Video Imager, 12-Bit, CMOS, CQFP68, HERMETIC SEALED, CERAMIC, CC-68
| 参数名称 | 属性值 |
| 零件包装代码 | QFP |
| 包装说明 | QFF, |
| 针数 | 68 |
| Reach Compliance Code | unknow |
| ECCN代码 | 3A001.A.2.C |
| 其他特性 | 12 BIT SOURCE ADDRESS; OPTEMP SPECIFIED AS TC |
| 边界扫描 | NO |
| 最大时钟频率 | 15.15 MHz |
| 外部数据总线宽度 | 12 |
| JESD-30 代码 | S-CQFP-F68 |
| JESD-609代码 | e0 |
| 长度 | 24.195 mm |
| 低功率模式 | NO |
| 端子数量 | 68 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出数据总线宽度 | 12 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QFF |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.92 mm |
| 最大压摆率 | 75 mA |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 宽度 | 24.195 mm |
| uPs/uCs/外围集成电路类型 | DSP PERIPHERAL, VIDEO IMAGING |
| Base Number Matches | 1 |
| 5962-8971501YA | 5962-8971501XC | 5962-8971502YA | 5962-8971502XC | |
|---|---|---|---|---|
| 描述 | Video Imager, 12-Bit, CMOS, CQFP68, HERMETIC SEALED, CERAMIC, CC-68 | Video Imager, 12-Bit, CMOS, CPGA68 | Video Imager, 12-Bit, CMOS, CQFP68, HERMETIC SEALED, CERAMIC, CC-68 | Video Imager, 12-Bit, CMOS, CPGA68 |
| Reach Compliance Code | unknow | unknow | unknown | unknown |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| 其他特性 | 12 BIT SOURCE ADDRESS; OPTEMP SPECIFIED AS TC | 12 BIT SOURCE ADDRESS; OPTEMP SPECIFIED AS TC | 12 BIT SOURCE ADDRESS; OPTEMP SPECIFIED AS TC; ICC SPECIFIED @ 15MHZ | 12 BIT SOURCE ADDRESS; OPTEMP SPECIFIED AS TC; ICC SPECIFIED @ 15MHZ |
| 边界扫描 | NO | NO | NO | NO |
| 外部数据总线宽度 | 12 | 12 | 12 | 12 |
| JESD-30 代码 | S-CQFP-F68 | S-CPGA-P68 | S-CQFP-F68 | S-CPGA-P68 |
| JESD-609代码 | e0 | e4 | e0 | e4 |
| 低功率模式 | NO | NO | NO | NO |
| 端子数量 | 68 | 68 | 68 | 68 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出数据总线宽度 | 12 | 12 | 12 | 12 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK | GRID ARRAY | FLATPACK | GRID ARRAY |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大压摆率 | 75 mA | 75 mA | 75 mA | 75 mA |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | TIN LEAD | GOLD | TIN LEAD | GOLD |
| 端子形式 | FLAT | PIN/PEG | FLAT | PIN/PEG |
| 端子位置 | QUAD | PERPENDICULAR | QUAD | PERPENDICULAR |
| uPs/uCs/外围集成电路类型 | DSP PERIPHERAL, VIDEO IMAGING | DSP PERIPHERAL, VIDEO IMAGING | DSP PERIPHERAL, VIDEO IMAGING | DSP PERIPHERAL, VIDEO IMAGING |
| Base Number Matches | 1 | 1 | 1 | 1 |
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