This document was generated on 11/09/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
Description:
5002104787
Obsolete
1.27mm (.050") Pitch Micro PGA Socket for Mobile Pentium* 4, Ball Grid Array (BGA)
Mount, ZIF, 478 Circuits, Key Version C, with Pick and Place Cover, Tape and Reel
Package, Lead Free
Documents:
Drawing (PDF)
Series
General
Product Family
Series
Comments
Component Type
Product Name
Processor Sockets
500210
ZIF, with Pick and Place Cover
Socket
Micro PGA
image - Reference only
EU RoHS
ELV and RoHS
Compliant
REACH SVHC
Not Reviewed
Low-Halogen Status
Not Reviewed
China RoHS
Physical
Circuits (Loaded)
Circuits (maximum)
Color - Resin
Durability (mating cycles max)
Material - Metal
Material - Plating Mating
Material - Plating Termination
Material - Resin
Packaging Type
Pitch - Mating Interface
Plating min - Mating
Plating min - Termination
Temperature Range - Operating
Termination Interface: Style
478
478
Black, Blue (Light)
50
Copper-Nickel-Silicon, Stainless Steel
Gold
Nickel
High Temperature Thermoplastic
Embossed Tape on Reel
1.27mm (.050")
0.254µm (10µ")
1.270µm (50µ")
-20°C to +90°C
Surface Mount
Need more information on product
environmental compliance?
Email productcompliance@molex.com
For a multiple part number RoHS Certificate of
Compliance, click here
Please visit the Contact Us section for any
non-product compliance questions.
Electrical
Current - Maximum per Contact
Voltage - Maximum
0.5A
100V
Search Parts in this Series
500210Series
Mates With
Intel Mobile Celeron* Processor-M|Intel
Mobile Pentium* 4 Processor
Material Info
Country of Origin
CN
Reference - Drawing Numbers
Packaging Specification
PK-500161-002
Product Specification
PS-51248-020
Sales Drawing
SD-500161-004
* Pentium and Celeron are registered trademarks of Intel Corporation
This document was generated on 11/09/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION