High Shock Discrete
Voltage Controlled SAW Oscillator
VS-701
VS-701
Description
The VS-701 VCSO (Voltage Controlled Saw Oscillator) from Vectron is a high frequency, ultra low phase noise oscillator designed
to support high speed data converters and 100G / 400G coherent optical receivers. The VS-701 provides 13fs rms jitter in a 12kHz
to 20MHz integration bandwidth and is available from 0.6 to 3.0GHz.
Features
•
•
•
•
•
•
•
•
Frequency Range 0.6 to 3.0 GHz
Ultra low jitter performance
Typical Jitter: 13fsec rms, 12kHz to 20MHz
3.3 + 5V supply voltage
Output: Sinewave & LVPECL
5x7 mm SMD package
20.000g shock survival
See table on Page 5 for standard frequencies
•
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Applications
High Speed ADCs
100G & 400G Coherent Receivers
Test & Measurement
Military
Performance Specifications
Pulling Characteristics
Parameter
Absolute Pull Range (APR)
Min
±20
Typ
Max
Units
ppm
Notes
Includes df vs:
•Operating temperature range +10 .. 85°C
•Aging 10 years
•Supply Voltage Change 5%
•Load change 10%
Positive
with V
S
= 5V
with V
S
= 3.3V
Tuning Slope
Control Voltage Range
Frequency control input
impedance
Modulation bandwidth
Supply voltage (standard)
Current consumption
Supply voltage (standard)
Current consumption
3.135
3.3
0.5
0
100
20
2.5
1.65
4.5
3.3
V DC
VDC
kΩ
kHz
@ -3dB
Supply Voltage (Vs)
4.75
5.00
5.25
50
3.465
75
95
V DC
mA
V DC
mA
mA
@ sinewave
@ LVPECL
@ sinewave
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Performance Specifications (Continued)
RF Output
Parameter
Signal
Load
Output Power
Signal
Load
Duty Cycle
Phase Noise: 100Hz offset
Phase Noise: 1kHz offset
Phase Noise: 10kHz offset
Phase Noise: 100kHz offset
Phase Noise: 1MHz offset
Phase Noise: 10MHz offset
Jitter: 12kHz to 20MHz offset
45
45
-63
-93
-124
-143
-158
-163
13
50
45
4
50
7
LVPECL
55
55
Ω
%
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
fs rms
@ 1.265GHz
Sinewave
3.3V
Min
Typ
Max
Sinewave
55
10
Units
Ω
dBm
Notes
Package G352
Package G356
Additional Parameters
Parameter
Weight
Subharmonics
Processing and Packing
Min
1.0g
Max
-20
Units
dBc
> 1.2 GHz
Notes
Handling and Processing Note
Absolute Maximum Ratings
Parameter
Supply Voltage (V
S
)
Operable Temperature Range
Storage Temperature Range
-40
-40
Min
Max
6.0
+85
+95
Units
V
0C
0C
Notes
Environmental Conditions
Rapid Temperature Changes
Vibration
Shock
Solderability
Solvent Resistance
ESD
Moisture Sensitivity
RoHS Compliance
MIL-883-1010 Cond B 500 cycles -55/125C
MIL-STD-883 Meth 2007 Cond A: 20g 20-2000Hz 4x in each 3axis 4 min sweep time
MIL-STD-883G Meth 2002.4 Cond. D: 5000g 0,3ms 6 shocks in each direction
MIL-STD-883G Meth 2002.4 Cond. E: 20000g 0,2ms 1 shock
J-STD-002C Cond A, leaded Cond. B SMD (MIL-STD-883 M 2003); 245°C
Dip&Look with 8h damp pre-treatment
MIL-STD-883 Meth 2015 Solv. 1,3,4
JESD22-A114F Class 1; 10* 800V
Level 1 JESD22-A113-B
100% ROHS Compliant
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Typical Performance
Performance
Phase Noise
Specifications (Continued)
VS-701 @ 1.265GHz Sinewave
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Outline Drawing / Enclosure
Package Codes
Code
G352
G356
Height “H”
2.5
2.5
Pin Length “L”
N/A
N/A
Dimensions in mm
Pin Assignment Sinewave (G352)
1
2
3
4
Control Voltage (V
C
)
GND
RF-Out
Supply Voltage Input (V
S
)
1
2
3
4
5
6
Pin Assignment LVPECL (G356)
Control Voltage (V
C
)
Enable
GND
RF-Out
RF-Out_complementary
Supply Voltage Input (V
S
)
Marking
VS-701-xxxx
Frequency
•AYYWW
Enable true table (optional)
LVPECL
Pin 2
High
Open
Low
Pin 4
Data
Data
No Data
Pin 5
Compl. Data
Compl. Data
No Data
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Standard Shipping Method
K
1.75±0.1
Position in tape
Pin1
A
4.0
XXXXX
XXXXX
Unwinding direction
B
B
cross-section
A-A
R
0.7
5
A
A
±0.05
P
0.2
0
if W < 32mm only upper hole line existent
cross-section
B-B
Dimension in mm:
A, B and K are dependent uppon component dimensions
production tolerance complying DIN IEC 286-3
All dimensions in millimeters unless otherwise stated
Enclosure Type
G352 / G356
Tape Width W (mm)
24
Quantity per meter
Quantity per reel
750
W
B
Dimension P (mm)
12
Recommended Reflow Profile
TP: max 250°C (@ solder joint,
customer board level)
T
p
: max: 10…30 sec
Additional Information:
This SMD oscillator has been
designed for pick and place reflow
soldering
SMD oscillators must be on the top
side of the PCB during the reflow
process.
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