IC unvrsl baseband intrfc 20qfn
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Silicon Laboratories Inc |
零件包装代码 | QFN |
包装说明 | HVQCCN, LCC20,.16SQ,20 |
针数 | 20 |
Reach Compliance Code | unknow |
JESD-30 代码 | S-XQCC-N20 |
长度 | 4 mm |
功能数量 | 1 |
端子数量 | 20 |
最高工作温度 | 85 °C |
最低工作温度 | -20 °C |
封装主体材料 | UNSPECIFIED |
封装代码 | HVQCCN |
封装等效代码 | LCC20,.16SQ,20 |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 |
电源 | 2.7/3 V |
认证状态 | Not Qualified |
座面最大高度 | 0.9 mm |
标称供电电压 | 2.85 V |
表面贴装 | YES |
技术 | CMOS |
电信集成电路类型 | RF AND BASEBAND CIRCUIT |
温度等级 | OTHER |
端子形式 | NO LEAD |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | 40 |
宽度 | 4 mm |
SI4201-GM | SI4200-GM | SI4200-BM | SI4201-BM | SI4134T-BM | SI4134T-GM | SI4200-BMR | |
---|---|---|---|---|---|---|---|
描述 | IC unvrsl baseband intrfc 20qfn | IC txrx tri-band 32mlp | IC txrx tri-band 32mlp | IC unvrsl baseband intrfc 20qfn | IC RF synth dual W/dcxo 32mlp | IC RF synth dual W/dcxo 32mlp | Telecom IC, CMOS, PQCC32 |
是否Rohs认证 | 符合 | 符合 | 不符合 | 不符合 | 不符合 | 符合 | 不符合 |
厂商名称 | Silicon Laboratories Inc | Silicon Laboratories Inc | Silicon Laboratories Inc | Silicon Laboratories Inc | Silicon Laboratories Inc | Silicon Laboratories Inc | Silicon Laboratories Inc |
Reach Compliance Code | unknow | unknow | unknow | unknow | unknow | unknow | unknown |
JESD-30 代码 | S-XQCC-N20 | S-XQCC-N32 | S-PQCC-N32 | S-XQCC-N20 | S-XQCC-N32 | S-XQCC-N32 | S-PQCC-N32 |
端子数量 | 20 | 32 | 32 | 20 | 32 | 32 | 32 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY |
封装代码 | HVQCCN | HVQCCN | QCCN | HVQCCN | HVQCCN | HVQCCN | QCCN |
封装等效代码 | LCC20,.16SQ,20 | LCC32,.2SQ,20 | LCC32,.2SQ,20 | LCC20,.16SQ,20 | LCC32,.2SQ,20 | LCC32,.2SQ,20 | LCC32,.2SQ,20 |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER |
电源 | 2.7/3 V | 2.85 V | 2.85 V | 2.7/3 V | 2.85 V | 2.85 V | 2.85 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
标称供电电压 | 2.85 V | 2.85 V | 2.85 V | 2.85 V | 2.85 V | 2.85 V | 2.85 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
零件包装代码 | QFN | QFN | - | QFN | QFN | QFN | - |
包装说明 | HVQCCN, LCC20,.16SQ,20 | HVQCCN, LCC32,.2SQ,20 | QCCN, LCC32,.2SQ,20 | HVQCCN, LCC20,.16SQ,20 | HVQCCN, LCC32,.2SQ,20 | HVQCCN, LCC32,.2SQ,20 | - |
针数 | 20 | 32 | - | 20 | 32 | 32 | - |
长度 | 4 mm | 5 mm | - | 4 mm | 5 mm | 5 mm | - |
功能数量 | 1 | 1 | - | 1 | 1 | 1 | - |
峰值回流温度(摄氏度) | 260 | 260 | - | 240 | 240 | 260 | - |
座面最大高度 | 0.9 mm | 0.9 mm | - | 0.9 mm | 0.9 mm | 0.9 mm | - |
电信集成电路类型 | RF AND BASEBAND CIRCUIT | RF AND BASEBAND CIRCUIT | - | RF AND BASEBAND CIRCUIT | RF AND BASEBAND CIRCUIT | RF AND BASEBAND CIRCUIT | - |
处于峰值回流温度下的最长时间 | 40 | 40 | - | 30 | 30 | 40 | - |
宽度 | 4 mm | 5 mm | - | 4 mm | 5 mm | 5 mm | - |
最大压摆率 | - | 0.08 mA | 80 mA | - | 0.03 mA | 0.03 mA | 80 mA |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved