Freescale Semiconductor
Data Sheet: Product Preview
Document Number: K50P144M100SF2
Rev. 4, 3/2011
Supports the following:
MK50N512CLQ100,
MK50N512CMD100
K50 Sub-Family Data Sheet
K50P144M100SF2
Features
• Operating Characteristics
– Voltage range: 1.71 to 3.6 V
– Flash write voltage range: 1.71 to 3.6 V
– Temperature range (ambient): -40 to 85°C
• Performance
– Up to 100 MHz ARM Cortex-M4 core with DSP
instructions delivering 1.25 Dhrystone MIPS per
MHz
• Memories and memory interfaces
– Up to 512 KB program flash memory on non-
FlexMemory devices
– Up to 128 KB RAM
– Serial programming interface (EzPort)
– FlexBus external bus interface
• Clocks
– 3 to 32 MHz crystal oscillator
– 32 kHz crystal oscillator
– Multi-purpose clock generator
• System peripherals
– 10 low-power modes to provide power optimization
based on application requirements
– Memory protection unit with multi-master
protection
– 16-channel DMA controller, supporting up to 64
request sources
– External watchdog monitor
– Software watchdog
– Low-leakage wakeup unit
• Security and integrity modules
– Hardware CRC module to support fast cyclic
redundancy checks
– 128-bit unique identification (ID) number per chip
• Human-machine interface
– Low-power hardware touch sensor interface (TSI)
– General-purpose input/output
• Analog modules
– Two 16-bit SAR ADCs
– Programmable gain amplifier (up to x64) integrated
into each ADC
– Two 12-bit DACs
– Two operational amplifiers
– Two transimpedance amplifiers
– Three analog comparators (CMP) containing a 6-bit
DAC and programmable reference input
– Voltage reference
• Timers
– Programmable delay block
– Eight-channel motor control/general purpose/PWM
timer
– Two 2-channel quadrature decoder/general purpose
timers
– Periodic interrupt timers
– 16-bit low-power timer
– Carrier modulator transmitter
– Real-time clock
• Communication interfaces
– USB full-/low-speed On-the-Go controller with on-
chip transceiver
– Three SPI modules
– Two I2C modules
– Six UART modules
– Secure Digital host controller (SDHC)
– I2S module
This document contains information on a product under development. Freescale
reserves the right to change or discontinue this product without notice.
© 2010–2011 Freescale Semiconductor, Inc.
Preliminary
Table of Contents
1 Ordering parts...........................................................................4
1.1 Determining valid orderable parts......................................4
2 Part identification......................................................................4
2.1 Description.........................................................................4
2.2 Format...............................................................................4
2.3 Fields.................................................................................4
2.4 Example............................................................................5
3 Terminology and guidelines......................................................5
3.1 Definition: Operating requirement......................................5
3.2 Definition: Operating behavior...........................................6
3.3 Definition: Attribute............................................................6
3.4 Definition: Rating...............................................................7
3.5 Result of exceeding a rating..............................................7
3.6 Relationship between ratings and operating
requirements......................................................................7
3.7 Guidelines for ratings and operating requirements............8
3.8 Definition: Typical value.....................................................8
3.9 Typical value conditions....................................................9
4 Ratings......................................................................................9
4.1 Thermal handling ratings...................................................10
4.2 Moisture handling ratings..................................................10
4.3 ESD handling ratings.........................................................10
4.4 Voltage and current operating ratings...............................10
5 General.....................................................................................11
5.1 Nonswitching electrical specifications...............................11
5.1.1
5.1.2
5.1.3
5.1.4
5.1.5
5.1.6
5.1.7
5.1.8
Voltage and current operating requirements.........11
LVD and POR operating requirements.................12
Voltage and current operating behaviors..............13
Power mode transition operating behaviors..........13
Power consumption operating behaviors..............14
EMC radiated emissions operating behaviors.......17
Designing with radiated emissions in mind...........18
Capacitance attributes..........................................18
6.6.7
6.6.6
6.1 Core modules....................................................................21
6.1.1
6.1.2
Debug trace timing specifications.........................21
JTAG electricals....................................................21
6.2 System modules................................................................25
6.3 Clock modules...................................................................25
6.3.1
6.3.2
6.3.3
MCG specifications...............................................25
Oscillator electrical specifications.........................27
32kHz Oscillator Electrical Characteristics............29
6.4 Memories and memory interfaces.....................................30
6.4.1
6.4.2
6.4.3
Flash (FTFL) electrical specifications....................30
EzPort Switching Specifications............................32
Flexbus Switching Specifications..........................33
6.5 Security and integrity modules..........................................35
6.6 Analog...............................................................................35
6.6.1
6.6.2
6.6.3
6.6.4
6.6.5
ADC electrical specifications.................................35
CMP and 6-bit DAC electrical specifications.........43
12-bit DAC electrical characteristics.....................46
Op-amp electrical specifications...........................49
Transimpedance amplifier electrical
specifications — full range....................................50
Transimpedance amplifier electrical
specifications — limited range..............................51
Voltage reference electrical specifications............52
6.7 Timers................................................................................53
6.8 Communication interfaces.................................................54
6.8.1
6.8.2
6.8.3
6.8.4
6.8.5
6.8.6
6.8.7
6.8.8
6.8.9
USB electrical specifications.................................54
USB DCD electrical specifications........................54
USB VREG electrical specifications......................54
DSPI switching specifications (low-speed mode)..55
DSPI switching specifications (high-speed mode) 56
I2C switching specifications..................................58
UART switching specifications..............................58
SDHC specifications.............................................58
I2S switching specifications..................................59
5.2 Switching specifications.....................................................18
5.2.1
5.2.2
Device clock specifications...................................18
General switching specifications...........................19
6.9 Human-machine interfaces (HMI)......................................61
6.9.1
TSI electrical specifications...................................61
5.3 Thermal specifications.......................................................20
5.3.1
5.3.2
Thermal operating requirements...........................20
Thermal attributes.................................................20
7 Dimensions...............................................................................62
7.1 Obtaining package dimensions.........................................62
8 Pinout........................................................................................63
8.1 K50 Signal Multiplexing and Pin Assignments..................63
6 Peripheral operating requirements and behaviors....................20
K50 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.
2
Preliminary
Freescale Semiconductor, Inc.
Terminology and guidelines
Field
FFF
Description
Program flash memory size
•
•
•
•
•
•
32 = 32 KB
64 = 64 KB
128 = 128 KB
256 = 256 KB
512 = 512 KB
1M0 = 1 MB
Values
T
PP
Temperature range (°C)
Package identifier
• V = –40 to 105
• C = –40 to 85
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
FM = 32 QFN (5 mm x 5 mm)
FT = 48 QFN (7 mm x 7 mm)
LF = 48 LQFP (7 mm x 7 mm)
EX = 64 QFN (9 mm x 9 mm)
LH = 64 LQFP (10 mm x 10 mm)
LK = 80 LQFP (12 mm x 12 mm)
MB = 81 MAPBGA (8 mm x 8 mm)
LL = 100 LQFP (14 mm x 14 mm)
MC = 121 MAPBGA (8 mm x 8 mm)
LQ = 144 LQFP (20 mm x 20 mm)
MD = 144 MAPBGA (13 mm x 13 mm)
MF = 196 MAPBGA (15 mm x 15 mm)
MJ = 256 MAPBGA (17 mm x 17 mm)
50 = 50 MHz
72 = 72 MHz
100 = 100 MHz
120 = 120 MHz
150 = 150 MHz
CCC
Maximum CPU frequency (MHz)
N
Packaging type
• R = Tape and reel
• (Blank) = Trays
2.4 Example
This is an example part number:
MK50N512VMD100
3 Terminology and guidelines
3.1 Definition: Operating requirement
An
operating requirement
is a specified value or range of values for a technical
characteristic that you must guarantee during operation to avoid incorrect operation and
possibly decreasing the useful life of the chip.
K50 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.
Freescale Semiconductor, Inc.
Preliminary
5
stm32/stm8
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