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24AA64-I/PG: 产品描述eeprom 8kx8 - 1.8V lead free package; 产品类别存储存储; 文件大小352KB，共26页; 制造商Microchip(微芯科技); 官网地址https://www.microchip.com; 标准

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24AA64-I/PG概述

eeprom 8kx8 - 1.8V lead free package

24AA64-I/PG规格参数

参数名称	属性值
是否无铅	不含铅
是否Rohs认证	符合
零件包装代码	DIP
包装说明	0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8
针数	8
Reach Compliance Code	compli
ECCN代码	EAR99
最大时钟频率 (fCLK)	0.4 MHz
数据保留时间-最小值	200
耐久性	1000000 Write/Erase Cycles
I2C控制字节	1010DDDR
JESD-30 代码	R-PDIP-T8
JESD-609代码	e3
长度	9.271 mm
内存密度	65536 bi
内存集成电路类型	EEPROM
内存宽度	8
功能数量	1
端子数量	8
字数	8192 words
字数代码	8000
工作模式	SYNCHRONOUS
最高工作温度	85 °C
最低工作温度	-40 °C
组织	8KX8
封装主体材料	PLASTIC/EPOXY
封装代码	DIP
封装等效代码	DIP8,.3
封装形状	RECTANGULAR
封装形式	IN-LINE
并行/串行	SERIAL
峰值回流温度（摄氏度）	NOT SPECIFIED
电源	2/5 V
认证状态	Not Qualified
座面最大高度	5.334 mm
串行总线类型	I2C
最大待机电流	0.000001 A
最大压摆率	0.003 mA
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	1.7 V
标称供电电压 (Vsup)	2.5 V
表面贴装	NO
技术	CMOS
温度等级	INDUSTRIAL
端子面层	Matte Tin (Sn)
端子形式	THROUGH-HOLE
端子节距	2.54 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED
宽度	7.62 mm
最长写入周期时间 (tWC)	5 ms
写保护	HARDWARE
Base Number Matches	1

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24AA64/24LC64

64K I

™

Serial EEPROM

Device Selection Table

Part

Number

24AA64

24LC64

Range

1.8-5.5

2.5-5.5

Max Clock

Frequency

400 kHz

(1)

400 kHz

Temp

Ranges

I, E

Description

The Microchip Technology Inc. 24AA64/24LC64

(24XX64*) is a 64 Kbit Electrically Erasable PROM.

The device is organized as eight blocks of 1K x 8-bit

memory with a 2-wire serial interface. Low-voltage

design permits operation down to 1.8V, with standby

and active currents of only 1

µA

and 1 mA,

respectively. It has been developed for advanced, low-

power applications such as personal communications

or data acquisition. The 24XX64 also has a page write

capability for up to 32 bytes of data. Functional address

lines allow up to eight devices on the same bus, for up

to 512 Kbits address space. The 24XX64 is available in

the standard 8-pin PDIP, surface mount SOIC, TSSOP

and MSOP packages.

Note 1:

100 kHz for V

<2.5V

Features

• Single supply with operation down to 1.8V

• Low-power CMOS technology

- 1 mA active current typical

- 1

µA

standby current (max.) (I-temp)

• Organized as 8 blocks of 8K bit (64K bit)

• 2-wire serial interface bus, I

C™ compatible

• Cascadable for up to eight devices

• Schmitt Trigger inputs for noise suppression

• Output slope control to eliminate ground bounce

• 100 kHz (24AA64) and 400 kHz (24LC64)

compatibility

• Self-timed write cycle (including auto-erase)

• Page write buffer for up to 32 bytes

• 2 ms typical write cycle time for page write

• Hardware write-protect for entire memory

• Can be operated as a serial ROM

• Factory programming (QTP) available

• ESD protection > 4,000V

• 1,000,000 erase/write cycles

• Data retention > 200 years

• 8-lead PDIP, SOIC, TSSOP and MSOP packages

• Standard and Pb-free finishes available

• Available temperature ranges:

- Industrial (I): -40°C to +85°C

- Automotive (E): -40°C to +125°C

Package Types

PDIP/SOIC/TSSOP

/MSOP

A0 1

A1 2

A2 3

Vss 4

ROTATED TSSOP

(24AA64X/24LC64X)

8 Vcc

7 WP Vcc

6 SCL A0

5 SDA A1

24XX64X

Block Diagram

Generator

24XX64

SCL

SDA

Vss

I/O

Control

Logic

Memory

Control

Logic

XDEC

EEPROM

Array

Page

Latches

I/O

SDA

SCL

YDEC

Sense Amp.

R/W Control

* 24XX64 is used in this document as a generic part number for the 24AA64/24LC64 devices.



2003 Microchip Technology Inc.

DS21189H-page 1

24AA64-I/PG相似产品对比

	24AA64-I/PG	24LC64-E/SNG	24LC64T-E/SNG	24LC64T-I/MSG	24LC64T-I/SMG	24AA64T-I/MSG	24AA64-I/MSG	24AA64T-I/STG
描述	eeprom 8kx8 - 1.8V lead free package	eeprom 8kx8 - 2.5V lead free package	eeprom 8kx8 - 2.5V lead free package	eeprom 8kx8 - 2.5V lead free package	eeprom 8kx8 - 2.5V lead free package	eeprom 8kx8 - 1.8V lead free package	eeprom 8kx8 - 1.8V lead free package	eeprom 8kx8 - 1.8V lead free package
是否无铅	不含铅	不含铅	不含铅	不含铅	不含铅	不含铅	不含铅	不含铅
是否Rohs认证	符合	符合	符合	符合	符合	符合	符合	符合
零件包装代码	DIP	SOIC	SOIC	MSOP	SOIC	MSOP	MSOP	SOIC
包装说明	0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8	3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8	3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8	ROHS COMPLIANT, PLASTIC, MSOP-8	5.28 MM, ROHS COMPLIANT, PLASTIC, SOIJ-8	ROHS COMPLIANT, PLASTIC, MSOP-8	ROHS COMPLIANT, PLASTIC, MSOP-8	4.40 MM, ROHS COMPLIANT, PLASTIC, TSSOP-8
针数	8	8	8	8	8	8	8	8
Reach Compliance Code	compli	compli	compli	compli	compli	compli	compli	compli
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
最大时钟频率 (fCLK)	0.4 MHz	0.4 MHz	0.4 MHz	0.4 MHz	0.4 MHz	0.4 MHz	0.4 MHz	0.4 MHz
数据保留时间-最小值	200	200	200	200	200	200	200	200
耐久性	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles
I2C控制字节	1010DDDR	1010DDDR	1010DDDR	1010DDDR	1010DDDR	1010DDDR	1010DDDR	1010DDDR
JESD-30 代码	R-PDIP-T8	R-PDSO-G8	R-PDSO-G8	S-PDSO-G8	R-PDSO-G8	S-PDSO-G8	S-PDSO-G8	R-PDSO-G8
JESD-609代码	e3	e3	e3	e3	e3	e3	e3	e3
长度	9.271 mm	4.9 mm	4.9 mm	3 mm	5.245 mm	3 mm	3 mm	4.4 mm
内存密度	65536 bi	65536 bi	65536 bi	65536 bi	65536 bi	65536 bi	65536 bi	65536 bi
内存集成电路类型	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM
内存宽度	8	8	8	8	8	8	8	8
功能数量	1	1	1	1	1	1	1	1
端子数量	8	8	8	8	8	8	8	8
字数	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words
字数代码	8000	8000	8000	8000	8000	8000	8000	8000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	85 °C	125 °C	125 °C	85 °C	85 °C	85 °C	85 °C	85 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
组织	8KX8	8KX8	8KX8	8KX8	8KX8	8KX8	8KX8	8KX8
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	DIP	SOP	SOP	TSSOP	SOP	TSSOP	TSSOP	TSSOP
封装等效代码	DIP8,.3	SOP8,.25	SOP8,.25	TSSOP8,.19	SOP8,.3	TSSOP8,.19	TSSOP8,.19	TSSOP8,.25
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	SQUARE	SQUARE	RECTANGULAR
封装形式	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
并行/串行	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
峰值回流温度（摄氏度）	NOT SPECIFIED	260	260	260	260	260	260	260
电源	2/5 V	3/5 V	3/5 V	3/5 V	3/5 V	2/5 V	2/5 V	2/5 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	5.334 mm	1.75 mm	1.75 mm	1.1 mm	2.03 mm	1.1 mm	1.1 mm	1.2 mm
串行总线类型	I2C	I2C	I2C	I2C	I2C	I2C	I2C	I2C
最大待机电流	0.000001 A	0.000005 A	0.000005 A	0.000001 A	0.000001 A	0.000001 A	0.000001 A	0.000001 A
最大压摆率	0.003 mA	0.003 mA	0.003 mA	0.003 mA	0.003 mA	0.003 mA	0.003 mA	0.003 mA
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	1.7 V	2.5 V	2.5 V	2.5 V	2.5 V	1.7 V	1.7 V	1.7 V
标称供电电压 (Vsup)	2.5 V	5 V	5 V	5 V	5 V	2.5 V	2.5 V	2.5 V
表面贴装	NO	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	AUTOMOTIVE	AUTOMOTIVE	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子面层	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)
端子形式	THROUGH-HOLE	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
端子节距	2.54 mm	1.27 mm	1.27 mm	0.65 mm	1.27 mm	0.65 mm	0.65 mm	0.65 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED	40	40	40	40	40	40	40
宽度	7.62 mm	3.9 mm	3.9 mm	3 mm	5.23 mm	3 mm	3 mm	3 mm
最长写入周期时间 (tWC)	5 ms	5 ms	5 ms	5 ms	5 ms	5 ms	5 ms	5 ms
写保护	HARDWARE	HARDWARE	HARDWARE	HARDWARE	HARDWARE	HARDWARE	HARDWARE	HARDWARE
Base Number Matches	1	1	1	1	1	1	1	1
湿度敏感等级	-	1	1	1	1	1	1	1

24AA64-I/PG

24AA64-I/PG概述

24AA64-I/PG规格参数

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24AA64-I/PG相似产品对比

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