55 to + 150
RS3G
RG
400
280
400
RS3J
RJ
600
420
600
RS3K
RK
800
500
800
V
V
V
A
A
°C
UNIT
Document Number: 88709
Revision: 11-Apr-08
For technical questions within your region, please contact one of the following:
PDD-Americas@vishay.com, PDD-Asia@vishay.com, PDD-Europe@vishay.com
www.vishay.com
1
RS3A thru RS3K
Vishay General Semiconductor
ELECTRICAL CHARACTERISTICS
(T
A
= 25 °C unless otherwise noted)
PARAMETER
Maximum instantaneous
forward voltage
Maximum DC reverse current at
rated DC blocking voltage
Maximum reverse recovery time
Typical junction capacitance
TEST CONDITIONS
2.5 A
T
A
= 25 °C
T
A
= 125 °C
I
F
= 0.5 A, I
R
= 1.0 A,
I
rr
= 0.25 A
4.0 V, 1 MHz
SYMBOL
V
F
I
R
t
rr
C
J
150
44
RS3A
RS3B
RS3D
1.3
10
250
250
34
500
RS3G
RS3J
RS3K
UNIT
V
µA
ns
pF
THERMAL CHARACTERISTICS
(T
A
= 25 °C unless otherwise noted)
PARAMETER
Typical thermal resistance
(1)
Note:
(1) Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with 0.3 x 0.3" (8.0 x 8.0 mm) copper pad area
SYMBOL
R
θJA
R
θJL
RS3A
RS3B
RS3D
50
15
RS3G
RS3J
RS3K
UNIT
°C/W
ORDERING INFORMATION
(Example)
PREFERRED P/N
RS3J-E3/57T
RS3J-E3/9AT
RS3JHE3/57T
(1)
RS3JHE3/9AT
(1)
Note:
(1) Automotive grade AEC Q101 qualified
UNIT WEIGHT (g)
0.211
0.211
0.211
0.211
REFFERED PACKAGE CODE
57T
9AT
57T
9AT
BASE QUANTITY
850
3500
850
3500
DELIVERY MODE
7" diameter plastic tape and reel
13" diameter plastic tape and reel
7" diameter plastic tape and reel
13" diameter plastic tape and reel
RATINGS AND CHARACTERISTICS CURVES
(T
A
= 25 °C unless otherwise noted)
3.0
150
Average Forward Rectified Current (A)
2.5
Peak Forward Surge Current /A)
Resistive or Inductive Load
T
L
= 75 °C
8.3
ms Single Half Sine-Wave
125
2.0
100
1.5
75
1.0
P.C.B. Mounted
0.3 x 0.3" (8.0 x
8.0
mm)
Copper Pad Areas
0
25
50
75
100
125
150
50
0.5
25
0
0
1
10
100
Lead Temperature (°C)
Number
of Cycles at 60 Hz
Figure 1. Forward Current Derating Curve
Figure 2. Maximum Non-Repetitive Peak Forward Surge Current
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For technical questions within your region, please contact one of the following:
PDD-Americas@vishay.com, PDD-Asia@vishay.com, PDD-Europe@vishay.com
Document Number: 88709
Revision: 11-Apr-08
RS3A thru RS3K
Vishay General Semiconductor
100
100
Instantaneous Forward Current (A)
10
T
J
= 25 °C
Pulse
Width
= 300
µs
1 % Duty Cycle
1
T
J
= - 40 °C
Junction Capacitance (pF)
T
J
= 125 °C
RS3A to RS3G
RS3J to RS3K
10
0.1
0.4
1
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
1
10
100
Instantaneous Forward
Voltage
(V)
Reverse
Voltage
(V)
Figure 3. Typical Instantaneous Forward Characteristics
Figure 5. Typical Junction Capacitance
100
100
T
J
= 125 °C
10
Transient Thermal Impedance (°C/W)
Instantaneous Reverse Current (µA)
Mounted on 0.20 x 0.27" (5 x 7 mm)
Copper Pad Areas
10
1
T
J
= 75 °C
T
J
= 25 °C
1
0.1
0.01
0
20
40
60
80
100
0.1
0.01
0.1
1
10
100
Percent of Rated Peak Reverse
Voltage
(%)
t - Pulse Duration (s)
Figure 4. Typical Reverse Characteristics
Figure 6. Typical Transient Thermal Impedance
PACKAGE OUTLINE DIMENSIONS
in inches (millimeters)
DO-214AB (SMC)
Cathode Band
Mounting Pad Layout
0.185 (4.69) MAX.
0.126 (3.20)
0.114 (2.90)
0.246 (6.22)
0.220 (5.59)
0.126 (3.20) MIN.
0.280 (7.11)
0.260 (6.60)
0.012 (0.305)
0.006 (0.152)
0.103 (2.62)
0.079 (2.06)
0.060 (1.52)
0.030 (0.76)
0.008 (0.2)
0 (0)
0.320 (8.13)
0.305 (7.75)
0.060 (1.52) MIN.
0.320 REF.
Document Number: 88709
Revision: 11-Apr-08
For technical questions within your region, please contact one of the following:
PDD-Americas@vishay.com, PDD-Asia@vishay.com, PDD-Europe@vishay.com
www.vishay.com
3
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Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
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Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 18-Jul-08
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