GaAs Solder Bump Flip Chip Schottky Diode
Features
•
Low Series Resistance, 4
Ω
•
Low Capacitance, 45 fF
•
High Cutoff Frequency
•
Silicon Nitride Passivation
•
Polyimide Scratch Protection
•
Solderable Bump Die Attach
MADS-001317-1320AG
V1
Mounting Side with Solder Bumps
Description
M/A-COM's MADS-001317-1320AG is a Gallium Arsenide Flip-Chip Schottky diode with solder bumps.These
devices are fabricated on OMCVD epitaxial wafers using a process designed for high device uniformity and extremely low
parasitics. This device can be used up to 80 GHz. This diode is fully passivated with silicon nitride and has an additional
layer of a polymer for scratch protection. The protective coatings prevent damage to the junction during handling and
circuit attachment.
Applications
The high cutoff frequency of this device allows use through millimeter wave frequencies. Typical applications
include single and double balanced mixers in PCN tranceivers, radios, police radar detectors and automotive radar
detectors
Electrical Specifications T
A
= 25
°
C
Parameters and Test Conditions
Symbol
Units
MADS-0001317-1320AG
Min
Junction Capacitance at 0V at 1 MHz
Total Capacitance at 0V at 1 MHz
1
Typ.
.020
.045
4
7
Ct
Rs
Vf
Vb
pF
Ω
Volts
Volts
.030
4.5
Max
0.030
.060
7
Dynamic Resistance at 9.5 mA – 10.5 mA
Reverse Breakdown Voltage at 10uA
Notes:
1.
Total capacitance is equivalent to the sum of junction capacitance Cj and parasitic capacitance Cp.
Specification Subject to Change Without Notice
M/A-COM, Inc.
________________________________________________________________________________
1
North America: Tel. (800) 366-2266
Fax (800) 618-8883
Asia/Pacific:
Tel.
Fax
+85 2 2375 0618
+85 2 2375 0350
Europe:
Tel.
Fax
+44 (1344) 869 595
+44 (1344) 300 020
GaAs Solder Bump Flip Chip Schottky Diode
MADS-001317-1320AG
V1.00
0.008”
0.013”
(2) PL
0.011”
(2) PL
Circuit Mounting Dimensions ( Inches )
Specification Subject to Change Without Notice
2
________________________________________________________________________________
M/A-COM, Inc.
Asia/Pacific:
Tel.
Fax
+85 2 2375 0618
+85 2 2375 0350
Europe:
Tel.
Fax
+44 (1344) 869 595
+44 (1344) 300 020
North America: Tel. (800) 366-2266
Fax (800) 618-8883
GaAs Solder Bump Flip Chip Schottky Diode
Device Installation Procedures
The following guidelines should be observed to avoid damaging GaAs Flip-Chips.
MADS-001317-1320AG
V1.00
Cleanliness
These devices should be handled in a clean environment. Do Not attempt to Clean Die After installation.
Static Sensitivity
Gallium arsenide Schottky diodes are ESD sensitive and can be damaged by static electricity. Since Schottky
diodes are rated as Class 0, proper ESD techniques should be used when handling these devices.
General Handling
These devices have a polymer layer which provides scratch protection for the junction area and the anode air
bridge. Die can be handled with plastic tweezers or picked and placed automatically with a #27 tip vacuum
pencil.
Assembly Requirements using Tin Lead Solder
This Flip Chip Diode employs a 6um thick, Sn 63 / Pb 37 Solderable interface as part of the 50µm high solder
bump. These chips are designed to be soldered onto hard or soft substrates with the junction side down. They
should be mounted onto silkscreened circuits using 60/40 Sn/Pb solder paste. A typical profile for a Sn 63/ Pb
37 Soldering process is provided in
Application Note, M538 Surface Mounting Instructions
on the M/A-COM
website
www.macom.com
Typical SPICE PARAMETERS
Is
(A)
1.7E-14
Rs
(
Ω
)
4.6
N
1.08
Ct0
( pF )
.047
M
.38
Ik
(A)
.016
Vj
(V)
.86
FC
.99
BV
(V)
7
IBV
(A)
1.0E-5
Absolute Maximum Ratings @ 25˚C
1
Parameter
Operating Temperature
Storage Temperature
Incident LO Power
Incident RF Power
Mounting Temperature
Maximum Ratings
-65
°C
to +125
°C
-65
°C
to +150
°C
+ 20 dBm
+ 20 dBm
+300
°C
for 10 seconds
Ordering Information
Part Number
MADS-001317-1320AG
Packaging
Gel Pack
Notes
1
.
Exceeding these limits may cause permanent damage.
Specification Subject to Change Without Notice
M/A-COM, Inc.
________________________________________________________________________________
3
North America: Tel. (800) 366-2266
Fax (800) 618-8883
Asia/Pacific:
Tel.
Fax
+85 2 2375 0618
+85 2 2375 0350
Europe:
Tel.
Fax
+44 (1344) 869 595
+44 (1344) 300 020
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