40 ns Propagation Delay,
CMOS Optocoupler
Technical Data
HCPL-7720 HCPL-7721
HCPL-0720 HCPL-0721
Features
• +5 V CMOS Compatibility
• 20 ns max. Prop. Delay Skew
• High Speed: 25 MBd
• 40 ns max. Prop. Delay
• 10 kV/
µ
s Minimum Common
Mode Rejection
• –40 to 85
°
C Temp. Range
• Safety and Regulatory
Approvals
UL Recognized
2500 V rms for 1 min. per
UL 1577 for HCPL-072X,
3750 V rms for 1 min. per
UL 1577 for HCPL-772X
CSA Component Acceptance
Notice #5
VDE 0884
– V
IORM
= 630 Vpeak for
HCPL-772X Option 060
– V
IORM
= 560 Vpeak for
HCPL-072X Option 060
• Multiplexed Data
Transmission
• Computer Peripheral
Interface
• Microprocessor System
Interface
Functional Diagram
**V
DD1
1
8
V
DD2
**
V
I
2
I
O
7
NC*
Description
Available in either an 8-pin DIP or
SO-8 package style respectively,
the HCPL-772X or HCPL-072X
optocouplers utilize the latest
CMOS IC technology to achieve
outstanding performance with
very low power consumption. The
HCPL-772X/072X require only
two bypass capacitors for
complete CMOS compatability.
Basic building blocks of the
HCPL-772X/072X are a CMOS
LED driver IC, a high speed LED
and a CMOS detector IC. A CMOS
logic input signal controls the
LED driver IC which supplies
current to the LED. The detector
IC incorporates an integrated
*
3
LED1
6
V
O
GND
1
4
SHIELD
5
GND
2
TRUTH TABLE
(POSITIVE LOGIC)
V
I
, INPUT
H
L
LED1
OFF
ON
V
O
, OUTPUT
H
L
Applications
• Digital Fieldbus Isolation:
CC-Link, DeviceNet,
Profibus, SDS
• AC Plasma Display Panel
Level Shifting
photodiode, a high-speed
transimpedance amplifier, and a
voltage comparator with an
output driver.
*Pin 3 is the anode of the internal LED and must be left unconnected for guaranteed data sheet performance.
Pin 7 is not connected internally.
**A 0.1
µF
bypass capacitor must be connected between pins 1 and 4, and 5 and 8.
CAUTION:
It is advised that normal static precautions be taken in handling and assembly of this component
to prevent damage and/or degradation which may be induced by ESD.
2
Selection Guide
8-Pin DIP
(300 Mil)
HCPL-7721
HCPL-7720
Small Outline
SO-8
HCPL-0721
HCPL-0720
Data Rate
25 MB
25 MB
PWD
6 ns
8 ns
Ordering Information
Specify Part Number followed by Option Number (if desired)
Example
HCPL-7720#XXX
060 = VDE0884 Option.
300 = Gull Wing Surface Mount Option (HCPL-7720 only).
500 = Tape and Reel Packaging Option.
No Option and Option 300 contain 50 units (HCPL-772X), 100 units (HCPL-072X) per tube.
Option 500 contain 1000 units (HCPL-772X), 1500 units (HCPL-072X) per reel.
Option data sheets available. Contact Hewlett-Packard sales representative or authorized distributor.
Package Outline Drawing
HCPL-772X 8-Pin DIP Package
9.65 ± 0.25
(0.380 ± 0.010)
TYPE NUMBER
8
7
6
5
OPTION 060 CODE*
6.35 ± 0.25
(0.250 ± 0.010)
DATE CODE
7.62 ± 0.25
(0.300 ± 0.010)
HP XXXXV
YYWW
1
1.19 (0.047) MAX.
2
3
4
1.78 (0.070) MAX.
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
5° TYP.
4.70 (0.185) MAX.
0.51 (0.020) MIN.
2.92 (0.115) MIN.
DIMENSIONS IN MILLIMETERS AND (INCHES).
*OPTION 300 AND 500 NOT MARKED.
1.080 ± 0.320
(0.043 ± 0.013)
0.65 (0.025) MAX.
2.54 ± 0.25
(0.100 ± 0.010)
3
Package Outline Drawing
HCPL-772X Package with Gull Wing Surface Mount Option 300
PAD LOCATION (FOR REFERENCE ONLY)
9.65 ± 0.25
(0.380 ± 0.010)
8
7
6
5
1.016 (0.040)
1.194 (0.047)
4.826 TYP.
(0.190)
6.350 ± 0.25
(0.250 ± 0.010)
9.398 (0.370)
9.906 (0.390)
1
2
3
4
1.194 (0.047)
1.778 (0.070)
1.780
(0.070)
MAX.
9.65 ± 0.25
(0.380 ± 0.010)
7.62 ± 0.25
(0.300 ± 0.010)
0.381 (0.015)
0.635 (0.025)
1.19
(0.047)
MAX.
4.19 MAX.
(0.165)
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
1.080 ± 0.320
(0.043 ± 0.013)
0.635 ± 0.130
2.54
(0.025 ± 0.005)
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
0.635 ± 0.25
(0.025 ± 0.010)
12° NOM.
Package Outline Drawing
HCPL-072X Outline Drawing (Small Outline SO-8 Package)
8
7
6
72XV
YWW
5
5.842 ± 0.203
(0.236 ± 0.008)
OPTION 060 CODE*
TYPE NUMBER (LAST 3 DIGITS)
3.937 ± 0.127
(0.155 ± 0.005)
0.381 ± 0.076
(0.016 ± 0.003)
PIN 1
ONE
2
3
4
1.270 BSG
(0.050)
DATE CODE
5.080 ± 0.005
(0.200 ± 0.005)
3.175 ± 0.127
(0.125 ± 0.005)
7°
45° X 0.432
(0.017)
1.524
(0.060)
0.152 ± 0.051
(0.006 ± 0.002)
0.228 ± 0.025
(0.009 ± 0.001)
DIMENSIONS IN MILLIMETERS AND (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
*OPTION 500 NOT MARKED.
0.305
MIN.
(0.012)
4
Solder Reflow Thermal Profile
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
1
2
3
4
5
6
7
8
9
10
11
12
∆T
= 145°C, 1°C/SEC
∆T
= 115°C, 0.3°C/SEC
TEMPERATURE – °C
∆T
= 100°C, 1.5°C/SEC
TIME – MINUTES
(NOTE: USE OF NON-CHLORINE ACTIVATED FLUXES IS RECOMMENDED.)
Regulatory Information
The HCPL-772X/072X have been
approved by the following
organizations:
UL
Recognized under UL 1577,
component recognition program,
File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File
CA88324.
VDE
(HCPL-772X Option 060)
Approved according to
VDE 0884/06.92,
File 6591-23-4880-1005.
TUV
Rheinland
(HCPL-072X Option 060)
Approved according to
VDE 0884/06.92, Certificate
R9650938.
Insulation and Safety Related Specifications
Parameter
Minimum External Air
Gap (Clearance)
Minimum External
Tracking (Creepage)
Minimum Internal Plastic
Gap (Internal Clearance)
Tracking Resistance
(Comparative Tracking
Index)
Isolation Group
CTI
Symbol
L(I01)
L(I02)
Value
772X 072X Units
7.1
4.9
mm
7.4
4.8
mm
Conditions
Measured from input terminals to output
terminals, shortest distance through air.
Measured from input terminals to output
terminals, shortest distance path along
body.
Insulation thickness between emitter and
detector; also known as distance through
insulation.
DIN IEC 112/VDE 0303 Part 1
0.08
0.08
mm
≥
175
≥
175
Volts
IIIa
IIIa
Material Group (DIN VDE 0110, 1/89,
Table 1)
recommended techniques such as
grooves and ribs which may be
used on a printed circuit board to
achieve desired creepage and
clearances. Creepage and
clearance distances will also
change depending on factors
such as pollution degree and
insulation level.
All Hewlett-Packard data sheets
report the creepage and
clearance inherent to the
optocoupler component itself.
These dimensions are needed as a
starting point for the equipment
designer when determining the
circuit insulation requirements.
However, once mounted on a
printed circuit board, minimum
creepage and clearance require-
ments must be met as specified
for individual equipment
standards. For creepage, the
shortest distance path along the
surface of a printed circuit board
between the solder fillets of the
input and output leads must be
considered. There are
5
VDE 0884 Insulation Related Characteristics (Option 060)
Description
Installation classification per DIN VDE 0110/1.89,
Table 1
for rated mains voltage
≤
150 V rms
for rated mains voltage
≤
300 V rms
for rated mains voltage
≤
450 V rms
Climatic Classification
Pollution Degree (DIN VDE 0110/1.89)
Maximum Working Insulation Voltage
Input to Output Test Voltage, Method b†
V
IORM
x 1.875 = V
PR
, 100% Production
Test with t
m
= 1 sec, Partial Discharge < 5 pC
Input to Output Test Voltage, Method a†
V
IORM
x 1.5 = V
PR
, Type and Sample Test,
t
m
= 60 sec, Partial Discharge < 5 pC
Highest Allowable Overvoltage†
(Transient Overvoltage, t
ini
= 10 sec)
Safety Limiting Values
(Maximum values allowed in the event of a failure,
also see Thermal Derating curve, Figure 11.)
Case Temperature
Input Current
Output Power
Insulation Resistance at T
S
, V
10
= 500 V
Symbol
HCPL-772X
Option 060
HCPL-072X
Option 060
Units
V
IORM
V
PR
I-IV
I-IV
I-III
55/85/21
2
630
1181
I-IV
I-III
55/85/21
2
560
1050
V peak
V peak
V
PR
945
840
V peak
V
IOTM
6000
4000
V peak
T
S
I
S,INPUT
P
S,OUTPUT
R
IO
175
230
600
≥
10
9
150
150
600
≥
10
9
°C
mA
mW
Ω
†Refer to the front of the optocoupler section of the
Isolation and Control Component Designer’s Catalog,
under Product Safety
Regulations section (VDE 0884), for a detailed description.
Note: These optocouplers are suitable for “safe electrical isolation” only within the safety limit data. Maintenance of the safety data
shall be ensured by means of protective circuits.
Note: The surface mount classification is Class A in accordance with CECC 00802.
Absolute Maximum Ratings
Parameter
Storage Temperature
Ambient Operating Temperature
[1]
Supply Voltages
Input Voltage
Output Voltage
Average Output Current
Lead Solder Temperature
Solder Reflow Temperature Profile
Symbol
Min.
Max.
Units
Figure
T
S
–55
125
°C
T
A
–40
+85
°C
V
DD1
, V
DD2
0
5.5
Volts
V
I
–0.5
V
DD1
+0.5
Volts
V
O
–0.5
V
DD2
+0.5
Volts
I
O
10
mA
260°C for 10 sec., 1.6 mm below seating plane
See
Solder Reflow Temperature Profile
Section
Recommended Operating Conditions
Parameter
Ambient Operating Temperature
Supply Voltages
Logic High Input Voltage
Logic Low Input Voltage
Input Signal Rise and Fall Times
Symbol
T
A
V
DD1
, V
DD2
V
IH
V
IL
t
r
, t
f
Min.
–40
4.5
2.0
0.0
Max.
+85
5.5
V
DD1
0.8
1.0
Units
°C
V
V
V
ms
Figure
1, 2
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