12-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, CQCC44
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Renesas(瑞萨电子) |
零件包装代码 | LCC |
包装说明 | CERAMIC, LCC-44 |
针数 | 44 |
Reach Compliance Code | not_compliant |
ECCN代码 | 3A001.A.2.C |
最大模拟输入电压 | 24 V |
最小模拟输入电压 | -24 V |
最长转换时间 | 25 µs |
转换器类型 | ADC, SUCCESSIVE APPROXIMATION |
JESD-30 代码 | S-CQCC-N44 |
JESD-609代码 | e0 |
最大线性误差 (EL) | 0.012% |
标称负供电电压 | -15 V |
位数 | 12 |
功能数量 | 1 |
端子数量 | 44 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出位码 | BINARY, OFFSET BINARY |
输出格式 | PARALLEL, WORD |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | QCCN |
封装等效代码 | LCC44,.65SQ |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
电源 | 5,+-12/+-15 V |
认证状态 | Not Qualified |
采样速率 | 0.05 MHz |
筛选级别 | 38535Q/M;38534H;883B |
最大压摆率 | 28 mA |
标称供电电压 | 15 V |
表面贴装 | YES |
技术 | BIPOLAR |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | NO LEAD |
端子节距 | 1.27 mm |
端子位置 | QUAD |
Base Number Matches | 1 |
HI4-774T/883 | HI4-574ATE/883 | HI4-574ASE/883 | HI4-674ATE/883 | |
---|---|---|---|---|
描述 | 12-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, CQCC44 | 1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, CQCC44, CERAMIC, LCC-44 | 1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, CQCC44, CERAMIC, LCC-44 | 1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, CQCC44, CERAMIC, LCC-44 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
零件包装代码 | LCC | LCC | LCC | LCC |
包装说明 | CERAMIC, LCC-44 | CERAMIC, LCC-44 | CERAMIC, LCC-44 | CERAMIC, LCC-44 |
针数 | 44 | 44 | 44 | 44 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant |
ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
最大模拟输入电压 | 24 V | 10 V | 10 V | 10 V |
最小模拟输入电压 | -24 V | -10 V | -10 V | -10 V |
最长转换时间 | 25 µs | 25 µs | 25 µs | 15 µs |
转换器类型 | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
JESD-30 代码 | S-CQCC-N44 | S-CQCC-N44 | S-CQCC-N44 | S-CQCC-N44 |
JESD-609代码 | e0 | e0 | e0 | e0 |
最大线性误差 (EL) | 0.012% | 0.0122% | 0.0244% | 0.0122% |
标称负供电电压 | -15 V | -12 V | -12 V | -12 V |
位数 | 12 | 12 | 12 | 12 |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 44 | 44 | 44 | 44 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
输出位码 | BINARY, OFFSET BINARY | BINARY | BINARY | BINARY |
输出格式 | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | QCCN | QCCN | QCCN | QCCN |
封装等效代码 | LCC44,.65SQ | LCC44,.65SQ | LCC44,.65SQ | LCC44,.65SQ |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
电源 | 5,+-12/+-15 V | 5,+-12/+-15 V | 5,+-12/+-15 V | 5,+-12/+-15 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
筛选级别 | 38535Q/M;38534H;883B | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 |
标称供电电压 | 15 V | 12 V | 12 V | 12 V |
表面贴装 | YES | YES | YES | YES |
技术 | BIPOLAR | BICMOS | BICMOS | BICMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD |
长度 | - | 16.535 mm | 16.535 mm | 16.535 mm |
模拟输入通道数量 | - | 1 | 1 | 1 |
峰值回流温度(摄氏度) | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
采样并保持/跟踪并保持 | - | SAMPLE | SAMPLE | SAMPLE |
座面最大高度 | - | 3.5 mm | 3.5 mm | 3.5 mm |
处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | - | 16.535 mm | 16.535 mm | 16.535 mm |
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