eeprom 512x8 - 1.8V
| 参数名称 | 属性值 |
| 厂商名称 | Microchip(微芯科技) |
| 产品种类 | EEPROM |
| RoHS | 是 |
| 存储容量 | 4 Kbi |
| 组织 | 2Block x 256 x 8 |
| 接口类型 | I2C |
| 最大时钟频率 | 0.4 MHz |
| 访问时间 | 900 ns |
| 电源电压（最大值） | 5.5 V |
| 电源电压（最小值） | 1.7 V |
| 最大工作电流 | 5 mA |
| 最大工作温度 | + 85 C |
| 安装风格 | SMD/SMT |
| 封装 / 箱体 | TSSOP-8 |
| 封装 | Tube |
| 最小工作温度 | - 40 C |
| 工作电源电压 | 1.8 V to 5.5 V |
| 工作温度 | - 65 C to + 150 C |
| 24AA04/ST | 24AA04T-I/MSG | 24LC04BT-I/MSG | 24AA04-I/STG | 24LC04BT-I/OTG | 24AA04-I/MSG | 24AA04T-I/STG | 24AA04T-I/SNG | 24AA04SC-I/S16K | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | eeprom 512x8 - 1.8V | eeprom 512x8 - 1.8V lead free package | eeprom 512x8 - 2.5V lead free package | eeprom 512x8 - 1.8V lead free package | eeprom 512x8 - 2.5V lead free package | eeprom 512x8 - 1.8V lead free package | eeprom 512x8 - 1.8V lead free package | eeprom 512x8 - 1.8V lead free package | 电可擦除可编程只读存储器 4K I2C SMARTCARD EE DIE IN WAFFLE PACK |
| 组织 | 2Block x 256 x 8 | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 | 256 x 8 |
| 是否无铅 | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - |
| 是否Rohs认证 | - | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | - |
| 零件包装代码 | - | MSOP | MSOP | SOIC | SOT-23 | MSOP | SOIC | SOIC | - |
| 包装说明 | - | TSSOP, TSSOP8,.19 | TSSOP, TSSOP8,.19 | TSSOP, TSSOP8,.25 | LSSOP, TSOP5/6,.11,37 | TSSOP, TSSOP8,.19 | TSSOP, TSSOP8,.25 | SOP, SOP8,.25 | - |
| 针数 | - | 8 | 8 | 8 | 5 | 8 | 8 | 8 | - |
| Reach Compliance Code | - | compli | compli | compli | compli | compli | compli | compli | - |
| ECCN代码 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - |
| 最大时钟频率 (fCLK) | - | 0.1 MHz | 0.4 MHz | 0.1 MHz | 0.4 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz | - |
| 数据保留时间-最小值 | - | 200 | 200 | 200 | 200 | 200 | 200 | 200 | - |
| 耐久性 | - | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | - |
| I2C控制字节 | - | 1010XXMR | 1010XXMR | 1010XXMR | 1010XXMR | 1010XXMR | 1010XXMR | 1010XXMR | - |
| JESD-30 代码 | - | S-PDSO-G8 | S-PDSO-G8 | R-PDSO-G8 | R-PDSO-G5 | S-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | - |
| JESD-609代码 | - | e3 | e3 | e3 | e3 | e3 | e3 | e3 | - |
| 长度 | - | 3 mm | 3 mm | 4.4 mm | 2.9 mm | 3 mm | 4.4 mm | 4.9 mm | - |
| 内存密度 | - | 4096 bi | 4096 bi | 4096 bi | 4096 bi | 4096 bi | 4096 bi | 4096 bi | - |
| 内存集成电路类型 | - | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | - |
| 内存宽度 | - | 8 | 8 | 8 | 8 | 8 | 8 | 8 | - |
| 湿度敏感等级 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
| 功能数量 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
| 端子数量 | - | 8 | 8 | 5 | 5 | 8 | 5 | 5 | - |
| 字数 | - | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words | - |
| 字数代码 | - | 512 | 512 | 512 | 512 | 512 | 512 | 512 | - |
| 工作模式 | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - |
| 最高工作温度 | - | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | - |
| 最低工作温度 | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | - | TSSOP | TSSOP | TSSOP | LSSOP | TSSOP | TSSOP | SOP | - |
| 封装等效代码 | - | TSSOP8,.19 | TSSOP8,.19 | TSSOP8,.25 | TSOP5/6,.11,37 | TSSOP8,.19 | TSSOP8,.25 | SOP8,.25 | - |
| 封装形状 | - | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | - |
| 并行/串行 | - | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | - |
| 峰值回流温度（摄氏度） | - | 260 | 260 | 260 | 260 | 260 | 260 | 260 | - |
| 电源 | - | 2/5 V | 3/5 V | 2/5 V | 3/5 V | 2/5 V | 2/5 V | 2/5 V | - |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 反向引出线 | - | NO | NO | NO | NO | NO | NO | NO | - |
| 座面最大高度 | - | 1.1 mm | 1.1 mm | 1.2 mm | 1.45 mm | 1.1 mm | 1.2 mm | 1.75 mm | - |
| 串行总线类型 | - | I2C | I2C | I2C | I2C | I2C | I2C | I2C | - |
| 最大待机电流 | - | 0.000001 A | 0.000005 A | 0.000001 A | 0.000005 A | 0.000001 A | 0.000001 A | 0.000001 A | - |
| 最大压摆率 | - | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | - |
| 最大供电电压 (Vsup) | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - |
| 最小供电电压 (Vsup) | - | 1.7 V | 2.5 V | 1.7 V | 2.5 V | 1.7 V | 1.7 V | 1.7 V | - |
| 表面贴装 | - | YES | YES | YES | YES | YES | YES | YES | - |
| 技术 | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - |
| 温度等级 | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - |
| 端子面层 | - | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | - |
| 端子形式 | - | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | - |
| 端子节距 | - | 0.65 mm | 0.65 mm | 0.65 mm | 0.95 mm | 0.65 mm | 0.65 mm | 1.27 mm | - |
| 端子位置 | - | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | - |
| 处于峰值回流温度下的最长时间 | - | 40 | 40 | 40 | 40 | 40 | 40 | 40 | - |
| 宽度 | - | 3 mm | 3 mm | 3 mm | 1.55 mm | 3 mm | 3 mm | 3.9 mm | - |
| 最长写入周期时间 (tWC) | - | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | - |
| 写保护 | - | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE | - |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
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