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HTHG120669R000AW

产品描述RES,SMT,METAL FOIL,69 OHMS,.05% +/-TOL,-2.5,2.5PPM TC,1206 CASE
产品类别无源元件    电阻器   
文件大小2MB,共7页
制造商Vishay(威世)
官网地址http://www.vishay.com
标准
下载文档 详细参数 全文预览

HTHG120669R000AW概述

RES,SMT,METAL FOIL,69 OHMS,.05% +/-TOL,-2.5,2.5PPM TC,1206 CASE

HTHG120669R000AW规格参数

参数名称属性值
是否Rohs认证符合
Objectid1222291727
包装说明SMT, 1206
Reach Compliance Codeunknown
Country Of OriginIsrael
ECCN代码EAR99
YTEOL10
构造Chip
制造商序列号HTHG
端子数量2
最高工作温度240 °C
最低工作温度-55 °C
封装高度0.5 mm
封装长度3.2 mm
封装形式SMT
封装宽度1.57 mm
包装方法Waffle Pack
额定功率耗散 (P)0.033 W
电阻69 Ω
电阻器类型FIXED RESISTOR
系列HTHG
尺寸代码1206
技术METAL FOIL
温度系数2.5 ppm/°C
容差0.05%

文档预览

下载PDF文档
HTHG (Z1 Foil Technology)
Ultra High Precision Z1 Foil Technology Gold Wire Bondable Chip
Resistor for Hybrid Circuits for High Temperature Applications up to
+240°C, Long Term Stability of 0.05%
FEATURES
Temperature coefficient of resistance (TCR):
±3 ppm/°C typical (- 55 °C to + 220 °C, + 25 °C ref.)
Resistance range: 5 to 100 k(for higher
or lower values, please contact VFR's application
engineering department)
Resistance tolerance: to ± 0.02 %
Connection method: gold wire bonding
Working power: to 150mW at + 220°C
Long term stability: to ± 0.05 % at + 240°C for 2000h, no
power
Load life stability: to 0.05% at + 220°C for 2000h at
working power
Bulk Metal Foil resistors are not restricted to standard
values; specific "as required" values can be supplied at no
extra cost or delivery (e.g. 1K2345 vs. 1K)
Thermal stabilization time < 1 s (nominal value achieved
within 10 ppm of steady state value)
Electrostatic discharge (ESD) at least to 25 kV
Non inductive, non capacitive design
Rise time: 1 ns effectively no ringing
Current noise: 0.010 µV (RMS)/Volt of applied voltage
(< - 40 dB)
Voltage coefficient: < 0.1 ppm/V
Non inductive: < 0.08 µH
Non hot spot design
Terminal finish: gold plated (lead (Pb)-free alloy)
quantities
available,
please
contact
Prototype
foil@vpgsensors.com
INTRODUCTION
Vishay Foil Resistors (VFR) introduces a new line of Ultra
Precision Bulk Metal
®
Z1 Foil Technology: hybrid chip
resistors, connected using gold wire bonding. The HTHG
series features two different layouts of chip designs
according to the sizes (see figure 3 and table 4). These new
types of hybrid chips were especially designed for high
temperature applications up to + 240°C
(1)
(working power: to
150mW at + 220°C), and include gold plated terminals.
The HTHG series is available in any value within the
specified resistance range. VFR's application engineering
department is available to advise and make
recommendations.
For non-standard technical requirements and special
applications, please contact
foil@vpgsensors.com.
FIGURE 1 - POWER DERATING CURVE
TABLE 1 - TOLERANCE AND TCR VS.
RESISTANCE VALUE
(1)(2)
(- 55 °C to + 220 °C, + 25 °C Ref.)
RESISTANCE
VALUE
()
100to 100K
50to < 100
25to < 50
10to < 25
5to 10
(1)
(2)
Percent of Rated Power
-55°C
100
75
50
25
0
-75
+70°C
TOLERANCE
(%)
± 0.02
± 0.05
± 0.1
± 0.25
± 0.5
TCR Typical
(ppm/°C)
-50
-25
0
+25
+50
+240
+75 +100 +125 +150 +175 +200 +225 +250
±3
Ambient Temperature (°C)
Notes
Performances obtained with ceramic PCB.
For tighter performances or non-standard values up to 150 k,
please contact VFR's application engineering department by
sending an e-mail to the address in the footer below.
Document Number: 63221
Revision: 13-Oct-15
For any questions, contact
foil@vpgsensors.com
www.vishayfoilresistors.com
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