电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

V62C2162096L-35B

产品描述Standard SRAM, 128KX16, 35ns, CMOS, PBGA48, 9 X 12 MM, FBGA-48
产品类别存储    存储   
文件大小118KB,共13页
制造商Mosel Vitelic Corporation ( MVC )
官网地址http://www.moselvitelic.com
下载文档 详细参数 全文预览

V62C2162096L-35B概述

Standard SRAM, 128KX16, 35ns, CMOS, PBGA48, 9 X 12 MM, FBGA-48

V62C2162096L-35B规格参数

参数名称属性值
是否Rohs认证不符合
Objectid1904877138
零件包装代码BGA
包装说明TFBGA, BGA48,6X8,30
针数48
Reach Compliance Codeunknown
ECCN代码3A991.B.2.A
最长访问时间35 ns
I/O 类型COMMON
JESD-30 代码R-PBGA-B48
JESD-609代码e0
长度12 mm
内存密度2097152 bit
内存集成电路类型STANDARD SRAM
内存宽度16
功能数量1
端子数量48
字数131072 words
字数代码128000
工作模式ASYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织128KX16
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码TFBGA
封装等效代码BGA48,6X8,30
封装形状RECTANGULAR
封装形式GRID ARRAY, THIN PROFILE, FINE PITCH
并行/串行PARALLEL
电源3 V
认证状态Not Qualified
座面最大高度1.2 mm
最大待机电流0.00001 A
最小待机电流2.7 V
最大压摆率0.065 mA
最大供电电压 (Vsup)3.3 V
最小供电电压 (Vsup)2.7 V
标称供电电压 (Vsup)3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层TIN LEAD
端子形式BALL
端子节距0.75 mm
端子位置BOTTOM
宽度9 mm

文档预览

下载PDF文档
V62C2162096L(L)
Ultra Low Power
128K x 16 CMOS SRAM
Features
• Ultra Low-power consumption
- Active: 65mA I
CC
at 35ns
- Stand-by: 10
µA
(CMOS input/output)
2
µA
(CMOS input/output, L version)
• 35/45/55/70/85/100 ns access time
• Equal access and cycle time
• Single +2.2V to 2.7V Power Supply
• Tri-state output
• Automatic power-down when deselected
• Multiple center power and ground pins for
improved noise immunity
• Individual byte controls for both Read and
Write cycles
• Available in 44 pin TSOP II / 48-fpBGA
Functional Description
The V62C2162096L is a Low Power CMOS Static
RAM organized as 131,072 words by 16 bits. Easy
memory expansion is provided by an active LOW (CE)
and (OE) pin.
This device has an automatic power-down mode feature
when deselected. Separate Byte Enable controls (BLE
and BHE) allow individual bytes to be accessed. BLE
controls the lower bits I/O1 - I/O8. BHE controls the
upper bits I/O9 - I/O16.
Writing to these devices is performed by taking Chip
Enable (CE) with Write Enable (WE) and Byte Enable
(BLE/BHE) LOW.
Reading from the device is performed by taking Chip
Enable (CE) with Output Enable (OE) and Byte Enable
(BLE/BHE) LOW while Write Enable (WE) is held
HIGH.
Logic Block Diagram
Pre-Charge Circuit
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
Data
Cont
Data
Cont
Vcc
Vss
TSOPII / 48-fpBGA
Memory Array
1024 X 2048
I/O1 - I/O8
I/O9 - I/O16
I/O Circuit
Column Select
A10 A11 A12 A13 A14 A15 A16
WE
OE
BHE
BLE
CE
A4
A3
A2
A1
A0
CE
I/O1
I/O2
I/O3
I/O4
Vcc
Vss
I/O5
I/O6
I/O7
I/O8
WE
A16
A15
A14
A13
A12
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
A5
A6
A7
OE
BHE
BLE
I/O16
I/O15
I/O14
I/O13
Vss
Vcc
I/O12
I/O11
I/O10
I/O9
NC
A8
A9
A10
A11
NC
Row Select
1
REV. 1.1
April
2001 V62C2162096L(L)

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2377  509  33  724  2632  48  11  1  15  53 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved