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BCR1000BFMAHWS

产品描述res 10 ohm 1/4W 1% back-C chip
产品类别无源元件   
文件大小83KB,共3页
制造商Vishay(威世)
官网地址http://www.vishay.com
标准  
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BCR1000BFMAHWS概述

res 10 ohm 1/4W 1% back-C chip

BCR1000BFMAHWS规格参数

参数名称属性值
Datasheets
BCR Series
Standard Package100
CategoryResistors
FamilyChip Resistor - Surface Mou
系列
Packaging
Tray
Resistance (Ohms)10
容差
Tolerance
±1%
Power (Watts)0.25W, 1/4W
CompositiThin Film
FeaturesMoisture Resis
Temperature Coefficie±250ppm/°C
封装 / 箱体
Package / Case
0202
Supplier Device Package0202
Size / Dimensi0.020" L x 0.020" W (0.50mm x 0.50mm)
Heigh0.012" (0.30mm)
Number of Terminations2

文档预览

下载PDF文档
BCR
www.vishay.com
Vishay Electro-Films
Thin Film, Back-Contact Resistor
FEATURES
Product may not be to scale
The Back Contact Resistor (BCR) series single-value
back-contact resistor chip is one of the smallest chips
available.
The BCR requires only one wire bond thus saving hybrid
space.
The BCRs are manufactured using Vishay Electro-Films
(EFI) sophisticated thin film equipment and manufacturing
technology. The BCRs are 100 % electrically tested and
visually inspected to MIL-STD-883, method 2032 class H
or K.
Wire bondable
Only one wire bond required
Small size: 0.020 inches square
Resistance range: 10
to 1 M
Oxidized silicon substrate for good power
dissipation
Moisture resistant
Case size: 0202
Resistor material: tantalum nitride, self-passivating
Material categorization: for definitions of compliance
please see
www.vishay.com/doc?99912
APPLICATIONS
Vishay EFI BCR resistor chips are widely used in hybrid
packages where space is limited. The bottom connection is
made by attaching the back of the chip to the substrate
either eutectic or with conductive epoxy. The single wire
bond is made to the notched pad on the top of the chip. (The
other rectangular pad on the top of the chip is a via hole, a
low-ohmic contact connecting the resistor to the bottom of
the chip.)
TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES, AND TOLERANCES
PARAMETER
Total Resistance Range
Standard Tolerances
TCR
VALUE
10 to 1M
± 0.1, ± 0.2, ± 0.5, ± 1, ± 2, ± 5
± 25, ± 50, ± 100, ± 250
UNIT
%
ppm/°C
Tightest Standard Tolerance Available
5%
2%
1%
0.5 % 0.2 %
0.1 %
± 25 ppm/°C
± 50 ppm/°C
± 100 ppm/°C
± 250 ppm/°C
360 kΩ
1 MΩ
200 kΩ
620 kΩ
10
Ω
20
Ω
50
Ω
100
Ω
200
Ω
1 kΩ
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER
Noise, MIL-STD-202, Method 308
100
to 250 k
< 100
or > 251 k
Moisture resistance, MIL-STD-202, Method 106
Stability, 1000 h, +125 °C, 125 mW
Operating Temperature Range
Thermal Shock, MIL-STD-202, Method 107, Test Condition F
High Temperature Exposure, +150 °C, 100 h
Dielectric Voltage Breakdown
Insulation Resistance
Operating Voltage
DC Power Rating at +70 °C (Derated to Zero at +175 °C)
5x Rated Power Short-Time Overload, +25 °C, 5 s
Revision: 21-Feb-17
VALUE
-35 typ.
-20 typ.
± 0.5 max.
R/R
± 1.0 max.
R/R
-55 to +125
± 0.25 max.
R/R
± 0.5 max.
R/R
200
10
12
min.
75 max.
0.250
± 0.25 max.
R/R
UNIT
dB
%
%
°C
%
%
V
V
W
%
Document Number: 61023
1
For technical questions, contact:
efi@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000

BCR1000BFMAHWS相似产品对比

BCR1000BFMAHWS BCR4700BFMAHWT BCR1000BFMAHWT BCR10001FMAHWT BCR10001FMAHWS BCR4700BFMAHWS
描述 res 10 ohm 1/4W 1% back-C chip res 47 ohm 1/4W 1% back-C chip res 10 ohm 1/4W 1% back-C chip res 10k ohm 1/4W 1% back-C chip res 10k ohm 1/4W 1% back-C chip res 47 ohm 1/4W 1% back-C chip

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