1, 2 and 3 Axis Magnetic Sensors
HMC1051/HMC1052L/HMC1053
The Honeywell HMC1051Z, HMC1051ZL, HMC1052L and
HMC1053 are magnetoresistive sensors designed for low
field magnetic sensing. Various packaging options have
been created from the basic HMC1052 sensor chip to
create 1, 2 and 3-axis magneto-resistive sensors for cost
effective and small size solutions. The advantage of the
HMC105X family of sensors is in the near-perfectly
orthogonal dual sensor on a single chip with shared
set/reset and offset coils/straps included.
The HMC105X family utilizes Honeywell’s Anisotropic
Magnetoresistive
(AMR)
technology
that
provides
advantages over coil based magnetic sensors. They are
extremely sensitive, low field, solid-state magnetic sensors
designed to measure direction and magnitude of Earth’s magnetic fields, from 120 micro-gauss to 6 gauss. Honeywell’s
Magnetic Sensors are among the most sensitive and reliable low-field sensors in the industry.
HMC105X family of sensors include low cost Compassing, Magnetometry, and Current Sensing.
Applications for the
Honeywell continues to maintain product excellence and performance by introducing innovative solid-state magnetic
sensor solutions. These are highly reliable, top performance products that are delivered when promised. Honeywell’s
magnetic sensor solutions provide real solutions you can count on.
FEATURES
Miniature Surface-Mount Packages
Leaded and Leadless Packages
Low Voltage Operations (1.8V)
Low Cost
Tape & Reel Packaging Options
4-Element Wheatstone Bridge
Wide Magnetic Field Range (+/-6 Oe)
Patented Offset and Set/Reset Straps
BENEFITS
Small Sizes for Compact Applications
Compatible with High Speed SMT Assembly and Prototyping
Compatible for Battery Powered Applications
Designed for High Volume, Cost Effective OEM Designs
High Volume OEM Assembly
Low Noise Passive Element Design
Sensor Can Be Used in Strong Magnetic Field Environments
Stray Magnetic Field Compensation
HMC1051/HMC1052/HMC1053
SPECIFICATIONS
Characteristics
Bridge Elements
Supply
Resistance
Operating Temperature
Storage Temperature
Humidity
Field Range
Linearity Error
Vbridge referenced to GND
Bridge current = 10mA
Ambient
Ambient, unbiased
Tested at 85°C
Full scale (FS) – total applied field
Best fit straight line
± 1 gauss
± 3 gauss
± 6 gauss
3 sweeps across ±3 gauss
3 sweeps across ±3 gauss
Offset = (OUT+) – (OUT-)
Field = 0 gauss after Set pulse
Set/Reset Current = 0.5A
@ 1kHz, Vbridge=5V
50Hz Bandwidth, Vbridge=5V
Magnetic signal (lower limit = DC)
Sensitivity starts to degrade.
Use S/R pulse to restore sensitivity.
T
A
= -40 to 125°C, Vbridge=5V
T
A
= -40 to 125°C, Ibridge=5mA
T
A
= -40 to 125°C, No Set/Reset
T
A
= -40 to 125°C, With Set/Reset
Vbridge=5V, T
A
= -40 to 125°C
Cross field = 1 gauss, Happlied = ±1 gauss
No perming effect on zero reading
T
A
= -40 to 125°C
(HMC1052 Only)
Sensitive direction in X and Y sensors
(HMC1052)
Measured from S/R+ to S/R-
0.1% duty cycle, or less, 2 sec current pulse
T
A
= -40 to 125°C
Measured from OFFSET+ to OFFSET-
DC Current
Field applied in sensitive direction
3500
3
0.4
3300
12
4.5
0.5
3700
15
10
3900
4300
95
100
2100
20
-3000
-2700
-600
± 500
± 10
2500
9
10000
105
0.01
2900
-2400
-1.25
0.8
-6
0.1
0.5
1.8
0.06
0.1
± 0.5
1.0
50
120
5
+1.25
1.2
1.8
800
-40
-55
3.0
1000
20
1500
125
150
85
+6
Volts
ohms
°C
°C
%
gauss
%FS
%FS
%FS
mV/V
mV/V/gauss
nV/sqrt Hz
gauss
MHz
gauss
ppm/°C
ppm/°C
ppm/°C
%FS
gauss
%
degree
Conditions*
Min
Typ
Max
Units
Hysteresis Error
Repeatability Error
Bridge Offset
Sensitivity
Noise Density
Resolution
Bandwidth
Disturbing Field
Sensitivity Tempco
Bridge Offset Tempco
Bridge Ohmic Tempco
Cross-Axis Effect
Max. Exposed
Field
Sensitivity Ratio of
X,Y Sensors
X,Y sensor
Orthogonality
Set/Reset Strap
Resistance
Current
Resistance Tempco
Offset Straps
Resistance
Offset
Constant
6
4
4100
18
ohms
Amp
ppm/°C
ohms
mA/gauss
ppm/°C
Resistance Tempco
T
A
= -40 to 125°C
* Tested at 25°C except stated otherwise.
2
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HMC1051/HMC1052/HMC1053
Product Handling and Mounting Guidelines
HMC1051ZL and HMC1053
HMC1051Z
HMC1052L
Moisture Sensitivity Level 3 with maximum reflow temp of 220°C
For mounting assistance reference document AN-216
Single Inline Package. Hand soldering recommended, follow MSL 1 handling
Moisture Sensitivity Level 1 with maximum reflow temp of 260°C
Compatible with most typical Pb-Free solder reflow profiles
PIN CONFIGURATIONS
(Arrow indicates direction of applied field that generates a positive output voltage after a SET pulse.)
HMC1051Z
Vcc
(3)
HMC1051Z Pinout
HMC1051
HONEYWELL
HMC1051Z
BRIDGE B
BRIDGE A
1 2 3 4 5 6 7 8
Vo+(A)
(2)
GND Plane
(4)
Vo-(A)
(8)
GND1(B) GND2(B)
(1)
(5)
Set/Reset Strap
S/R+
(6)
S/R-
(7)
HMC1051ZL
HMC1051ZL Pinout
8
VB
7
6
5
4
3
2
1
VO+ OFF+ GND VO- S/R- S/R+ OFF-
HMC1052L Pinout
BOTTOM VIEW
NC
OUT-
(B) S/R-
NC
HMC1052L
9
10
11
12
S/R+
GND2
(B)
OFF-
NC
8
7
6
5
B
13
14
A
15
16
GND1
(A)
OUT-
(A)
GND1
(B)
OUT+
(B)
4
3
2
1
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VB
OUT+ OFF+ GND2
(A)
(A)
3
HMC1051/HMC1052/HMC1053
HMC1053
HMC1053 Pinout
PACKAGE OUTLINES
PACKAGE DRAWING HMC1051Z (8-PIN SIP)
Symbol
A
A1
B
D
E
e
H
h
Millimeters
Min
Max
1.371
1.728
0.101
0.249
0.355
0.483
9.829
11.253
3.810
3.988
1.270 ref
6.850
7.300
0.381
0.762
Inches x 10E-3
Min
Max
54
68
4
10
14
19
387
443
150
157
50 ref
270
287
15
30
PACKAGE DRAWING HMC1051ZL (8-PIN IN-LINE LCC)
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HMC1051/HMC1052/HMC1053
PACKAGE DRAWING HMC1052L (16-PIN LCC)
Symbol
A
A1
A3
b
D
D2
E
E2
e
L
N
ND
NE
r
aaa
bbb
ccc
min
0.80
0
Millimeters
max
1.00
0.05
0.20 REF
0.18
3.00 BSC
1.55
3.00 BSC
1.55
0.50 BSC
0.30
16
4
4
B(min)/2
0.15
0.10
0.10
0.30
1.80
1.80
0.50
PACKAGE DRAWING HMC1053 (16-PIN LCC)
STENCIL DESIGN AND SOLDER PASTE
A 4 mil stencil and 100% paste coverage is recommended for the electrical contact pads.
REFLOW AND REWORK
The HMC1051ZL and HMC1053 parts should reference application note AN-216 and it should be noted that these parts
are moisture sensitive (MSL 3) and have maximum reflow temperature of 220°C. The other part types have no special
profile required (handle the HMC1052L and HMC1051Z as MSL 1) and are compatible with lead eutectic or lead-free
solder paste reflow profiles. Honeywell recommends the adherence to solder paste manufacturer’s guidelines. The
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