SFP 2xN
Amphenol’s SFP interconnect system consists of a 20-position connector enclosed in a metal cage
mounted to a host PCB.
Amphenol’s stacked SFP combos are rated up to 6 Gbps. The connector accepts multiple transceivers
per INF-8074i and combines, transmits, and receives functions in a low cost, compact, and exible
format. The cages have a two-piece construction with enhanced transceiver mating tabs available in a
press- t version or a solder tail version. Longer and shorter pins are available as custom options. Stacked
versions (2xN) consist of a 2-row cage with integrated 2-row connectors.
UE78-B8126-00321
UE78-L1126-00321
UE78-B2127-00321
Speci cation Highlights
The interconnect system is comprised of a cage
assembly which is used with 20-position SFP
connectors complying with MSA Agreement INF-8074i.
General Characteristics
•
RoHS Compliant
•
Industry Standard Footprint
•
Industry Standard EIA-364
Mechanical Characteristics
•
Accepts Multiple Transceivers per INF-8074i
•
Compliant Press-Fit Pins or Solder Tails (1x1
Cages)
•
Durability: 250 Mating Cycles min
Electrical Characteristics
•
Hot Swappable
•
Operating Voltage: 3.3 V
•
Operating Current: 0.5 A
•
Differential Impedance: 100 Ω +/- 10 Ω
•
DWV: 300 V AC
•
Insulation Resistance: 1000 MΩ min
•
Contact Resistance: 70 mΩ max
•
Spring Fingers for Superior EMI Grounding
Packaging
•
Tape and Reel Packaging: Connector or Cage
•
Tray Packaging: Cage of all Sizes
•
Bulk Packaging: Dust Cover
Materials
•
Cage
o
Base Material: Copper Alloy
o
Plating: Nickel or Tin
o
Light Pipe: Optical Grade Polycarbonate
o
Heat Sink: Aluminum Alloy
o
Heat Sink Clip: Stainless Steel
o
Dust Cover: Thermoplastic
o
EMI Ground Tabs: Stainless Steel
•
Connector
o
Contact Base Material: Copper Alloy
o
Contact Plating: Gold on Mating Area, Gold
or Matte Tin on Termination
o
Housings: Glass Reinforced, Lead-Free Solder
Reflow Process Compatible Thermoplastic,
UL94V-0 Rated
Temperature Rating
•
Operating Temperature: -55°C to +85°C
•
Storage Temperature: -55°C to +105°C
Con gurations
(Rows x Ports per Row)
•
2x1
•
2x2
•
2x4
•
2x5
•
2x6
•
2x8
Options
•
Dust Cover
•
Light Pipe
•
Heat Sink (Standard Fin for Final Cage Combo)
•
Enhanced EMI Performance Cage
10
Ordering Information
UE86-K2127-10321
UE78-B4127-00321
(Cage / Connector)
SFP 2xN Combo
UEXX
-
X X X 2 X
-
X X X X 1
PACKAGING
UEXX
SERIES DESIGNATION
UE78
- Standard SFP Cage and Connector (RoHS)
UE86
- Standard SFP Cage and Connector with Light Pipes (RoHS)
1
- Tray Packaging (Stacked)
1
X
1
- Bright Tin (for Wave Soldering)
2
- Nickel
3
- Matte Tin (for SMT Soldering)
PLATING OPTION: CAGE
X
STYLE
B
- Stacked Connector and Cage Combo (UE78 Series)
D
- 2xN, Small Light Pipe Openings (UE86 Series)
K
- 2xN, Large Light Pipe Openings (UE86 Series)
L
- 2xN,
Low Profile Combo (No Light Pipe)
(UE78 Series)
X
- Various Options Available
PLATING OPTION: CONNECTOR
Consult Sales or Website for Details
X
X
1
- 2x1
2
- 2x2
4
- 2x4
5
- 2x5
6
- 2x6
8
- 2x8
NUMBER OF PORTS IN ROW
0
- Without Dust Cover
DUST COVER OPTION
X
D
- With Dust Cover (Shipped Loose)
HEAT SINK / LIGHT PIPE OPTION
0
- No Heat Sink or Light Pipe
X
- Various Options Available
Consult Sales or Website for Details
X
X
EMI SHIELDING
1
- Standard
2
- Bottom Mylar Tape, No Mid Ground Pins
3
- No Mid Ground Pins
PCB MOUNTING OPTION
7
- Standard
X
- Various Customer Specific Options Available
Consult Sales or Website for Details
X
2
2
- Standard
UE78 Series Footprint
Telephone: (416)-291-4401
UE86 Series Footprint
Email: cages@amphenol-highspeed.com
All speci cations are subject to change without notice.
Website: www.amphenol-highspeed.com
11
Microchip MCU
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
