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24AA02T-I/SNG: 产品描述eeprom 256x8 - 1.8V lead free package; 产品类别存储存储; 文件大小338KB，共24页; 制造商Microchip(微芯科技); 官网地址https://www.microchip.com; 标准

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24AA02T-I/SNG概述

eeprom 256x8 - 1.8V lead free package

24AA02T-I/SNG规格参数

参数名称	属性值
是否无铅	不含铅
是否Rohs认证	符合
零件包装代码	SOIC
包装说明	3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8
针数	8
Reach Compliance Code	compli
ECCN代码	EAR99
最大时钟频率 (fCLK)	0.1 MHz
数据保留时间-最小值	200
耐久性	1000000 Write/Erase Cycles
I2C控制字节	1010XXXR
JESD-30 代码	R-PDSO-G8
JESD-609代码	e3
长度	4.9 mm
内存密度	2048 bi
内存集成电路类型	EEPROM
内存宽度	8
湿度敏感等级	1
功能数量	1
端子数量	8
字数	256 words
字数代码	256
工作模式	SYNCHRONOUS
最高工作温度	85 °C
最低工作温度	-40 °C
组织	256X8
封装主体材料	PLASTIC/EPOXY
封装代码	SOP
封装等效代码	SOP8,.25
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE
并行/串行	SERIAL
峰值回流温度（摄氏度）	260
电源	2/5 V
认证状态	Not Qualified
座面最大高度	1.75 mm
串行总线类型	I2C
最大待机电流	0.000001 A
最大压摆率	0.003 mA
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	1.7 V
标称供电电压 (Vsup)	2.5 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子面层	Matte Tin (Sn)
端子形式	GULL WING
端子节距	1.27 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	40
宽度	3.9 mm
最长写入周期时间 (tWC)	5 ms
写保护	HARDWARE
Base Number Matches	1

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24AA02/24LC02B

2K I

™

Serial EEPROM

Device Selection Table

Part

Number

24AA02

24LC02B

Note 1:

Range

1.8-5.5

2.5-5.5

Max Clock

Frequency

400 kHz

(1)

400 kHz

Temp

Ranges

I, E

Description

The Microchip Technology Inc. 24AA02/24LC02B

(24XX02*) is a 2 Kbit Electrically Erasable PROM. The

device is organized as one block of 256 x 8-bit memory

with a 2-wire serial interface. Low-voltage design

permits operation down to 1.8V, with standby and

active currents of only 1

µA

and 1 mA, respectively.

The 24XX02 also has a page write capability for up to

8 bytes of data. The 24XX02 is available in the

standard 8-pin PDIP, surface mount SOIC, TSSOP and

MSOP packages and is also available in the 5-lead

SOT-23 package.

100 kHz for V

<2.5V

Features

• Single supply with operation down to 1.8V

• Low-power CMOS technology

- 1 mA active current typical

- 1

µA

standby current typical (I-temp)

• Organized as 1 block of 256 bytes (1 x 256 x 8)

• 2-wire serial interface bus, I

C™ compatible

• Schmitt Trigger inputs for noise suppression

• Output slope control to eliminate ground bounce

• 100 kHz (24AA02) and 400 kHz (24LC02B)

compatibility

• Self-timed write cycle (including auto-erase)

• Page write buffer for up to 8 bytes

• 2 ms typical write cycle time for page write

• Hardware write-protect for entire memory

• Can be operated as a serial ROM

• Factory programming (QTP) available

• ESD protection > 4,000V

• 1,000,000 erase/write cycles

• Data retention > 200 years

• 8-lead PDIP, SOIC, TSSOP and MSOP packages

• 5-lead SOT-23 package

• Pb-free finish available

• Available for extended temperature ranges:

- Industrial (I): -40°C to +85°C

- Automotive (E): -40°C to +125°C

Package Types

PDIP/SOIC/TSSOP/MSOP

Vss

Vcc

SCL

Vss

SDA SDA

SCL

24XX02

SOT-23-5

24XX02

Vcc

Note:

Pins A0, A1 and A2 are not used by the

24XX02. (No internal connections).

Block Diagram

Generator

I/O

Control

Logic

Memory

Control

Logic

XDEC

EEPROM

Array

Page

Latches

I/O

SDA

SCL

YDEC

Sense Amp.

R/W Control



2003 Microchip Technology Inc.

DS21709C-page 1

24AA02T-I/SNG相似产品对比

	24AA02T-I/SNG	24LC02BT-I/MSG	24AA02-I/MSG	24AA02-I/STG	24AA02-I/PG	24AA02T-I/STG	24LC02BT-I/STG	24LC02B-I/STG
描述	eeprom 256x8 - 1.8V lead free package	eeprom 256x8 - 1.8V lead free package	eeprom 256x8 - 1.8V lead free package	eeprom 256x8 - 1.8V lead free package	eeprom 256x8 - 1.8V lead free package	eeprom 256x8 - 1.8V lead free package	eeprom 256x8 - 1.8V lead free package	eeprom 256x8 - 1.8V lead free package
是否无铅	不含铅	不含铅	不含铅	不含铅	不含铅	不含铅	不含铅	不含铅
是否Rohs认证	符合	符合	符合	符合	符合	符合	符合	符合
零件包装代码	SOIC	MSOP	MSOP	SOIC	DIP	SOIC	SOIC	SOIC
包装说明	3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8	ROHS COMPLIANT, PLASTIC, MSOP-8	ROHS COMPLIANT, PLASTIC, MSOP-8	4.40 MM, ROHS COMPLIANT, PLASTIC, TSSOP-8	0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8	4.40 MM, ROHS COMPLIANT, PLASTIC, TSSOP-8	4.40 MM, ROHS COMPLIANT, PLASTIC, TSSOP-8	4.40 MM, ROHS COMPLIANT, PLASTIC, TSSOP-8
针数	8	8	8	8	8	8	8	8
Reach Compliance Code	compli	compli	compli	compli	compli	compli	compli	compli
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
最大时钟频率 (fCLK)	0.1 MHz	0.4 MHz	0.1 MHz	0.1 MHz	0.1 MHz	0.1 MHz	0.4 MHz	0.4 MHz
数据保留时间-最小值	200	200	200	200	200	200	200	200
耐久性	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles
I2C控制字节	1010XXXR	1010XXXR	1010XXXR	1010XXXR	1010XXXR	1010XXXR	1010XXXR	1010XXXR
JESD-30 代码	R-PDSO-G8	S-PDSO-G8	S-PDSO-G8	R-PDSO-G8	R-PDIP-T8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8
JESD-609代码	e3	e3	e3	e3	e3	e3	e3	e3
长度	4.9 mm	3 mm	3 mm	4.4 mm	9.27 mm	4.4 mm	4.4 mm	4.4 mm
内存密度	2048 bi	2048 bi	2048 bi	2048 bi	2048 bi	2048 bi	2048 bi	2048 bi
内存集成电路类型	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM
内存宽度	8	8	8	8	8	8	8	8
功能数量	1	1	1	1	1	1	1	1
端子数量	8	8	8	8	8	8	8	8
字数	256 words	256 words	256 words	256 words	256 words	256 words	256 words	256 words
字数代码	256	256	256	256	256	256	256	256
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
组织	256X8	256X8	256X8	256X8	256X8	256X8	256X8	256X8
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	SOP	TSSOP	TSSOP	TSSOP	DIP	TSSOP	TSSOP	TSSOP
封装等效代码	SOP8,.25	TSSOP8,.19	TSSOP8,.19	TSSOP8,.25	DIP8,.3	TSSOP8,.25	TSSOP8,.25	TSSOP8,.25
封装形状	RECTANGULAR	SQUARE	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	IN-LINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
并行/串行	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
峰值回流温度（摄氏度）	260	260	260	260	NOT SPECIFIED	260	260	260
电源	2/5 V	3/5 V	2/5 V	2/5 V	2/5 V	2/5 V	3/5 V	3/5 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.75 mm	1.1 mm	1.1 mm	1.1 mm	5.334 mm	1.1 mm	1.1 mm	1.1 mm
串行总线类型	I2C	I2C	I2C	I2C	I2C	I2C	I2C	I2C
最大待机电流	0.000001 A	0.000001 A	0.000001 A	0.000001 A	0.000001 A	0.000001 A	0.000001 A	0.000001 A
最大压摆率	0.003 mA	0.003 mA	0.003 mA	0.003 mA	0.003 mA	0.003 mA	0.003 mA	0.003 mA
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	1.7 V	2.5 V	1.7 V	1.7 V	1.7 V	1.7 V	2.5 V	2.5 V
标称供电电压 (Vsup)	2.5 V	5 V	2.5 V	2.5 V	2.5 V	2.5 V	5 V	5 V
表面贴装	YES	YES	YES	YES	NO	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子面层	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)
端子形式	GULL WING	GULL WING	GULL WING	GULL WING	THROUGH-HOLE	GULL WING	GULL WING	GULL WING
端子节距	1.27 mm	0.65 mm	0.65 mm	0.65 mm	2.54 mm	0.65 mm	0.65 mm	0.65 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
处于峰值回流温度下的最长时间	40	40	40	40	NOT SPECIFIED	40	40	40
宽度	3.9 mm	3 mm	3 mm	3 mm	7.62 mm	3 mm	3 mm	3 mm
最长写入周期时间 (tWC)	5 ms	5 ms	5 ms	5 ms	5 ms	5 ms	5 ms	5 ms
写保护	HARDWARE	HARDWARE	HARDWARE	HARDWARE	HARDWARE	HARDWARE	HARDWARE	HARDWARE
Base Number Matches	1	1	1	1	1	1	1	1
湿度敏感等级	1	1	1	1	-	1	1	1

24AA02T-I/SNG

24AA02T-I/SNG概述

24AA02T-I/SNG规格参数

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