Amplifier. A Darlington configuration featuring 1 micron emitters
provides high F
T
and excellent thermal perfomance. The
heterojunction increases breakdown voltage and minimizes
leakage current between junctions. Cancellation of emitter
junction non-linearities results in higher suppression of
intermodulation products. Only 2 DC-blocking capacitors, a
bias resistor and an optional RF choke are required for
operation.
The matte tin finish on Sirenza’s lead-free package utilizes a
post annealing process to mitigate tin whisker formation and
is RoHS compliant per EU Directive 2002/95. This package
is also manufactured with green molding compounds that
contain no antimony trioxide nor halogenated fire retardants.
Gain & Return Loss vs. Frequency
V
D
= 5.1 V, I
D
= 75 mA (Typ.)
SGA-6489
SGA-6489Z
Pb
RoHS Compliant
&
Green
Package
DC-3500 MHz, Cascadable
SiGe HBT MMIC Amplifier
Product Features
•
Now available in Lead Free, RoHS
Compliant, & Green Packaging
• High Gain : 17.5 dB at 1950 MHz
• Cascadable 50 Ohm
• Operates From Single Supply
• Low Thermal Resistance Package
24
GAIN
0
Gain (dB)
ORL
Return Loss (dB)
18
-10
Applications
•
PA Driver Amplifier
12
IRL
-20
6
-30
• Cellular, PCS, GSM, UMTS
• IF Amplifier
• Wireless Data, Satellite
0
0
1
2
3
Frequency (GHz)
4
5
-40
Sym bol
G
P aram eter
S m a ll S ig na l G a in
U n its
dB
Frequency
8 5 0 M Hz
1 9 5 0 M Hz
2 4 0 0 M Hz
8 5 0 M Hz
1 9 5 0 M Hz
8 5 0 M Hz
1 9 5 0 M Hz
M in .
1 8 .4
Typ.
2 0 .1
1 7 .5
1 6 .5
2 0 .7
1 8 .7
3 4 .0
3 2 .0
3500
M ax.
2 2 .4
P
1dB
O IP
3
B a nd w id th
O utp ut P o w e r a t 1 d B C o m p r e s s io n
O utp ut T hir d O r d e r Inte r c e p t P o int
D e t e r m ine d b y R e t ur n L o s s ( > 1 0 d B )
Inp ut R e tur n L o s s
O utp ut R e tur n L o s s
No is e F ig ur e
D e vic e O p e r a ting Vo lta g e
D e vic e O p e r a ting C ur r e nt
T he r m a l R e s is ta nc e ( junc tio n to le a d )
V
S
= 8 V
R
BIAS
= 39 Ohms
dBm
dBm
M Hz
dB
dB
dB
V
mA
° C /W
IR L
O RL
NF
V
D
I
D
R
T H
, j- l
1 9 5 0 M Hz
1 9 5 0 M Hz
1 9 5 0 M Hz
4 .7
67
1 4 .4
1 0 .9
3 .0
5 .1
75
97
5 .5
83
Test Conditions:
I
D
= 75 mA Typ.
T
L
= 25ºC
OIP
3
Tone Spacing = 1 MHz, Pout per tone = 0 dBm
Z
S
= Z
L
= 50 Ohms
The information provided herein is believed to be reliable at press time. Sirenza Microdevices assumes no responsibility for inaccuracies or omissions. Sirenza Microdevices assumes no responsibility for the use of this
information, and all such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or
granted to any third party. Sirenza Microdevices does not authorize or warrant any Sirenza Microdevices product for use in life-support devices and/or systems. Copyright 2001 Sirenza Microdevices, Inc.. All worldwide rights
303 Technology Court, Broomfield, CO 80021
Phone: (800) SMI-MMIC
1
http://www.sirenza.com
EDS-100621 Rev. G
SGA-6489 DC-3500 GHz Cascadable MMIC Amplifier
Preliminary
Typical RF Performance at Key Operating Frequencies
Frequency
Frequency (MHz)
Frequency (MHz)(MHz)
Symbol
Parameter
Unit
100
500
850
1950
2400
3500
G
OIP
3
P
1dB
IRL
ORL
S
12
NF
Small Signal Gain
Output Third Order Intercept Point
Output Power at 1dB Compression
Input Return Loss
Output Return Loss
Reverse Isolation
Noise Figure
dB
dBm
dBm
dB
dB
dB
dB
21.0
35.0
20.6
29.4
18.7
23.9
3.2
20.8
34.5
20.9
30.8
16.3
23.8
2.8
20.1
34.0
20.7
24.7
14.6
23.9
2.7
17.5
32.0
18.7
14.4
10.9
22.2
3.0
16.5
30.1
17.4
12.5
10.9
21.4
3.4
14.0
25.0
14.0
10.8
10.0
19.3
4.4
V
S
= 8 V
Test Conditions:
V
S
= 8 V
Test Conditions:
R
BIAS
= 39 Ohms
R
BIAS
= 39 Ohms
= 75 mA Typ.
II
D
= 80 mA Typ.
D
T = 25ºC
T
LL
= 25ºC
OIP Tone Spacing = 1 MHz, Pout per tone = 0 dBm
OIP
33
Tone Spacing = 1 MHz, Pout per tone = 0 dBm
Z
S
= Z = 50 Ohms
Z
S
= Z
LL
= 50 Ohms
Absolute Maximum Ratings
Noise Figure vs. Frequency
V
D
=5.1 V, I
D
= 75 mA
5
Noise Figure (dB)
4
3
2
1
0
0
1
2
Frequency (GHz)
3
4
P a ra m e te r
M a x.
D e vice C urre nt
(I
D
)
M a x.
D e vice
Vo lta g e (V
D
)
M a x.
RF Inp ut P o we r
M a x.
Junctio n Te m p
. (T
J
)
O p e ra ting Te m p
. Ra ng e (T
L
)
Ab s o lu te L im it
150 mA
7 V
+1 8 d B m
+1 5 0 °C
-4 0 °C to +8 5 °C
+1 5 0 °C
M a x.
Sto ra g e Te m p
.
T
L
=+25ºC
O p e ra tio n o f this d e vice b e yo nd a ny o ne o f the se lim its m a y
ca use p e rm a ne nt d a m a g e . F o r re lia b le co ntino us o p e ra tio n,
the d e vice vo lta g e a nd curre nt m ust no t e xce e d the m a xim um
o p e ra ting va lue s sp e cifie d in the ta b le o n p a g e o ne .
B ia s C o nd itio ns sho uld a lso sa tisfy the fo llo wing e xp re ssio n:
I
D
V
D
< (T
J
- T
L
) / R
TH
, j-l
Ta ke into a cco unt o ut o f b a nd V S W R p re se nte d b y d e vice s
such a s S AW filte rs to d e te rm ine m a xim um RF inp ut p o we r.
Re fle cte d ha rm o nic le ve ls in sa tura tio n a re sig nifica nt.
OIP
3
vs. Frequency
V
D
= 5.1 V, I
D
= 75 mA
40
36
OIP
3
(dBm)
32
28
+25°C
P
1dB
vs. Frequency
V
D
= 5.1 V, I
D
= 75 mA
22
20
P
1dB
(dBm)
18
16
+25°C
24
20
0.0
0.5
T
L
-40°C
+85°C
14
12
T
L
0.0
0.5
1.0
-40°C
+85°C
1.0
1.5
2.0
2.5
3.0
3.5
1.5
2.0
2.5
3.0
3.5
Frequency (GHz)
Frequency (GHz)
303 Technology Court, Broomfield, CO 80021
Phone: (800) SMI-MMIC
2
http://www.sirenza.com
EDS-100621 Rev. G
SGA-6489 DC-3500 GHz Cascadable MMIC Amplifier
Preliminary
|
S
|
vs. Frequency
21
|
S
|
vs. Frequency
11
24
18
|S
21
| (dB)
V
D
= 5.1 V, I
D
= 75 mA
0
-10
|S
11
| (dB)
V
D
= 5.1 V, I
D
= 75 mA
12
6
-20
-30
T
L
0
0
1
2
3
4
Frequency (GHz)
5
+25°C
-40°C
+85°C
T
L
-40
6
+25°C
-40°C
+85°C
0
1
2
3
Frequency (GHz)
4
5
|
S
|
vs. Frequency
12
|
S
|
vs. Frequency
22
-12
-15
-18
-21
-24
-27
0
1
V
D
= 5.1 V, I
D
= 75 mA
0
-10
|S
22
| (dB)
V
D
= 5.1 V, I
D
= 75 mA
|S
12
| (dB)
-20
-30
T
L
2
3
Frequency (GHz)
4
+25°C
-40°C
+85°C
T
L
-40
5
+25°C
-40°C
+85°C
0
1
2
3
Frequency (GHz)
4
5
V
D
vs. I
D
over Temperature for fixed
V
S
= 8 V, R
BIAS
= 39 ohms *
90
85
80
I
D
(mA)
75
70
65
60
4.7
4.9
5.1
V
D
(Volts)
5.3
5.5
+25°C
+85°C
V
D
vs. Temperature for Constant I
D
= 75 mA
5.7
5.5
V
D
(Volts)
5.3
5.1
4.9
4.7
-40
-15
10
35
Temperature(°C)
60
85
-40°C
* Note: In the applications circuit on page 4, R
BIAS
compensates for voltage and current variation over temperature.
303 Technology Court, Broomfield, CO 80021
Phone: (800) SMI-MMIC
3
http://www.sirenza.com
EDS-100621 Rev. G
SGA-6489 DC-3500 GHz Cascadable MMIC Amplifier
Preliminary
Basic Application Circuit
R
BIAS
1 uF
1000
pF
Application Circuit Element Values
Frequency (Mhz)
Reference
Designator
500
850
1950
2400
3500
V
S
C
D
L
C
C
B
C
D
L
C
220 pF
100 pF
68 nH
100 pF
68 pF
33 nH
68 pF
22 pF
22 nH
56 pF
22 pF
18 nH
39 pF
15 pF
15 nH
RF in
C
B
4
1
SGA-6489
3
2
C
B
RF out
Recommended Bias Resistor Values for I
D
=75mA
R
BIAS
=( V
S
-V
D
) / I
D
Supply Voltage(V
S
)
R
BIAS
6V
12
8V
39
10 V
62
12 V
91
V
S
R
BIAS
Note: R
BIAS
provides DC bias stability over temperature.
1 uF
1000 pF
Mounting Instructions
1. Solder the copper pad on the backside of the
device package to the ground plane.
2. Use a large ground pad area with many plated
through-holes as shown.
3. We recommend 1 or 2 ounce copper. Measurement
for this data sheet were made on a 31 mil thick FR-4
board with 1 ounce copper on both sides.
A64
L
C
C
D
C
B
C
B
Pin # Function
Description
RF input pin. This pin requires the use of an
external DC blocking capacitor chosen for
the frequency of operation.
Connection to ground. For optimum RF
performance, use via holes as close to
ground leads as possible to reduce lead
inductance.
Part Identification Marking
4
4
1
RF IN
A64
2
A64Z
3
2, 4
3
GND
1
2
3
1
1
2
2
3
1
3
RF OUT/ RF output and bias pin. DC voltage is
BIAS present on this pin, therefore a DC blocking
capacitor is necessary for proper operation.
Caution: ESD sensitive
Appropriate precautions in handling, packaging
and testing devices must be observed.
Part Number Ordering Information
Part Number
Reel Size
Devices/Reel
SGA-6489
SGA-6489Z
13"
13"
3000
3000
303 Technology Court, Broomfield, CO 80021
Phone: (800) SMI-MMIC
4
http://www.sirenza.com
EDS-100621 Rev. G
SGA-6489 DC-3500 GHz Cascadable MMIC Amplifier
Suggested PCB Pad Layout
Dimensions in inches [millimeters]
Preliminary
Nominal Package Dimensions
Package Type: SOT- 89
Dimensions in inches (millimeters)
Refer to package drawing posted at www.sirenza.com for tolerances
卡巴斯基的安全研究人员称其发现了如何攻击Intel微处理器的远程攻击代码，据传，这一代码可以通过TCP/IP包和JavaScript代码到达用户系统。 目前受影响的系统包括Windows XP，Vista，Windows Server 2003，Windows Server 2008，Linux甚至是BSD和Mac。但所幸大多数错误可以由Intel和BIOS厂商联合进行修复。 卡...[详细]
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