SRAM
ADDENDUM
Attention:
Micron has discontinued its 119-pin BGA SRAM package. While
we are currently working to update these data sheets, please note
that this data sheet still shows the discontinued package.
For further information please call 208-368-3900.
Regular business hours are from 8:00 a.m. to 5:00 p.m. MST.
Thank you
Micron SRAM
PRELIMINARY
4Mb: 256K x 18, 128K x 32/36
PIPELINED, SCD SYNCBURST SRAM
4Mb SYNCBURST
™
SRAM
FEATURES
• Fast clock and OE# access times
• Single +3.3V +0.3V/-0.165V power supply (V
DD
)
• Separate +3.3V or +2.5V isolated output buffer
supply (V
DD
Q)
• SNOOZE MODE for reduced-power standby
• Single-cycle deselect (Pentium
®
BSRAM-compatible)
• Common data inputs and data outputs
• Individual BYTE WRITE control and GLOBAL
WRITE
• Three chip enables for simple depth expansion and
address pipelining
• Clock-controlled and registered addresses, data I/Os
and control signals
• Internally self-timed WRITE cycle
• Burst control pin (interleaved or linear burst)
• Automatic power-down for portable applications
• 100-lead TQFP package for high density, high speed
• 119-pin BGA package
• Low capacitive bus loading
• x18, x32 and x36 versions available
MT58L256L18P1, MT58L128L32P1,
MT58L128L36P1; MT58L256V18P1,
MT58L128V32P1, MT58L128V36P1
3.3V V
DD
, 3.3V or 2.5V I/O, Pipelined, Single-Cycle
Deselect
100-PIN TQFP*
119-PIN BGA
OPTIONS
• Timing (Access/Cycle/MHz)
2.3ns/4ns/250 MHz
2.6ns/4.4ns/225 MHz
3.1ns/5ns/200 MHz
3.5ns/6ns/166 MHz
4.0ns/7.5ns/133 MHz
5ns/10ns/100 MHz
• Configurations
3.3V I/O
256K x 18
128K x 32
128K x 36
2.5V I/O
256K x 18
128K x 32
128K x 36
• Packages
100-pin TQFP
119-pin, 14mm x 22mm BGA
• Operating Temperature Range
Commercial (0°C to +70°C)
Industrial (-40°C to +85°C)
Part Number Example:
MARKING
-4
-4.4
-5
-6
-7.5
-10
MT58L256L18P1
MT58L128L32P1
MT58L128L36P1
MT58L256V18P1
MT58L128V32P1
MT58L128V36P1
T
B
None
IT
*JEDEC-standard MS-026 BHA (LQFP).
GENERAL DESCRIPTION
The Micron
®
SyncBurst
™
SRAM family employs
high-speed, low-power CMOS designs that are fabri-
cated using an advanced CMOS process.
Micron’s 4Mb SyncBurst SRAMs integrate a
256K x 18, 128K x 32, or 128K x 36 SRAM core with
advanced synchronous peripheral circuitry and a 2-bit
burst counter. All synchronous inputs pass through
registers controlled by a positive-edge-triggered single
clock input (CLK). The synchronous inputs include all
addresses, all data inputs, active LOW chip enable
(CE#), two additional chip enables for easy depth ex-
MT58L256L18P1T-6 IT
4Mb: 256K x 18, 128K x 32/36 Pipelined, SCD SyncBurst SRAM
MT58L256L18P1.p65 – Rev. 3/00
1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2000, Micron Technology, Inc.
PRELIMINARY
4Mb: 256K x 18, 128K x 32/36
PIPELINED, SCD SYNCBURST SRAM
FUNCTIONAL BLOCK DIAGRAM
256K x 18
18
SA0, SA1, SA
MODE
ADV#
CLK
ADDRESS
REGISTER
18
16
18
2
SA0, SA1
SA1'
BINARY Q1
COUNTER AND
LOGIC
CLR
Q0
SA0'
ADSC#
ADSP#
BYTE “b”
WRITE REGISTER
9
BYTE “b”
WRITE DRIVER
9
256K x 9 x 2
MEMORY
ARRAY
9
18
SENSE 18
AMPS
BWb#
OUTPUT
18
REGISTERS
OUTPUT
BUFFERS
E
18
BWa#
BWE#
GW#
CE#
CE2
CE2#
OE#
BYTE “a”
WRITE REGISTER
9
BYTE “a”
WRITE DRIVER
DQs
DQPa
DQPb
ENABLE
REGISTER
18
PIPELINED
ENABLE
2
INPUT
REGISTERS
FUNCTIONAL BLOCK DIAGRAM
128K x 32/36
17
SA0, SA1, SA
ADDRESS
REGISTER
17
15
SA0, SA1
17
MODE
ADV#
CLK
Q1
BINARY
COUNTER
SA0'
CLR
Q0
SA1'
ADSC#
ADSP#
BWd#
BYTE “d”
WRITE REGISTER
BYTE “c”
WRITE REGISTER
BYTE “d”
WRITE DRIVER
BYTE “c”
WRITE DRIVER
BYTE “b”
WRITE DRIVER
BYTE “a”
WRITE DRIVER
INPUT
REGISTERS
128K x 8 x 4
(x32)
128K x 9 x 4
(x36)
MEMORY
ARRAY
SENSE
AMPS
BWc#
OUTPUT
REGISTERS
BWb#
BYTE “b”
WRITE REGISTER
OUTPUT
BUFFERS
E
DQs
DQPa
DQPd
BWa#
BWE#
GW#
CE#
CE2
CE2#
OE#
BYTE “a”
WRITE REGISTER
ENABLE
REGISTER
PIPELINED
ENABLE
4
NOTE:
Functional block diagrams illustrate simplified device operation. See truth tables, pin descriptions and timing diagrams
for detailed information.
4Mb: 256K x 18, 128K x 32/36 Pipelined, SCD SyncBurst SRAM
MT58L256L18P1.p65 – Rev. 3/00
2
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2000, Micron Technology, Inc.
PRELIMINARY
4Mb: 256K x 18, 128K x 32/36
PIPELINED, SCD SYNCBURST SRAM
GENERAL DESCRIPTION (continued)
pansion (CE2, CE2#), burst control inputs (ADSC#,
ADSP#, ADV#), byte write enables (BWx#) and global
write (GW#).
Asynchronous inputs include the output enable
(OE#), clock (CLK) and snooze enable (ZZ). There is also
a burst mode input (MODE) that selects between inter-
leaved and linear burst modes. The data-out (Q), en-
abled by OE#, is also asynchronous. WRITE cycles can
be from one to two bytes wide (x18) or from one to four
bytes wide (x32/x36), as controlled by the write control
inputs.
Burst operation can be initiated with either address
status processor (ADSP#) or address status controller
(ADSC#) inputs. Subsequent burst addresses can be
internally generated as controlled by the burst advance
input (ADV#).
Address and write control are registered on-chip to
simplify WRITE cycles. This allows self-timed WRITE
cycles. Individual byte enables allow individual bytes
to be written. During WRITE cycles on the x18 device,
BWa# controls DQa’s and DQPa; BWb# controls DQb’s
and DQPb. During WRITE cycles on the x32 and x36
devices, BWa# controls DQa’s and DQPa; BWb# con-
trols DQb’s and DQPb; BWc# controls DQc’s and DQPc;
BWd# controls DQd’s and DQPd. GW# LOW causes all
bytes to be written. Parity bits are only available on the
x18 and x36 versions.
This device incorporates a single-cycle deselect fea-
ture during READ cycles. If the device is immediately
deselected after a READ cycle, the output bus goes to a
High-Z state
t
KQHZ nanoseconds after the rising edge
of clock.
Micron’s 4Mb SyncBurst SRAMs operate from a
+3.3V V
DD
power supply, and all inputs and outputs are
TTL-compatible. Users can choose either a 3.3V or 2.5V
I/O version. The device is ideally suited for Pentium and
PowerPC pipelined systems and systems that benefit
from a very wide, high-speed data bus. The device is also
ideal in generic 16-, 18-, 32-, 36-, 64- and 72-bit-wide
applications.
Please refer to Micron’s Web site (www.micron.com/
mti/msp/html/sramprod.html) for the latest data sheet.
TQFP PIN ASSIGNMENT TABLE
PIN #
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
x32/x36
NC/DQPc*
DQc
DQc
V
DD
Q
V
SS
NC
DQc
NC
DQc
DQb
DQc
DQb
DQc
V
SS
V
DD
Q
DQb
DQc
DQb
DQc
V
DD
V
DD
NC
V
SS
DQb
DQd
DQb
DQd
V
DD
Q
V
SS
DQb
DQd
DQb
DQd
DQPb
DQd
NC
DQd
x18
NC
NC
NC
PIN #
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
x18
x32/x36
V
SS
V
DD
Q
NC
DQd
NC
DQd
NC
NC/DQPd*
MODE
SA
SA
SA
SA
SA1
SA0
DNU
DNU
V
SS
V
DD
NF**
NF**
SA
SA
SA
SA
SA
SA
SA
PIN #
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
x32/x36
NC/DQPa*
DQa
DQa
V
DD
Q
V
SS
NC
DQa
NC
DQa
DQa
DQa
V
SS
V
DD
Q
DQa
DQa
ZZ
V
DD
NC
V
SS
DQa
DQb
DQa
DQb
V
DD
Q
V
SS
DQa
DQb
DQa
DQb
DQPa
DQb
NC
DQb
x18
NC
NC
NC
PIN #
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
x18
x32/x36
V
SS
V
DD
Q
DQb
DQb
NC/DQPb*
SA
SA
ADV#
ADSP#
ADSC#
OE#
BWE#
GW#
CLK
V
SS
V
DD
CE2#
BWa#
BWb#
BWc#
BWd#
CE2
CE#
SA
SA
NC
NC
SA
NC
NC
*No Connect (NC) is used on the x32 version. Parity (DQPx) is used on the x36 version.
**Pins 43 and 42 are reserved for address expansion, 8Mb and 16Mb respectively.
4Mb: 256K x 18, 128K x 32/36 Pipelined, SCD SyncBurst SRAM
MT58L256L18P1.p65 – Rev. 3/00
3
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2000, Micron Technology, Inc.
PRELIMINARY
4Mb: 256K x 18, 128K x 32/36
PIPELINED, SCD SYNCBURST SRAM
PIN ASSIGNMENT (TOP VIEW)
100-PIN TQFP
SA
NC
NC
V
DD
Q
V
SS
NC
DQPa
DQa
DQa
V
SS
V
DD
Q
DQa
DQa
V
SS
NC
V
DD
ZZ
DQa
DQa
V
DD
Q
V
SS
DQa
DQa
NC
NC
V
SS
V
DD
Q
NC
NC
NC
SA
SA
ADV#
ADSP#
ADSC#
OE#
BWE#
GW#
CLK
V
SS
V
DD
CE2#
BWa#
BWb#
NC
NC
CE2
CE#
SA
SA
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
50
81
49
82
48
83
47
84
46
85
45
86
44
87
43
88
42
89
41
90
40
91
39
92
38
93
37
94
36
95
35
96
34
97
33
98
32
99
31
100
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30
x18
SA
SA
SA
SA
SA
SA
SA
NF**
NF**
V
DD
V
SS
DNU
DNU
SA0
SA1
SA
SA
SA
SA
MODE
SA
SA
ADV#
ADSP#
ADSC#
OE#
BWE#
GW#
CLK
V
SS
V
DD
CE2#
BWa#
BWb#
BWc#
BWd#
CE2
CE#
SA
SA
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
50
81
49
82
48
83
47
84
46
85
45
86
44
87
43
88
42
89
41
90
40
91
39
92
38
93
37
94
36
95
35
96
34
97
33
98
32
99
31
100
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30
NC/DQPb*
DQb
DQb
V
DD
Q
V
SS
DQb
DQb
DQb
DQb
V
SS
V
DD
Q
DQb
DQb
V
SS
NC
V
DD
ZZ
DQa
DQa
V
DD
Q
V
SS
DQa
DQa
DQa
DQa
V
SS
V
DD
Q
DQa
DQa
NC/DQPa*
NC
NC
NC
V
DD
Q
V
SS
NC
NC
DQb
DQb
V
SS
V
DD
Q
DQb
DQb
V
DD
V
DD
NC
V
SS
DQb
DQb
V
DD
Q
V
SS
DQb
DQb
DQPb
NC
V
SS
V
DD
Q
NC
NC
NC
x32/x36
SA
SA
SA
SA
SA
SA
SA
NF**
NF**
V
DD
V
SS
DNU
DNU
SA0
SA1
SA
SA
SA
SA
MODE
*No Connect (NC) is used on the x32 version. Parity (DQPx) is used on the x36 version.
**Pins 43 and 42 are reserved for address expansion, 8Mb and 16Mb respectively.
4Mb: 256K x 18, 128K x 32/36 Pipelined, SCD SyncBurst SRAM
MT58L256L18P1.p65 – Rev. 3/00
NC/DQPc*
DQc
DQc
V
DD
Q
V
SS
DQc
DQc
DQc
DQc
V
SS
V
DD
Q
DQc
DQc
V
DD
V
DD
NC
V
SS
DQd
DQd
V
DD
Q
V
SS
DQd
DQd
DQd
DQd
V
SS
V
DD
Q
DQd
DQd
NC/DQPd*
4
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2000, Micron Technology, Inc.
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