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MASW-001150-1316

产品描述surmount pin diode switch element with thermal terminal
文件大小209KB,共9页
制造商M/A-COM Tech(MACOM)
官网地址http://www.macom.com
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MASW-001150-1316概述

surmount pin diode switch element with thermal terminal

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MASW-001150-1316
SURMOUNT PIN Diode Switch Element
with Thermal Terminal
Features
Specified Bandwidth: 30MHz—2.5GHz
Useable to 3.0GHz
Low Loss <0.5dB
High isolation >40dB
High C.W. Incident Power, 50W at 500MHz
Unique Thermal Terminal for Series Diode
Surface Mount Device (No Wire Bonds)
Rugged Silicon-Glass Construction
Silicon Nitride Passivation
Protective Polymer Scratch Protection
RoHS Compliant
V3
Description
This device is a PIN diode series-shunt switch
element with a unique integrated thermal terminal for
dissipating heat in the series diode created by the
DC and RF input power. The thermal terminal allows
for optimum heat dissipation by providing a direct
thermal path from the series diode to circuit thermal
ground while also being electrically isolated. The chip
is designed to provide a heat transfer conduit that
does not interfere with the PIN diode anode (input)
and cathode (output) electrical terminals, especially
with respect to RF performance. The silicon-glass
PIN diode chip is fabricated using M/A-COM
Technology Solutions patented HMIC™ process.
This device features silicon pedestals embedded in a
low loss, low dispersion glass. Selective backside
metallization is applied producing a surface mount
device. The topside is fully encapsulated with silicon
nitride and has an additional polymer layer to protect
against damage during handling and assembly
.
Ordering Information
2
Part Number
MASW-001150-13160W
MASW-001150-13160P
Package
WAFFLE PACK
POCKET TAPE
2. Reference Application Note M513 for reel size information.
Absolute Maximum Ratings
Parameter
Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Junction Temperature
Dissipated RF & DC Power
RF C.W. Incident Power
Mounting Temperature
ESD
ESD
ESD
Absolute Maximum
100mA
- 180V
-55°C to +125°C
-55°C to +150°C
+175°C
500MHz, 4W
500MHz, 50W
+260°C for 30 seconds
Class 1A — HBM
Class M3 — MM
Class C3 — CDM
Applications
This PIN diode series-shunt switch element is
particularly advantageous in higher average power,
50W switch applications from 30MHZ – 3000GHz. In
addition, the backside RF, D.C., and thermal I/O
ports allow for direct solder re-flow attachments to
the micro-strip circuit for surface mount assembly. Of
particular interest, is the thermal terminal which
provides the power dissipating series diode a direct
connection to the circuit thermal ground for
unprecedented heat transfer. This thermal terminal is
electrically isolated from the other I/O ports. The chip
can be configured as either a reflective or an
absorptive switch.
1
North America
Tel: 800.366.2266 / Fax: 978.366.2266
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
and/or prototype measurements. Commitment to develop is not guaranteed.
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Solutions has under development. Performance is based on engineering tests. Specifications are
Visit www.macomtech.com for additional data sheets and product information.
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.

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