1M-bit, 2M-bit, 4M-bit and 8M-bit serial flash memory with 4kb sectors and dual output spi
W25X10A | W25X10AVZPIG | W25X10AVDAIZ | |
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描述 | 1M-bit, 2M-bit, 4M-bit and 8M-bit serial flash memory with 4kb sectors and dual output spi | 1M-bit, 2M-bit, 4M-bit and 8M-bit serial flash memory with 4kb sectors and dual output spi | 1M-bit, 2M-bit, 4M-bit and 8M-bit serial flash memory with 4kb sectors and dual output spi |
是否Rohs认证 | - | 符合 | 符合 |
厂商名称 | - | Winbond(华邦电子) | Winbond(华邦电子) |
零件包装代码 | - | SON | DIP |
包装说明 | - | WSON-8 | DIP, DIP8,.3 |
针数 | - | 8 | 8 |
Reach Compliance Code | - | unknow | compli |
ECCN代码 | - | EAR99 | EAR99 |
最大时钟频率 (fCLK) | - | 75 MHz | 75 MHz |
数据保留时间-最小值 | - | 20 | 20 |
耐久性 | - | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles |
JESD-30 代码 | - | R-XDSO-N8 | R-PDIP-T8 |
长度 | - | 6 mm | 9.27 mm |
内存密度 | - | 1048576 bi | 1048576 bi |
内存集成电路类型 | - | FLASH | FLASH |
内存宽度 | - | 8 | 8 |
功能数量 | - | 1 | 1 |
端子数量 | - | 8 | 8 |
字数 | - | 131072 words | 131072 words |
字数代码 | - | 128000 | 128000 |
工作模式 | - | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | - | 85 °C | 85 °C |
最低工作温度 | - | -40 °C | -40 °C |
组织 | - | 128KX8 | 128KX8 |
封装主体材料 | - | UNSPECIFIED | PLASTIC/EPOXY |
封装代码 | - | VSON | DIP |
封装等效代码 | - | SOLCC8,.25 | DIP8,.3 |
封装形状 | - | RECTANGULAR | RECTANGULAR |
封装形式 | - | SMALL OUTLINE, VERY THIN PROFILE | IN-LINE |
并行/串行 | - | SERIAL | SERIAL |
电源 | - | 3/3.3 V | 3/3.3 V |
编程电压 | - | 2.7 V | 2.7 V |
认证状态 | - | Not Qualified | Not Qualified |
座面最大高度 | - | 0.8 mm | 5.33 mm |
串行总线类型 | - | SPI | SPI |
最大待机电流 | - | 0.00001 A | 0.00001 A |
最大压摆率 | - | 0.025 mA | 0.025 mA |
最大供电电压 (Vsup) | - | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | - | 2.7 V | 2.7 V |
标称供电电压 (Vsup) | - | 3 V | 3 V |
表面贴装 | - | YES | NO |
技术 | - | CMOS | CMOS |
温度等级 | - | INDUSTRIAL | INDUSTRIAL |
端子形式 | - | NO LEAD | THROUGH-HOLE |
端子节距 | - | 1.27 mm | 2.54 mm |
端子位置 | - | DUAL | DUAL |
类型 | - | NOR TYPE | NOR TYPE |
宽度 | - | 5 mm | 7.62 mm |
写保护 | - | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE |
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