PRELIMINARY INFORMATION
IS25LQ025B
IS25LQ512B
IS25LQ010B
IS25LQ020B
IS25LQ040B
256K/512K/1M/2M/4M-BIT
3V- QUAD SERIAL FLASH MEMORY WITH
MULTI-I/O SPI
PRELIMINARY DATA SHEET
PRELIMINARY INFORMATION
IS25LQ025/512/010/020/040B
256K/512K/1M/2M/4M-BIT
3V- QUAD SERIAL FLASH MEMORY WITH MULTI-I/O SPI
PRELIMINARY INFORMATION
FEATURES
Industry Standard Serial Interface
-
IS25LQ040B: 4M-bit/ 512K-byte
-
IS25LQ020B: 2M-bit/ 256K-byte
-
IS25LQ010B: 1M-bit/ 128K-byte
-
IS25LQ512B: 512K-bit/ 64K-byte
-
IS25LQ025B: 256K-bit/ 32K-byte
-
256-bytes per Programmable Page Standard
-
Standard SPI/Dual/Quad Multi-I/O SPI
-
Supports Serial Flash Discoverable Parameters
(SFDP)
High Performance Serial Flash (SPI)
-
104 MHz SPI/Dual/Quad Multi-I/O SPI
-
416 MHz equivalent Quad SPI
-
52MB/S Continuous Data Throughput
-
Supports SPI Modes 0 and 3
-
More than 100,000 erase/program cycles
-
More than 20-year data retention
Efficient Read and Program modes
-
Low Instruction Overhead Operations
-
Continuous data read with Byte Wrap around
-
Allows XIP operations (execute in place)
-
Outperforms X16 Parallel Flash
Flexible & Cost Efficient Memory Architecture
-
Uniform 4 Kbyte Sectors or 32/64 Kbyte Blocks
-
Flexible 4, 32, 64 K-bytes, or Chip Erase
-
Standard Page Program 1 to 256 bytes
-
Program/Erase Suspend and Resume
Low Power with Wide Temp. Ranges
-
Single 2.3V to 3.6V Voltage Supply
-
10 mA Active Read Current
-
8 µA Standby Current
-
Deep Power Down
-
Temp Grades:
Extended: -40°C to +105°C
V Grade: -40°C to +125°C
Auto Grade: -40°C to +125°C
Advanced Security Protection
-
Software and Hardware Write Protection
-
4x256-Byte dedicated security area with
user-lockable bits, (OTP) One Time
Programmable Memory
-
128 bit Unique ID for each device
Industry Standard Pin-out & Pb-Free Packages
1
-
JB = 8-pin SOIC 208mil
-
JN = 8-pin SOIC 150mil
-
JD = 8-pin TSSOP 150mil
-
JV = 8-pin VVSOP 150mil
-
JK = 8-contact WSON 6x5mm
-
JU = 8-contact USON 2x3mm
-
KGD (call factory)
Note1: IS25LQ040B (not available in JD)
GENERAL DESCRIPTION
The IS25LQ025/512/010/020/040B (256K/512K/1M/2M/4M-bit) Serial Flash memory offers a storage solution with
flexibility and performance in a simplified pin count package. ISSI’s “Industry Standard Serial Interface” is for systems
that have limited space, pins, and power. The IS25LQ025/512/010/020/040B is accessed through a 4-wire SPI
Interface consisting of a Serial Data Input (Sl), Serial Data Output (SO), Serial Clock (SCK), and Chip Enable (CE#)
pins, which also serve as multi-function I/O pins in Dual and Quad modes (see pin descriptions). The IS25xQ series
of Flash is ideal for code shadowing to RAM, execute in place (XIP) operations, and storing non-volatile data.
The memory array is organized into programmable pages of 256-bytes each. The IS25LQ025/512/010/020/040B
supports page program mode where 1 to 256 bytes of data can be programmed into the memory with one command.
Pages can be erased in groups of 4K-byte sectors, 32K-byte blocks, 64K-byte blocks, and/or the entire chip. The
uniform sectors and blocks allow greater flexibility for a variety of applications requiring solid data retention.
The device supports the standard Serial Peripheral Interface (SPI), Dual/Quad output (SPI), and Dual/Quad I/O (SPI).
Clock frequencies of up to 104MHz for all read modes allow for equivalent clock rates of up to 416MHz (104MHz x 4)
allowing up to 52MBytes/S of throughput. These transfer rates can outperform 16-bit Parallel Flash memories
allowing for efficient memory access for a XIP (execute in place) operation. The IS25LQ025/512/010/020/040B is
manufactured using industry leading non-volatile memory technology and offered in industry standard lead-free
packages. See Ordering Information for the density and package combinations available.
Integrated Silicon Solution, Inc.- www.issi.com
Rev. 0A
10/31/2014
2
PRELIMINARY INFORMATION
IS25LQ025/512/010/020/040B
TABLE OF CONTENTS
FEATURES .......................................................................................................................................................... 2
GENERAL DESCRIPTION .................................................................................................................................. 2
1.
2.
3.
4.
5.
6.
PIN CONFIGURATION ................................................................................................................................ 5
PIN DESCRIPTIONS ................................................................................................................................... 6
BLOCK DIAGRAM ....................................................................................................................................... 7
SPI MODES DESCRIPTION ........................................................................................................................ 8
SYSTEM CONFIGURATION ..................................................................................................................... 10
5.1 BLOCK/SECTOR ADDRESSES .......................................................................................................... 10
REGISTERS ............................................................................................................................................... 12
6.1. STATUS REGISTER ........................................................................................................................... 12
6.2. FUNCTION REGISTER ....................................................................................................................... 14
7.
PROTECTION MODE ................................................................................................................................ 15
7.1 HARDWARE WRITE PROTECTION.................................................................................................... 15
7.2 SOFTWARE WRITE PROTECTION .................................................................................................... 15
8.
DEVICE OPERATION ................................................................................................................................ 16
8.1 READ DATA OPERATION (RD, 03h) .................................................................................................. 17
8.2 FAST READ DATA OPERATION (FR, 0Bh) ........................................................................................ 18
8.3 HOLD OPERATION .............................................................................................................................. 19
8.4 FAST READ DUAL I/O OPERATION (FRDIO, BBh) ........................................................................... 19
8.5 FAST READ DUAL OUTPUT OPERATION (FRDO, 3Bh) .................................................................. 21
8.6 FAST READ QUAD OUTPUT (FRQO, 6Bh) ........................................................................................ 22
8.7 FAST READ QUAD I/O OPERATION (FRQIO, EBh) .......................................................................... 23
8.8 PAGE PROGRAM OPERATION (PP, 02h) .......................................................................................... 25
8.9 QUAD INPUT PAGE PROGRAM OPERATION (PPQ, 38h)................................................................ 26
8.10 ERASE OPERATION ......................................................................................................................... 27
8.11 SECTOR ERASE OPERATION (SER, D7h/20h) ............................................................................... 27
8.12 BLOCK ERASE OPERATION (BER32K:52h, BER64K:D8h) ............................................................ 28
8.13 CHIP ERASE OPERATION (CER, C7h/60h) ..................................................................................... 29
8.14 WRITE ENABLE OPERATION (WREN, 06h) .................................................................................... 30
8.15 WRITE DISABLE OPERATION (WRDI, 04h) ..................................................................................... 30
8.16 READ STATUS REGISTER OPERATION (RDSR, 05h) ................................................................... 31
8.17 WRITE STATUS REGISTER OPERATION (WRSR, 01h) ................................................................. 31
8.18 READ FUNCTION REGISTER OPERATION (RDFR, 48h) ............................................................... 32
8.19 WRITE FUNCTION REGISTER OPERATION (WRFR, 42h)............................................................. 32
8.20 PROGRAM/ERASE SUSPEND & RESUME ...................................................................................... 33
8.21 DEEP POWER DOWN (DP, B9h) ...................................................................................................... 34
8.22 RELEASE DEEP POWER DOWN (RDPD, ABh) ............................................................................... 35
Integrated Silicon Solution, Inc.- www.issi.com
Rev. 0A
10/31/2014
3
PRELIMINARY INFORMATION
IS25LQ025/512/010/020/040B
8.23 READ PRODUCT IDENTIFICATION (RDID, ABh) ............................................................................ 36
8.24 READ PRODUCT IDENTIFICATION BY JEDEC ID OPERATION (RDJDID, 9Fh) ........................... 37
8.25 READ DEVICE MANUFACTURER AND DEVICE ID OPERATION (RDMDID, 90h) ........................ 38
8.26 READ UNIQUE ID NUMBER (RDUID, 4Bh) ...................................................................................... 40
8.27 READ SFDP OPERATION (RDSFDP, 5Ah) ...................................................................................... 41
8.28 SOFTWARE RESET (RESET-ENABLE (RSTEN, 66h) AND RESET (RST, 99h) ............................ 42
8.29 SECURITY INFORMATION ROW (OTP AREA) ................................................................................ 43
8.30 INFORMATION ROW PROGRAM OPERATION (IRP, 62h) ............................................................. 43
8.31 INFORMATION ROW READ OPERATION (IRRD, 68h) ................................................................... 45
9.
ELECTRICAL CHARACTERISTICS .......................................................................................................... 46
9.1 ABSOLUTE MAXIMUM RATINGS
(1)
................................................................................................... 46
9.2 OPERATING RANGE ........................................................................................................................... 46
9.3 DC CHARACTERISTICS ...................................................................................................................... 46
9.4 AC MEASUREMENT CONDITIONS .................................................................................................... 47
9.5 AC CHARACTERISTICS ...................................................................................................................... 48
9.6 SERIAL INPUT/OUTPUT TIMING ........................................................................................................ 49
9.7 POWER-UP AND POWER-DOWN ...................................................................................................... 50
9.8 PROGRAM/ERASE PERFORMANCE ................................................................................................. 51
9.9 RELIABILITY CHARACTERISTICS ..................................................................................................... 51
10. PACKAGE TYPE INFORMATION ............................................................................................................. 52
10.1 8-Pin JEDEC 208mil Broad Small Outline Integrated Circuit (SOIC) Package (JB) ........................ 52
10.2 8-Pin JEDEC 150mil Broad Small Outline Integrated Circuit (SOIC) Package (JN) ........................ 53
10.3 8-Pin 150mil TSSOP Package (JD) .................................................................................................. 54
10.4 8-Pin 150mil VVSOP Package (JV) .................................................................................................. 55
10.5 8-Contact Ultra-Thin Small Outline No-Lead (WSON) Package 6x5mm (JK) .................................. 57
10.6 8-Contact Ultra-Thin Small Outline No-Lead (USON) Package 2x3mm (JU) .................................. 58
11. ORDERING INFORMATION ...................................................................................................................... 59
Integrated Silicon Solution, Inc.- www.issi.com
Rev. 0A
10/31/2014
4
PRELIMINARY INFORMATION
IS25LQ025/512/010/020/040B
1. PIN CONFIGURATION
CE#
1
8
Vcc
CE#
1
8
Vcc
7
HOLD# (IO3)
6
SCK
SO (IO1)
2
7
HOLD# (IO3)
SO (IO1)
2
3
4
WP# (IO2)
3
6
SCK
WP# (IO2)
GND
5
SI (IO0
)
GND
4
5
SI (IO0
)
8-contact WSON 6x5mm (Package: JK)
8-pin SOIC 208mil (Package: JB)
8-pin SOIC 150mil (Package: JN)
8-pin TSSOP 150mil (Package: JD)
8-pin VVSOP 208mil (Package: JV)
CE#
SO (IO1)
WP# (IO2)
GND
1
2
3
4
8
7
6
5
Vcc
HOLD# (IO3)
SCK
SI (IO0
)
8-contact USON 2x3mm (Package: JU)
Integrated Silicon Solution, Inc.- www.issi.com
Rev. 0A
10/31/2014
5
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