电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

C0603X200G2GALAUTO7411

产品描述Ceramic Capacitor, Ceramic,
产品类别无源元件    电容器   
文件大小1MB,共20页
制造商KEMET(基美)
官网地址http://www.kemet.com
下载文档 详细参数 全文预览

C0603X200G2GALAUTO7411概述

Ceramic Capacitor, Ceramic,

C0603X200G2GALAUTO7411规格参数

参数名称属性值
Objectid7296291019
包装说明, 0603
Reach Compliance Codecompliant
ECCN代码EAR99
YTEOL6.9
电容0.00002 µF
电容器类型CERAMIC CAPACITOR
介电材料CERAMIC
高度0.8 mm
JESD-609代码e0
长度1.6 mm
安装特点SURFACE MOUNT
多层Yes
负容差2%
端子数量2
最高工作温度125 °C
最低工作温度-55 °C
封装形式SMT
包装方法TR, PUNCHED PAPER, 13 INCH
正容差2%
额定(直流)电压(URdc)200 V
参考标准AEC-Q200
尺寸代码0603
表面贴装YES
温度特性代码C0G
温度系数30ppm/Cel ppm/°C
端子面层Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
端子形状WRAPAROUND
宽度0.8 mm

文档预览

下载PDF文档
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), C0G Dielectric,
10 – 250 VDC (Commercial & Automotive Grade)
Overview
KEMET’s Flexible Termination (FT-CAP) Multilayer Ceramic
Capacitor in C0G dielectric incorporates a unique, flexible
termination system that is integrated with KEMET’s
standard termination materials. A conductive silver epoxy
is utilized between the base metal and nickel barrier
layers of KEMET’s standard termination system in order
to establish pliability while maintaining terminal strength,
solderability and electrical performance. This technology
was developed in order to address the primary failure
mode of MLCCs– flex cracks, which are typically the result
of excessive tensile and shear stresses produced during
board flexure and thermal cycling. Flexible termination
technology inhibits the transfer of board stress to the rigid
ceramic body, therefore mitigating flex cracks which can
result in low IR or short circuit failures.
Although this technology does not eliminate the potential
for mechanical damage that may propagate during extreme
environmental and handling conditions, it does provide
superior flex performance over standard termination
systems. FT-CAP complements KEMET’s Open Mode,
Floating Electrode (FE-CAP), Floating Electrode with
Flexible Termination (FF-CAP), and KEMET Power Solutions
(KPS) product lines by providing a complete portfolio of
flex mitigation solutions.
Combined with the stability of C0G dielectric and designed to
accommodate all capacitance requirements, these flex-robust
devices are RoHS Compliant, offer up to 5 mm of flex-bend
capability and exhibit no change in capacitance with respect
to time and voltage. Capacitance change with reference to
ambient temperature is limited to ±30 ppm/ºC from −55°C to
+125°C.
In addition to Commercial Grade, Automotive Grade devices
are available which meet the demanding Automotive
Electronics Council's AEC–Q200 qualification requirements.
Click image above for interactive 3D content
Open PDF in Adobe Reader for full functionality
Ordering Information
C
Ceramic
1206
X
563
Capacitance
Code (pF)
Two significant digits
and number of zeros.
Use 9 for 1.0 – 9.9 pF
Use 8 for 0.5 – .99 pF
e.g., 2.2 pF = 229
e.g., 0.5 pF = 508
J
Capacitance
Tolerance
1
B = ±0.10 pF
C = ±0.25 pF
D = ±0.5 pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
3
Rated
Voltage
(VDC)
8 = 10
4 = 16
3 = 25
5 = 50
1 = 100
2 = 200
A = 250
G
Dielectric
G = C0G
A
Failure
Rate/
Design
A = N/A
C
Termination Finish
2
C = 100% Matte Sn
L = SnPb (5% Pb minimum)
TU
Packaging/
Grade (C-Spec)
See
"Packaging
C-Spec
Ordering
Options
Table"
Case Size
Specification/
(L" x W")
Series
0603
0805
1206
1210
1812
1825
2220
2225
X = Flexible
Termination
1
2
Additional capacitance tolerance offerings may be available. Contact KEMET for details.
Additional termination finish options may be available. Contact KEMET for details.
Built Into Tomorrow
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1062_C0G_FT-CAP_SMD • 9/14/2020
1
【米尔MYS-8MMX】米尔MYS-8MMQ6-8E2D-180-C应用四——NLP使用自定义词典
在上篇(https://bbs.eeworld.com.cn/thread-1178634-1-1.html)中,我们在米尔MYS-8MMQ6-8E2D-180-C的板卡上尝试对词性进行了标注,发现jieba缺省库中的词性识别并不是特别准确,同时而且分词 ......
tobot 嵌入式系统
modelsim时序仿真
把源文件和测试文件以及所用到的原语库加载到工程中去,在时序仿真,指定quartus产生的sdf文件,并指定region/(例化名)结果出现这样的错误 Failed to find INSTANCE ''. Failed to annotat ......
edelajiang FPGA/CPLD
纳闷:按说A/D前面不加低通滤波
按说A/D前面不加低通滤波,因为采样造成的混叠会使情况“很糟”, 但事实上似乎没那么严重。各位是否都加所谓的抗混叠滤波?...
leslie 单片机
SPI通讯
我用VET6的SPI1操作一个加速度芯片,读字节总是0x00,但用同样的代码操作SPI2,FLASH IC确可以。不知道是什么原因。请问大家是怎么用SPI1的啊? SPI的设置我反复修改,结果还是不行。但是在 ......
ldw3 stm32/stm8
51单片机IO口模拟spi接口
求源代码及详细解释 1、spi接口通行时有寄存器比如:SPCTL 控制寄存器、 SPDTA 、数据寄存器、 SPSTAT状态寄存器。51单片机模拟时如上的寄存器如何处理和模拟(51应该没有如上的七寸器)?2、 ......
xinghua217 51单片机
请问直流母线的P,N线最小安全距离由什么决定?
爬电距离???? ...
西里古1992 模拟电子

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 537  1894  93  786  2014  11  39  2  16  41 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved