cmos 8-bit microcontroller
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Toshiba(东芝) |
| 零件包装代码 | DIP |
| 包装说明 | SDIP, SDIP28,.4 |
| 针数 | 28 |
| Reach Compliance Code | unknow |
| 具有ADC | YES |
| 其他特性 | OPERATES AT 2.7 V MINIMUM SUPPLY AT 4.2 MHZ |
| 地址总线宽度 | |
| 位大小 | 8 |
| CPU系列 | TLCS-870 |
| 最大时钟频率 | 8 MHz |
| DAC 通道 | NO |
| DMA 通道 | NO |
| 外部数据总线宽度 | |
| JESD-30 代码 | R-PDIP-T28 |
| JESD-609代码 | e0 |
| 长度 | 25.6 mm |
| I/O 线路数量 | 22 |
| 端子数量 | 28 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | -30 °C |
| PWM 通道 | NO |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SDIP |
| 封装等效代码 | SDIP28,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 3/5 V |
| 认证状态 | Not Qualified |
| RAM（字节） | 256 |
| ROM（单词） | 4096 |
| ROM可编程性 | MROM |
| 座面最大高度 | 4.1 mm |
| 速度 | 8 MHz |
| 最大压摆率 | 14 mA |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | OTHER |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 1.778 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 10.16 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER |
| TMP87C408N | TMP87C408DM | TMP87C408LM | TMP87C408LN | TMP87C408M | TMP87C808LM | TMP87C808LN | |
|---|---|---|---|---|---|---|---|
| 描述 | cmos 8-bit microcontroller | cmos 8-bit microcontroller | cmos 8-bit microcontroller | cmos 8-bit microcontroller | cmos 8-bit microcontroller | cmos 8-bit microcontroller | cmos 8-bit microcontroller |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) |
| 零件包装代码 | DIP | SSOP | SOIC | DIP | SOIC | SOIC | DIP |
| 包装说明 | SDIP, SDIP28,.4 | LSSOP, SSOP30,.3 | SOP, SOP28,.5 | SDIP, SDIP28,.4 | SOP, SOP28,.5 | SOP, SOP28,.5 | SDIP, SDIP28,.4 |
| 针数 | 28 | 30 | 28 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | unknow | unknow | unknow | unknow | unknow | unknow | unknow |
| 具有ADC | YES | YES | YES | YES | YES | YES | YES |
| 其他特性 | OPERATES AT 2.7 V MINIMUM SUPPLY AT 4.2 MHZ | OPERATES AT 2.7 V MINIMUM SUPPLY AT 4.2 MHZ | OPERATES AT 2.7 V MINIMUM SUPPLY @ 4.2 MHZ | OPERATES AT 2.7 V MINIMUM SUPPLY @ 4.2 MHZ | OPERATES AT 2.7 V MINIMUM SUPPLY AT 4.2 MHZ | OPERATES AT 2.7 V MINIMUM SUPPLY @ 4.2 MHZ | OPERATES AT 2.7 V MINIMUM SUPPLY @ 4.2 MHZ |
| 位大小 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| CPU系列 | TLCS-870 | TLCS-870 | TLCS-870 | TLCS-870 | TLCS-870 | TLCS-870 | TLCS-870 |
| 最大时钟频率 | 8 MHz | 8 MHz | 4.2 MHz | 4.2 MHz | 8 MHz | 4.2 MHz | 4.2 MHz |
| DAC 通道 | NO | NO | NO | NO | NO | NO | NO |
| DMA 通道 | NO | NO | NO | NO | NO | NO | NO |
| JESD-30 代码 | R-PDIP-T28 | R-PDSO-G30 | R-PDSO-G28 | R-PDIP-T28 | R-PDSO-G28 | R-PDSO-G28 | R-PDIP-T28 |
| 长度 | 25.6 mm | 9.7 mm | 18.5 mm | 25.6 mm | 18.5 mm | 18.5 mm | 25.6 mm |
| I/O 线路数量 | 22 | 22 | 22 | 22 | 22 | 22 | 22 |
| 端子数量 | 28 | 30 | 28 | 28 | 28 | 28 | 28 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 最低工作温度 | -30 °C | -30 °C | -30 °C | -30 °C | -30 °C | -30 °C | -30 °C |
| PWM 通道 | NO | NO | NO | NO | NO | NO | NO |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SDIP | LSSOP | SOP | SDIP | SOP | SOP | SDIP |
| 封装等效代码 | SDIP28,.4 | SSOP30,.3 | SOP28,.5 | SDIP28,.4 | SOP28,.5 | SOP28,.5 | SDIP28,.4 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE | IN-LINE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | IN-LINE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 3/5 V | 3/5 V | 1.8/4 V | 1.8/4 V | 3/5 V | 1.8/4 V | 1.8/4 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM（字节） | 256 | 256 | 256 | 256 | 256 | 256 | 256 |
| ROM（单词） | 4096 | 4096 | 4096 | 4096 | 4096 | 8192 | 8192 |
| ROM可编程性 | MROM | MROM | MROM | MROM | MROM | MROM | MROM |
| 座面最大高度 | 4.1 mm | 1.45 mm | 2.7 mm | 4.1 mm | 2.7 mm | 2.7 mm | 4.1 mm |
| 速度 | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | NO | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER |
| 端子形式 | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE |
| 端子节距 | 1.778 mm | 0.65 mm | 1.27 mm | 1.778 mm | 1.27 mm | 1.27 mm | 1.778 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 10.16 mm | 5.6 mm | 8.8 mm | 10.16 mm | 8.8 mm | 8.8 mm | 10.16 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | - | e0 |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
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