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MX29F002NBQI-12

产品描述2M-bit [256k x 8] cmos flash memory
产品类别存储    存储   
文件大小607KB,共51页
制造商Macronix
官网地址http://www.macronix.com/en-us/Pages/default.aspx
下载文档 详细参数 全文预览

MX29F002NBQI-12概述

2M-bit [256k x 8] cmos flash memory

MX29F002NBQI-12规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称Macronix
零件包装代码LCC
包装说明QCCJ, LDCC32,.5X.6
针数32
Reach Compliance Codeunknow
ECCN代码EAR99
最长访问时间120 ns
启动块BOTTOM
命令用户界面YES
数据轮询YES
耐久性100000 Write/Erase Cycles
JESD-30 代码R-PQCC-J32
JESD-609代码e0
长度14.05 mm
内存密度2097152 bi
内存集成电路类型FLASH
内存宽度8
功能数量1
部门数/规模1,2,1,3
端子数量32
字数262144 words
字数代码256000
工作模式ASYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织256KX8
封装主体材料PLASTIC/EPOXY
封装代码QCCJ
封装等效代码LDCC32,.5X.6
封装形状RECTANGULAR
封装形式CHIP CARRIER
并行/串行PARALLEL
峰值回流温度(摄氏度)NOT SPECIFIED
电源5 V
编程电压5 V
认证状态Not Qualified
座面最大高度3.55 mm
部门规模16K,8K,32K,64K
最大待机电流0.000005 A
最大压摆率0.05 mA
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Tin/Lead (Sn/Pb)
端子形式J BEND
端子节距1.27 mm
端子位置QUAD
处于峰值回流温度下的最长时间NOT SPECIFIED
切换位YES
类型NOR TYPE
宽度11.43 mm

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MX29F002/002N T/B
2M-BIT [256K x 8] CMOS FLASH MEMORY
FEATURES
262,144x 8 only
Fast access time: 55/70/90/120ns
Low power consumption
- 30mA maximum active current(5MHz)
- 1uA typical standby current
Programming and erasing voltage 5V ± 10%
Command register architecture
- Byte Programming (7us typical)
- Sector Erase (16K-Byte x1, 8K-Byte x 2, 32K-Byte
x1, and 64K-Byte x 3)
Auto Erase (chip & sector) and Auto Program
- Automatically erase any combination of sectors or the
whole chip with Erase Suspend capability.
- Automatically programs and verifies data at specified
address
Erase Suspend/Erase Resume
- Suspends an erase operation to read data from, or
program data to, a sector that is not being erased, then
resumes the erase operation.
Status Reply
- Data polling & Toggle bit for detection of program and
erase cycle completion.
Sector protection
- Hardware method to disable any combination of
sectors from program or erase operations
- Sector protect/unprotect for 5V only system or 5V/12V
system
100,000 minimum erase/program cycles
Latch-up protected to 100mA from -1 to VCC+1V
Boot Code Sector Architecture
- T = Top Boot Sector
- B = Bottom Boot Sector
Hardware RESET pin(only for 29F002T/B)
- Resets internal state machine to read mode
Low VCC write inhibit is equal to or less than 3.2V
Package type:
- 32-pin PDIP
- 32-pin PLCC
- 32-pin TSOP (Type 1)
20 years data retention
GENERAL DESCRIPTION
The MX29F002T/B is a 2-mega bit Flash memory organ-
ized as 256K bytes of 8 bits only. MXIC's Flash memories
offer the most cost-effective and reliable read/write non-
volatile random access memory. The MX29F002T/B is
packaged in 32-pin PDIP,PLCC and 32-pin TSOP(I). It is
designed to be reprogrammed and erased in-system or in-
standard EPROM programmers.
The standard MX29F002T/B offers access time as fast as
55ns, allowing operation of high-speed microprocessors
without wait states. To eliminate bus contention, the
MX29F002T/B has separate chip enable (CE) and output
enable (OE) controls.
MXIC's Flash memories augment EPROM functionality
with in-circuit electrical erasure and programming. The
MX29F002T/B uses a command register to manage this
functionality. The command register allows for 100% TTL
level control inputs and fixed power supply levels during
erase and programming, while maintaining maximum
EPROM compatibility.
MXIC's Flash technology reliably stores memory contents
even after 100,000 erase and program cycles. The MXIC
cell is designed to optimize the erase and programming
mechanisms. In addition, the combination of advanced
tunnel oxide processing and low internal electric fields for
erase and programming operations produces reliable
cycling. The MX29F002T/B uses a 5.0V ± 10% VCC
supply to perform the High Reliability Erase and auto
Program/Erase algorithms.
The highest degree of latch-up protection is achieved with
MXIC's proprietary non-epi process. Latch-up protection is
proved for stresses up to 100 milliamps on address and
data pin from -1V to VCC + 1V.
P/N: PM0547
1
REV. 1.5, MAR. 28, 2005
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