电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

MC2040-1003-FTW

产品描述Fixed Resistor, Metal Glaze/thick Film, 3W, 100000ohm, 350V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 2040, CHIP
产品类别无源元件    电阻器   
文件大小189KB,共1页
制造商RCD Components Inc.
官网地址http://www.rcdcomponents.com/
标准
下载文档 详细参数 全文预览

MC2040-1003-FTW概述

Fixed Resistor, Metal Glaze/thick Film, 3W, 100000ohm, 350V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 2040, CHIP

MC2040-1003-FTW规格参数

参数名称属性值
是否Rohs认证符合
Objectid912199346
包装说明CHIP
Reach Compliance Codecompliant
Country Of OriginTaiwan
ECCN代码EAR99
YTEOL7.9
构造Rectangular
JESD-609代码e3
安装特点SURFACE MOUNT
端子数量2
最高工作温度155 °C
最低工作温度-55 °C
封装高度0.6 mm
封装长度5.1 mm
封装形式SMT
封装宽度10.2 mm
包装方法TR
额定功率耗散 (P)3 W
额定温度70 °C
电阻100000 Ω
电阻器类型FIXED RESISTOR
尺寸代码2040
表面贴装YES
技术METAL GLAZE/THICK FILM
温度系数100 ppm/°C
端子面层Matte Tin (Sn) - with Nickel (Ni) barrier
端子形状WRAPAROUND
容差1%
工作电压350 V

文档预览

下载PDF文档
THICK FILM CHIP RESISTORS AND JUMPERS
RESISTORSCAPACITORSCOILSDELAY LINES
MC SERIES
50mW (0201) to 3W (2040)
ZC SERIES
Zero-ohm chip (1A - 25A)
r
Industry’s widest selection & lowest prices-
0.1W to 22M, 50mW to 3W, 0.25% to 5%, TC’s to 50ppm
r
0402, 0603, 0805, 1206 sizes heavily stocked in 1% & 5%
(other sizes available from stock in many popular values)
r
Option V: +175° operating temperature
r
Option U: User-trimmable chips
r
Option P: Increased pulse capability
r
Military screening, custom values & TC, microwave design, etc.
RCD Type Wattage
MC, ZC
Rating
1
0201
0402
Stock item
0603
Stock item
0805
Stock item
1206
Stock item
1206B
1210
2010
2512
2512B
2040
1
2
RoHS
(Term.W)
(Term.Q)
L
T
W
t
RCD’s Series MC resistors utilize precision thick film technology
offering inherently low inductance, exceptional reliability and superior
performance. Heavy plating with NO LEACHTM nickel barrier assures
superb solderability and long shelf life. State-of-the-art production line
enables the industry’s most precise accuracies (0.25% & 50ppm!)
thereby replacing more costly thin-film chips in many applications.
RCD offers low cost offshore assembly of SM and leaded PCB’s (refer
to RCD’s Assembly Services p.114 for more information).
Standard Resis.
Range ±5% Tol
2
10W to 1MW
1- 9.1W ,1.1M-2.2M
10W to 1MW
1- 9.1W ,1.1M-4.7M
10W to 1MW
1- 9.1W ,1.1M-10M
10W to 5.6MW
0.1- 9.1W ,1.1M-10M
10W to 1MW
0.1- 9.1W ,1.1M-22M
10W to 1MW
0.1- 9.1W ,1.1M-22M
10W to 1MW
0.1- 9.1W ,1.1M-22M
10W to 1MW
0.1- 9.1W ,1.1M-22M
10W to 1MW
1- 9.1W
Std TC
2
ppm/°C,
typ.
100
200
400
100
200
400
100
200
400
100
200
400
100
200
400
100
200
400
100
200
400
100
200
400
100
200
400
Resis. Range Standard Resis. Range
±1% Tol
2
±0.5% Tol
2
10Wto 22KW
22.1K to 1MW
10W to 1MW
10W to 1MW
10W to 1MW
10W to 1MW
10W to 1MW
10W to 1MW
10W to 1MW
1W to 9.76W
10W to 1MW
1W to 9.76W
10W to 1MW
1.02M to 5.6M
0.1-9.76W, 1.02M-10M
10W to 1MW
1.02M to 5.6M
1W to 9.76W 1.02M-10M
10W to 1MW
1.02M to 5.6M
1W to 9.76W 1.02M-10M
10W to 1MW
1.02M to 5.6M
1W to 9.76W 1.02M-10M
10W to 1MW
1.02M to 5.6M
1W to 9.76W 1.02M-10M
10W to 1MW
MC
Voltage
Rating
2
25V
50V
50V
150V
200V
200V
200V
(250V
Opt. P)
250V
( 350V
Opt. P)
350V
TYPE ZC
Jumper
3
1 Amp Max
50mW Max.
1 Amp Max
50mW Max.
Dimensions Inch [mm]
L
.024±.002
[0.6±.03]
.040±.004
[1.00±.1]
W
.012±.002
[.3±.03]
.020±.004
[.5±.1]
.031±.004
[.8±.1]
.050±.006
[1.25±.15]
.061±.006
[1.55±.15]
.098±.008
[2.5±.2]
.102±.008
[2.6±.2]
.125±.010
[3.2±.25]
.402±.008
[10.2±.2]
T
.010±.002
[.25±.03]
.014±.004
[.35±.1]
.016±.006
[.40±.15]
.020±.006
[.50±.15]
.024±.006
[.61±.15]
.024±.008
[.6±.2]
.024±.008
[.6±.2]
.024±.008
[.6±.2]
.024±.008
[.6±.2]
t
.006±.002
[.15±.05]
.010±.004
10 [.25±.1]
.010±.006
[.25±.15]
.016±.008
[.4±.2]
.020±.008
[.51±.2]
.020±.010
[.5±.25]
.020±.010
[.50±.25]
026±.012
[.65±.3]
4
.055±.018
[1.4±.46]
.05W
.063W
.1W
.125W
.25W
.50W
.33W
.75W
1.0W
2.0W
2.0/3.0
1.5 Amp Max .061±.005
50mW Max. [1.55±.12]
2 Amp Max.
50mW Max.
2 Amp Max.
50mW Max.
3 Amp Max.
50mW Max.
3 Amp Max.
50mW Max.
4 Amp Max.
50mW Max.
N/A
.079±.005
[2.0±.15]
.126±.008
[3.2±.2]
.126±.008
[3.2±.2]
.197±.008
[5.0±.2]
.250±.01
[6.35±.25]
.201±.008
[5.1±.2]
Operation at or near full rated power (especially >1W) involves consideration of mounting geometry (solder pad and trace area/thickness, etc.). Request FA2623 for suggested mounting pad layouts.
Extended resistance range available. Most sizes available down to 0.01W 1%.
3
Up to 25A available.
4
Dim. t on MC2512B is .094[2.4] maximum.
TYPICAL PERFORMANCE
Thermal Shock (-55° to +125°C)
Overload (2.5x W, 5S, NTE 2x rated V)
Low Temp. Operation (-55°C)
High Temp. Exposure (125°C, 100hrs)
Resistance to Solder Heat
Moisture Resistance
Load Life(1000 hrs.)
Operating Temp. (+175°C Opt. V)
Derating (above 70°C)
0.2% ΔR
1% ΔR
0.2% ΔR
0.5% ΔR
0.2% ΔR
0.5% ΔR
1.0% ΔR
-55 to +155°C
Derate W & V by 1.18%/°C
PULSE WITHSTAND CHART
(increased pulse levels avail.)
500
Peak Power (Watts)
100
10
1
1uS
MC2512P
MC2010P
MC1210P
MC1206P
MC0805P
MC0603P
MC0402P
10uS
100uS
P/N DESIGNATION:
MC 1206
- 2210 - F T
W
Pulse Duration
1mS
10mS
100mS
RCD Type:
MC or ZC
Chip Size:
0201 to 2040
Options:
U, P, etc. (leave blank if std)
Resis. Code:
0.25% to 1% Tol: 3 signif. digits & multiplier
(R100= .1W, 1R00=1W, 10R0=10W, 1000=100W 1001=1KW)
5% Tol: 2 signif. digits & multiplier (R10=.1W, 1R0=1W, 100=10W,
101=100W 102=1KW). Leave blank on ZC zero-ohm chips.
Tolerance:
J=5%, F=1%, D=0.5%, C=0.25% Leave blank on ZC
zero-ohm chips. Opt.U trimmable chips W=±15%, M=±20%, U=0 to -30%.
Packaging:
B=Bulk, T=Tape & Reel
Optional TC:
50=50ppm, 101=100ppm, 201=200ppm (leave blank if std)
Termination:
W = Lead-free (std), Q = Tin/Lead (leave blank if both acceptable)
Pulse capability is dependent on res. value, waveform, repeti-
tion, etc. Chart is a general guide for Opt. P version, single or in-
frequent pulses, with peak voltage levels not exceeding 150V for
0402 & 0603 size, 300V for 0805, 400V for 1206 & 1210, 450V
for 2010 & 2512. Max pulse wattage for standard parts (w/o
Opt.P) is 50% less, max pulse voltage is 50V less. Increased
pulse levels available. For improved performance and reliability,
pulse derating factor is recommended (30-50% typ., refer to #R-
42). Verify selection by evaluating under worst-case conditions.
RCD Components Inc,
520 E.Industrial Park Dr, Manchester, NH, USA 03109
rcdcomponents.com
Tel: 603-669-0054 Fax: 603-669-5455 Email:sales@rcdcomponents.com
FA033H
Sale of this product is in accordance with GF-061. Specifications subject to change without notice.
16
stm32f411串口发slip包头包尾0xc0时输出的为什么是0x80
发送数据时,发送字节数比较少时,包头包尾显示均正确,但是数据一多的话,发送的slip包头包尾就会变成0x80,不知道为什么,求大神指点:congratulate: ...
whllieying stm32/stm8
关于串口中断接收影响主循环的问题
我是用的单片机是PIC18F46K80,编译环境是MPLAB C18 V3.41,MPLAB IDE V8.92。 我是用串口助手给单片机发信息,每次发送7个字节,每隔20ms或者100ms或者200ms,串口接收使用数组存储。 我的主 ......
shuidi_wangdan Microchip MCU
【PCB 设计技巧】覆铜技巧
本帖最后由 ohahaha 于 2017-8-23 15:07 编辑 pcb 覆铜技巧都有哪些呢? pcb 覆铜设置方法呢? pcb 覆铜的主要作用在于“回流和屏蔽”。pcb 覆铜多用网格方式来进行。双面 pcb 覆铜厚度约为 ......
ohahaha PCB设计
2009-2010网络最热的 嵌入式学习|ARM|Linux|wince|ucos|经典资料与实例分析 完整版
前段时间做了一个关于ARM9 2440资料的汇总帖,很高兴看到2@1ic和eeworld等论坛朋友们的支持和鼓励。当年学单片机的时候datasheet和学习资料基本都是在论坛上找到的,也遇到很多好心的高手朋友, ......
susion 实时操作系统RTOS
16 位MSP430G 系列微处理器的使用扩展
该文档相当好,题目是:16 位MSP430G 系列微处理器的使用扩展 对于使用低成本的430应用来说可以说太有价值了, 具体自己看,我就列一下标题.哈哈,希望有更多这样的好文章出现. 1 系统硬件 ......
Aguilera 微控制器 MCU
虚拟机和win7相互ping通
虚拟机里面安装的redhat的eth0有三种连接方式,Bridged ,NAT (Network Address Translation) ,Host-only。 我的理解是: bridg相当于eth0和电脑主机本地连接并行属于一个局域网里面的机台。 ......
inintrovert ARM技术

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1447  967  21  1705  1549  30  20  1  35  32 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved