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MGF4953B

产品描述super low noise ingaas hemt leadless ceramic package
产品类别分立半导体    晶体管   
文件大小116KB,共5页
制造商Mitsubishi(日本三菱)
官网地址http://www.mitsubishielectric.com/semiconductors/
标准
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MGF4953B概述

super low noise ingaas hemt leadless ceramic package

MGF4953B规格参数

参数名称属性值
是否Rohs认证符合
包装说明CHIP CARRIER, S-CBCC-N4
针数4
Reach Compliance Codeunknow
其他特性LOW NOISE
外壳连接SOURCE
配置SINGLE
最大漏极电流 (Abs) (ID)0.06 A
最大漏极电流 (ID)0.06 A
FET 技术HIGH ELECTRON MOBILITY
最高频带K BAND
JESD-30 代码S-CBCC-N4
元件数量1
端子数量4
工作模式DEPLETION MODE
最高工作温度125 °C
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装形状SQUARE
封装形式CHIP CARRIER
极性/信道类型N-CHANNEL
功耗环境最大值0.05 W
最小功率增益 (Gp)9 dB
认证状态Not Qualified
表面贴装YES
端子形式NO LEAD
端子位置BOTTOM
晶体管应用AMPLIFIER
晶体管元件材料GALLIUM ARSENIDE
Base Number Matches1

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N
½½
./2006
MITSUBISHI SEMICONDUTOR <GaAs FET>
MGF4953B
SUPER LOW NOISE InGaAs HEMT (Leadless Ceramic Package)
DESCRIPTION
The MGF4953B super-low noise HEMT (High Electron Mobility
Transistor) is designed for use in K band amplifiers.
The lead-less ceramic package assures minimum parasitic losses.
Outline Drawing
FEATURES
Low noise figure
@ f=20GHz
NFmin. = 0.55dB (Typ.)
High associated gain
@ f=20GHz
Gs = 10.5dB (Typ.)
Fig.1
MITSUBISHI Proprietary
Not to be reproduced or disclosed
without permission by Mitsubishi Electric
APPLICATION
C to K band low noise amplifiers
QUALITY GRADE
GG
RECOMMENDED BIAS CONDITIONS
V
DS
=2V , I
D
=10mA
ORDERING INFORMATION
Tape & reel
3000pcs./reel
Keep Safety first in your circuit designs!
Mitsubishi Electric Corporation puts the maximum
effort into making semiconductor products better
and more reliable , but there is always the
possibility that trouble may occur with them.
Trouble with semiconductors may lead to personal
injury , fire or property damage. Remember to give
due consideration to safety when making your
circuit designs , with appropriate measure such
as (I) placement of substitutive , auxiliary circuits ,
(ii) use of non-flammable material or (iii) prevention
against any malfunction or mishap.
ABSOLUTE MAXIMUM RATINGS
Symbol
V
GDO
V
GSO
I
D
PT
T
ch
T
stg
Parameter
Gate to drain voltage
Gate to source voltage
Drain current
Total power dissipation
Channel temperature
Storage temperature
(Ta=25°C )
Ratings
-4
-4
60
50
125
-65 to +125
Unit
V
V
mA
mW
°C
°C
ELECTRICAL CHARACTERISTICS
Synbol
V
(BR)GDO
I
GSS
I
DSS
V
GS(off)
Gs
NFmin.
Parameter
Gate to drain breakdown voltage
Gate to source leakage current
Saturated drain current
Gate to source cut-off voltage
Associated gain
Minimum noise figure
(Ta=25°C )
Test conditions
MIN.
I
G
=-10µA
V
GS
=-2V,V
DS
=0V
V
GS
=0V,V
DS
=2V
V
DS
=2V,I
D
=500µA
V
DS
=2V,I
D
=10mA
f=20GHz
-3
--
15
-0.1
9.0
--
Limits
TYP.
--
--
--
--
10.5
0.55
MAX
--
50
60
-1.5
--
0.80
Unit
V
µA
mA
V
dB
dB
MITSUBISHI
(1/5)
Nov./2006

 
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