To all our customers
Regarding the change of names mentioned in the document, such as Hitachi
Electric and Hitachi XX, to Renesas Technology Corp.
The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas
Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog
and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)
Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand
names are mentioned in the document, these names have in fact all been changed to Renesas
Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and
corporate statement, no changes whatsoever have been made to the contents of the document, and
these changes do not constitute any alteration to the contents of the document itself.
Renesas Technology Home Page: http://www.renesas.com
Renesas Technology Corp.
Customer Support Dept.
April 1, 2003
Cautions
Keep safety first in your circuit designs!
1. Renesas Technology Corporation puts the maximum effort into making semiconductor products better
and more reliable, but there is always the possibility that trouble may occur with them. Trouble with
semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate
measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or
(iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas
Technology Corporation product best suited to the customer's application; they do not convey any
license under any intellectual property rights, or any other rights, belonging to Renesas Technology
Corporation or a third party.
2. Renesas Technology Corporation assumes no responsibility for any damage, or infringement of any
third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or
circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and
algorithms represents information on products at the time of publication of these materials, and are
subject to change by Renesas Technology Corporation without notice due to product improvements or
other reasons. It is therefore recommended that customers contact Renesas Technology Corporation
or an authorized Renesas Technology Corporation product distributor for the latest product information
before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corporation assumes no responsibility for any damage, liability, or other loss
rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corporation by various
means, including the Renesas Technology Corporation Semiconductor home page
(http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams,
charts, programs, and algorithms, please be sure to evaluate all information as a total system before
making a final decision on the applicability of the information and products. Renesas Technology
Corporation assumes no responsibility for any damage, liability or other loss resulting from the
information contained herein.
5. Renesas Technology Corporation semiconductors are not designed or manufactured for use in a device
or system that is used under circumstances in which human life is potentially at stake. Please contact
Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor
when considering the use of a product contained herein for any specific purposes, such as apparatus or
systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.
6. The prior written approval of Renesas Technology Corporation is necessary to reprint or reproduce in
whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must be
exported under a license from the Japanese government and cannot be imported into a country other
than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the
country of destination is prohibited.
8. Please contact Renesas Technology Corporation for further details on these materials or the products
contained therein.
HD404449 Series
Rev. 6.0
Sept. 1998
Description
The HD404449 Series is a HMCS400-series microcomputer designed to increase program productivity
with large-capacity memory. Each microcomputer has four timers, two serial interfaces, A/D converter,
input capture circuit, 32-kHz oscillator for clock, and four low-power dissipation modes.
The HD404449 Series includes three chips: the HD404448 with 8-kword ROM; the HD404449 with 16-
kword ROM; and HD4074449 with 16-kword PROM (ZTAT™ version).
The HD4074449 is a PROM version (ZTAT™ microcomputer). A program can be written to the PROM by
a PROM writer, which can dramatically shorten system development periods and smooth the process from
debugging to mass production. (The ZTAT™ version is 27256-compatible.)
ZTAT™: Zero Turn Around Time ZTAT is a trademark of Hitachi Ltd.
Features
•
8,192-word
×
10-bit ROM (HD404448)
16,384-word
×
10-bit ROM (HD404449 and HD4074449)
•
1,152-digit
×
4-bit RAM
•
64 I/O pins, including 10 high-current pins (15 mA, max)
•
Four timer/counters
•
Eight-bit input capture circuit
•
Three timer outputs (including two PWM outputs)
•
Two event counter inputs (including one double-edge function)
•
Two clock-synchronous 8-bit serial interfaces
•
A/D converter (4-channel
×
8-bit)
•
Built-in oscillators
Main clock: 4-MHz ceramic oscillator or crystal (an external clock is also possible)
Subclock: 32.768-kHz crystal
•
Eleven interrupt sources
Four by external sources, including two double-edge function
Seven by internal sources
HD404449 Series
•
Subroutine stack up to 16 levels, including interrupts
•
Four low-power dissipation modes
Subactive mode
Standby mode
Watch mode
Stop mode
•
One external input for transition from stop mode to active mode
•
Instruction cycle time: 1
µs
(f
OSC
= 4 MHz)
•
Two operating modes
MCU mode (HD404448, HD404449)
MCU/PROM mode (HD4074449)
Ordering Information
Type
Mask ROM
Product Name
HD404448
Model Name
HD404448H
HD404448TF
HD404449
HD404449H
HD404449TF
ZTAT™
HD4074449
HD4074449H
HD4074449TF
16,384
16,384
ROM (Words)
8,192
Package
80-pin plastic QFP (FP-80A)
80-pin plastic QFP (TFP-80F)
80-pin plastic QFP (FP-80A)
80-pin plastic QFP (TFP-80F)
80-pin plastic QFP (FP-80A)
80-pin plastic QFP (TFP-80F)
2
FPGA/CPLD
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