MA4E2514 Series
SURMOUNT
TM
Low and Medium Barrier Silicon
Schottky Diodes: Tee Pair
Features
•
Extremely Low Parasitic Capitance and Induc-
tance
•
Surface Mountable in Microwave Circuits, No
Wirebonds Required
•
Rugged HMIC Construction with Polyimide
Scratch Protection
•
Reliable, Multilayer Metalization with a Diffusion
Barrier, 100 % Stabilization Bake (300°C, 16
hours)
•
Lower Susceptibility to ESD Damage
A
M/A-COM Products
Rev. V5
B
Description
The MA4E2514 SURMOUNT
TM
Diode Tee Series
are Silicon Low, and Medium Barrier Schottky De-
vices fabricated with the patented Heterolithic Mi-
crowave Integrated Circuit (HMIC) process. HMIC
Circuits consist of Silicon pedestals which form di-
odes or via conductors embedded in glass dielec-
tric, which acts as the low dispersion, low loss mi-
crostrip transmission medium. The combination of
silicon and glass allows HMIC devices to have ex-
cellent loss and power dissipation characteristics in
a low profile, reliable device.
The Surmount Schottky devices are excellent
choices for circuits requiring the small parasitics of
a beam lead device coupled with the superior me-
chanical performance of a chip. The Surmount
structure employs very low resistance silicon vias
to connect the Schottky contacts to the metalized
mounting pads on the bottom surface of the chip.
These devices are reliable, repeatable, and a lower
cost performance solution to conventional devices.
They have lower susceptibility to electrostatic dis-
charge than conventional beam lead Schottky di-
odes.
The multi-layer metallization employed in the fabri-
cation of the Surmount Schottky junctions includes
a platinum diffusion barrier, which permits all de-
vices to be subjected to a 16-hour non-operating
stabilization bake at 300°C.
The “0505” outline allows for Surface Mount place-
ment and multi-functional polarity orientations.
D
E
D
C
Case Style 1116
DIM
A
B
C
D Sq.
E
INCHES
MIN.
0.0445
0.0445
0.0040
0.0128
0.0128
MILLIMETERS
MIN.
1.130
1.130
0.102
0.325
0.325
MAX.
0.0465
0.0465
0.0080
0.0148
0.0148
MAX.
1.180
1.180
0.203
0.375
0.375
1
ADVANCED:
Data Sheets contain information regarding a product M/A-COM is considering for
•
North America
Tel: 800.366.2266 / Fax: 978.366.2266
development. Performance is based on target specifications, simulated results, and/or prototype
•
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
measurements. Commitment to develop is not guaranteed.
•
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM has under develop-
Visit www.macom.com for additional data sheets and product information.
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
volume is not guaranteed.
information contained herein without notice.
MA4E2514 Series
SURMOUNT
TM
Low and Medium Barrier Silicon
Schottky Diodes: Tee Pair
Electrical Specifications @ 25°C (Measured as Single Diodes)
1,2,3
Model Number
Type
Recommended
Freq. Range
Vf @ 1 mA
(mV)
330 Max
300 Typ
470 Max
400 Typ
M/A-COM Products
Rev. V5
Vb @ 10 uA
(V)
3 Min
5 Typ
3 Min
5 Typ
Ct @ 0 V
(pF)
0.12 Max
0.10 Typ
0.12 Max
0.10 Typ
Rt Slope Resistance
(Vf1– Vf2)/
(10.5 mA - 9.5 mA)
(Ω)
16 Typ
20 Max
12 Typ
18 Max
MA4E2514L
MA4E2514M
Low Barrier
Medium Barrier
DC - 18 GHz
DC - 18 GHz
1. Rt is the dynamic slope resistance where Rt = Rs + Rj, where Rj = 26 / Idc (Idc is in mA) and Rs is the ohmic resistance.
2. Max Forward Voltage Difference
Δ
Vf @ 1 mA: 10 mV
Absolute Maximum Ratings
4
3. Max Total Capacitance Difference
Δ
Ct @ 0 V: 0.03 pF
Parameter
Value
-40°C to +150°C
-40°C to +150°C
20 mA
5V
+ 20 dBm
50 mW
Class 0
Applications
The MA4E2514 Family of Surmount Schottky diodes
are recommended for use in microwave circuits
through Ku band frequencies for lower power applica-
tions such as mixers, sub-harmonic mixers, detectors
and limiters. The HMIC construction facilitates the
direct replacement of more fragile beam lead diodes
with the corresponding Surmount diode, which can be
connected to a hard or soft substrate circuit with sol-
der.
Operating Temperature
Storage Temperature
Forward Current
Reverse Voltage
RF C.W. Incident Power
RF & DC Dissipated Power
Electrostatic Discharge
5
( ESD ) Classification
Handling
All semiconductor chips should be handled with care
to avoid damage or contamination from perspiration
and skin oils. The use of plastic tipped tweezers or
vacuum pickups is strongly recommended for individ-
ual components. The top surface of the die has a
protective polyimide coating to minimize damage.
The rugged construction of these Surmount devices
allows the use of standard handling and die attach
techniques. It is important to note that industry stan-
dard electrostatic discharge (ESD) control is required
at all times, due to the sensitive nature of Schottky
junctions. Bulk handling should insure that abrasion
and mechanical shock are minimized.
4. Exceeding any of these values may result in permanent dam-
age.
5. Human Body Model
Die Bonding
For Hard substrates, we recommend utilizing a vac-
uum tip and force of 60 to 100 grams applied uni-
formly to the top surface of the device, using a hot gas
bonder with equal heat applied across the bottom
mounting pads of the device. When soldering to soft
substrates, it is recommended to use a lead-tin inter-
face at the circuit board mounting pads. Position the
die so that its mounting pads are aligned with the cir-
cuit board mounting pads. Reflow the solder paste by
applying equal heat to the circuit at both die-mounting
pads. The solder joint must not be made one at a
time, creating unequal heat flow and thermal stress.
Solder reflow should not be performed by causing
heat to flow through the top surface of the die. Since
the HMIC glass is transparent, the edges of the
mounting pads can be visually inspected through the
die after the die attach is completed.
Die Bonding
Die attach for these devices is made simple through
the use of surface mount die attach technology.
Mounting pads are conveniently located on the bottom
surface of these devices, and are opposite the active
junction. The devices are well suited for high tem-
perature solder attachment onto hard substrates.
2
ADVANCED:
Data Sheets contain information regarding a product M/A-COM is considering for
•
North America
Tel: 800.366.2266 / Fax: 978.366.2266
development. Performance is based on target specifications, simulated results, and/or prototype
•
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
measurements. Commitment to develop is not guaranteed.
•
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM has under develop-
Visit www.macom.com for additional data sheets and product information.
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
volume is not guaranteed.
information contained herein without notice.
MA4E2514 Series
SURMOUNT
TM
Low and Medium Barrier Silicon
Schottky Diodes: Tee Pair
MA4E2514L Low Barrier SPICE PARAMETERS (Per Diode
) 5
Is
(nA)
26
M/A-COM Products
Rev. V5
Rs
(Ω)
12.8
N
1.20
Cj0
(pF)
1.0 E-2
M
0.5
Ik
(mA)
14
Cjpar
(pF)
9.0 E-2
Vj
(V)
8.0 E-2
FC
0.5
BV
(V)
5.0
IBV
(mA)
1.0 E-2
MA4E2514L Medium Barrier SPICE PARAMETERS (Per Diode)
5
Is
(nA)
5 E-1
Rs
(Ω)
9.6
N
1.20
Cj0
(pF)
1.0 E-2
M
0.5
Ik
(mA)
10
Cjpar
(pF)
9.0 E-2
Vj
(V)
8.0 E-2
FC
0.5
BV
(V)
5.0
IBV
(mA)
1.0 E-2
5. Spice parameters (Per Diode) are based on the MA4E2502 Series datasheet.
Circuit Mounting Dimensions (Inches)
0.020
0.020
0.013
0.013
0.020
0.020
Ordering Information
Part Number
MA4E2514L-1116W
MA4E2514L-1116
MA4E2514L-1116T
MADS-002514-1116LP
MA4E2514M-1116W
MA4E2514M-1116
MA4E2514M-1116T
MADS-002514-1116MP
3
ADVANCED:
Data Sheets contain information regarding a product M/A-COM is considering for
•
North America
Tel: 800.366.2266 / Fax: 978.366.2266
development. Performance is based on target specifications, simulated results, and/or prototype
•
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
measurements. Commitment to develop is not guaranteed.
•
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM has under develop-
Visit www.macom.com for additional data sheets and product information.
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
volume is not guaranteed.
Packaging
Wafer on Frame
Die in Carrier
Surf Tape
Pocket Tape on Reel
Wafer on Frame
Die in Carrier
Surf Tape
Pocket Tape on Reel
information contained herein without notice.
MA4E2514 Series
SURMOUNT
TM
Low and Medium Barrier Silicon
Schottky Diodes: Tee Pair
MA4E2514 Schematic Per Diode
Ct
M/A-COM Products
Rev. V5
Ls
Rs
Rj
Schematic Values per Diode
Model Number
MA4E2514L
MA4E2514M
Ls (nH)
0.7
0.7
Rs (Ω)
13.4
9.4
Rj (Ω)
26 / Idc
26 / Idc
Ct (pF)
0.10
0.10
MA4E2514 Equivalent Circuit
4
ADVANCED:
Data Sheets contain information regarding a product M/A-COM is considering for
•
North America
Tel: 800.366.2266 / Fax: 978.366.2266
development. Performance is based on target specifications, simulated results, and/or prototype
•
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
measurements. Commitment to develop is not guaranteed.
•
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM has under develop-
Visit www.macom.com for additional data sheets and product information.
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
volume is not guaranteed.
information contained herein without notice.
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