J-K Flip-Flop, LS Series, 2-Func, Negative Edge Triggered, 2-Bit, Complementary Output, TTL, CDIP16, CERAMIC, DIP-16
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP16,.3 |
| 针数 | 16 |
| Reach Compliance Code | unknow |
| 系列 | LS |
| JESD-30 代码 | R-GDIP-T16 |
| JESD-609代码 | e0 |
| 长度 | 19.304 mm |
| 逻辑集成电路类型 | J-K FLIP-FLOP |
| 最大频率@ Nom-Su | 25000000 Hz |
| 最大I（ol） | 0.004 A |
| 位数 | 2 |
| 功能数量 | 2 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出极性 | COMPLEMENTARY |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 最大电源电流（ICC） | 6 mA |
| 传播延迟（tpd） | 28 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 Class B |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 触发器类型 | NEGATIVE EDGE |
| 宽度 | 7.62 mm |
| 最小 fmax | 30 MHz |
| Base Number Matches | 1 |
| 54LS112DMQB | 54LS112LMQB | DM54LS112AJ | DM54LS112AW | 54LS112FMQB | DM74LS112AM | |
|---|---|---|---|---|---|---|
| 描述 | J-K Flip-Flop, LS Series, 2-Func, Negative Edge Triggered, 2-Bit, Complementary Output, TTL, CDIP16, CERAMIC, DIP-16 | J-K Flip-Flop, LS Series, 2-Func, Negative Edge Triggered, 2-Bit, Complementary Output, TTL, CQCC20, CERAMIC, LCC-20 | J-K Flip-Flop, LS Series, 2-Func, Negative Edge Triggered, 2-Bit, Complementary Output, TTL, CDIP16, CERAMIC, DIP-16 | J-K Flip-Flop, LS Series, 2-Func, Negative Edge Triggered, 2-Bit, Complementary Output, TTL, CDFP16, CERAMIC, FP-16 | J-K Flip-Flop, LS Series, 2-Func, Negative Edge Triggered, 2-Bit, Complementary Output, TTL, CDFP16, CERAMIC, FP-16 | J-K Flip-Flop, LS Series, 2-Func, Negative Edge Triggered, 2-Bit, Complementary Output, TTL, PDSO16, PLASTIC, SOP-16 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | DIP | QLCC | DIP | DFP | DFP | SOIC |
| 包装说明 | DIP, DIP16,.3 | QCCN, LCC20,.35SQ | CERAMIC, DIP-16 | CERAMIC, FP-16 | DFP, FL16,.3 | PLASTIC, SOP-16 |
| 针数 | 16 | 20 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | unknow | unknow | unknown | unknown | unknown | unknown |
| 系列 | LS | LS | LS | LS | LS | LS |
| JESD-30 代码 | R-GDIP-T16 | S-CQCC-N20 | R-GDIP-T16 | R-GDFP-F16 | R-GDFP-F16 | R-PDSO-G16 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 19.304 mm | 8.89 mm | 19.304 mm | 9.6645 mm | 9.6645 mm | 9.9 mm |
| 逻辑集成电路类型 | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP |
| 最大I（ol） | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.008 A |
| 位数 | 2 | 2 | 2 | 2 | 2 | 2 |
| 功能数量 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 16 | 20 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 70 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | - |
| 输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
| 封装代码 | DIP | QCCN | DIP | DFP | DFP | SOP |
| 封装等效代码 | DIP16,.3 | LCC20,.35SQ | DIP16,.3 | FL16,.3 | FL16,.3 | SOP16,.25 |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | CHIP CARRIER | IN-LINE | FLATPACK | FLATPACK | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 最大电源电流（ICC） | 6 mA | 6 mA | 6 mA | 6 mA | 6 mA | 6 mA |
| 传播延迟（tpd） | 28 ns | 28 ns | 28 ns | 28 ns | 28 ns | 28 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 1.905 mm | 5.08 mm | 2.032 mm | 2.032 mm | 1.75 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.25 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.75 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | NO | YES | YES | YES |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | FLAT | FLAT | GULL WING |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 触发器类型 | NEGATIVE EDGE | NEGATIVE EDGE | NEGATIVE EDGE | NEGATIVE EDGE | NEGATIVE EDGE | NEGATIVE EDGE |
| 宽度 | 7.62 mm | 8.89 mm | 7.62 mm | 6.604 mm | 6.604 mm | 3.9 mm |
| 最小 fmax | 30 MHz | 30 MHz | 30 MHz | 30 MHz | 30 MHz | 30 MHz |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| 最大频率@ Nom-Sup | - | - | 25000000 Hz | 25000000 Hz | 25000000 Hz | 25000000 Hz |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
