EVALUATION KIT AVAILABLE
MAX14661
Beyond-the-Rails 16:2 Multiplexer
General Description
The MAX14661 is a serially controlled, dual-channel
analog multiplexer allowing any of the 16 pins to be
connected to either common pin simultaneously in any
combination. The device features Beyond-the-Rails
TM
capability so that ±5.5V signals can be passed with any
single supply between +1.6V and +5.5V.
The serial control is selectable between I
2
C and SPI.
Both modes provide individual control of each indepen-
dent switch so that any combination of switches can
be applied. I
2
C mode provides two address-select pins
allowing for addressing up to four devices on a single bus.
The SPI mode includes a DOUT pin that can be used to
chain multiple devices together with a single select signal.
The IC is available in a 28-pin (4mm x 4mm) TQFN pack-
age and is specified over the -40ºC to +85ºC extended
temperature range. The AB_ and COM_ pins provide
±10kV ESD protection (HBM).
Features and Benefits
Applications
●
●
●
●
System Diagnostics
Data Acquisition
I
2
C Signal Switching
Audio Input Selection
● Beyond-the-Rails Technology Reduces Cost and
Complexity
• Switch ±5.5V Signals from a +1.6V Single Supply
• Wide +1.6V to +5.5V Supply Range
• Low 5.5W R
ON
(typ) Across the Supply Range
● Flexible Multiplexing Enables Design Reuse
• 16:2 Matrix Switch Multiplexer Connects Any Input
Pin To Either Common Pin In Any Combination
• Each Switch is Independently Controlled via I
2
C or
SPI
• Programmable Shadow Registers Allow
Simultaneous Updating
● Low Distortion Switching Improves System
Performance
• Total Harmonic Distortion + Noise 0.005% (typ)
• R
ON
Flatness 2.5mΩ (typ) Across Complete
Signal Range
● Integrated Protection for System Reliability
• ±10kV HBM ESD Protection on all AB_ and COM_
Pins, Even When Powered Down
Ordering Information
appears at end of data sheet.
Beyond-the-Rails™ is a trademark Maxim Integrated Products, Inc.
19-6739; Rev 2; 1/15
MAX14661
Beyond-the-Rails 16:2 Multiplexer
Functional Diagram
MAX14661
AB01
AB02
AB03
AB04
AB05
AB06
AB07
AB08
AB09
AB10
AB11
AB12
AB13
AB14
AB15
AB16
COMA
COMB
SCLK/SCL
DIN/SDA
CS/A0
DOUT/A1
SERIAL CONTROL
V
CC
GND
SPI/I
2
C
SD
MAX14661
Beyond-the-Rails 16:2 Multiplexer
Absolute Maximum Ratings
(All voltages referenced to GND.)
V
CC
, DIN/SDA, SCLK/SCL, DOUT/A1,
CS/A0, SD
....................................................... -0.3V to +6.0V
SPI/I
2
C
................................. -0.3V to min (V
CC
to +0.3V, 6V)
AB_, COM_ .........................................................-6.0V to +6.0V
Continuous Current (AB_ or COM_ to any switch) ..........±50mA
Peak Current (AB_ or COM_ to any switch)
(pulsed at 1ms, maximum 10% duty cycle)................±100mA
Continuous Power Dissipation
28 TQFN (derate 28.6mW/ºC above +70ºC) ..........2285.7mW
Operating Temperature Range ............................-40ºC to +85ºC
Maximum Junction Temperature ..................................... +150ºC
Storage Temperature Range .............................-65ºC to +150ºC
Lead Temperature (soldering, 10s) ................................. +300ºC
Soldering Temperature (reflow) ....................................... +260ºC
Package Thermal Characteristics
(Note 1)
Junction-to-Case Thermal Resistance (θ
JC
)
TQFN .................................................................................3ºC/W
Junction-to-Ambient Thermal Resistance (θ
JA
)
TQFN ...........................................................................35ºC/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics
PARAMETER
POWER SUPPLY
Power-Supply Range
Power-Supply Rejection Ratio
(V
CC
= +1.6V to +5.5V, T
A
= -40ºC to +85ºC, unless otherwise noted. Typical values are at V
CC
= +3.3V, T
A
= +25ºC, unless otherwise
noted.) (Note 2)
SYMBOL
V
CC
PSRR
R
COM
= 50Ω,
V
CC
= +3.3V ±0.1V, f = 10kHz
V
CC
= +3.3V, all switches on
V
CC
Supply Current
ANALOG SWITCH
Analog Signal Range
Analog Signal Amplitude
(Notes 3, 4)
On-Resistance
On-Resistance Match between
Channels
On-Resistance Flatness
V
AB_
,
V
COM_
V
CC
> 2.5V
V
P-P
f < 500kHz
V
CC
< 2.5V, f > 500kHz
R
ON
ΔR
ON
R
FLAT
V
CC
= +5V
V
CC
= +1.8V
V
CC
= 3.3V, between COM_ and AB_
V
CC
= 3.3V, I
COM_
= 10mA,
V
COM_
= -5.5V to +5.5V
V
CC
= 3.3V, switch open,
V
COM_
= -5.5V, +5.5V
V
AB_
= +5.5V, -5.5V, unconnected
(Notes 3, 5)
-50
0.25
25
-5.5
+5.5
11
11
6
8
12
Ω
Ω
mΩ
V
V
I
CC
V
CC
= +3.3V, two switches on
V
CC
= +3.3V,
SD
= 0
CONDITIONS
MIN
1.6
-84
675
115
1500
200
1
µA
TYP
MAX
5.5
UNITS
V
dB
AB_, COM_ Off-Leakage Current
I
OFF
+50
nA
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MAX14661
Beyond-the-Rails 16:2 Multiplexer
Electrical Characteristics (continued)
PARAMETER
AB_, COM_ On-Leakage Current
DYNAMIC PERFORMACE (Notes 6, 7)
Turn-Off Time
Break-Before-Make Time
t
OFF
t
BBM
SYMBOL
I
ON
(V
CC
= +1.6V to +5.5V, T
A
= -40ºC to +85ºC, unless otherwise noted. Typical values are at V
CC
= +3.3V, T
A
= +25ºC, unless otherwise
noted.) (Note 2)
CONDITIONS
V
CC
= 3.3V, switch closed,
V
COM_
= V
AB_
= ±5.5V (Notes 3, 5)
V
COM_
= 3.0V, R
L
= 100Ω, C
L
= 33pF,
open COM_ and AB_ together
V
COM_
= 3.0V, R
L
= 100Ω, C
L
= 33pF,
time for both switching channels are open
during transition
V
COM_
= 3.0V, R
L
= 100W, C
L
= 33pF;
close
AB_ and COMA or AB_ and COMB
together
Time from when
SD
pin goes high to
when the device is ready to listen for
I
2
C/SPI comunications
R
S
= R
L
= 50Ω (Notes 7, 8), V
COM_
=
0.6
V
P-P
f = 20Hz to 20kHz, V
COM_
= 0.5V
P-P
,
R
S
= R
L
= 50Ω, DC bias = 0
R
S
= R
L
= 50Ω, V
COM_
= 0.6V
P-P
,
f = 1MHz (Note 8)
R
S
= R
L
= 50Ω, V
COM
= 0.6V
P-P
,
f = 1MHz (Note 8)
60
0.005
-62
-80
150
25
95
35
45
15
15
15
C
L
= 15pF, V
CC
≥ 2.7V
C
L
= 15pF, 1.6V ≤ V
CC
< 2.7V
C
L
= 15pF
60
400
1.3
10
40
80
0
MIN
-50
TYP
MAX
+50
UNITS
nA
5
µs
µs
Turn-On Time
t
ON
13
25
µs
Enable Time
Bandwidth -3dB
Total Harmonic Distortion Plus
Noise
Off-Isolation
Crosstalk
Thermal Shutdown
Thermal Hysteresis
SCLK Clock Period
SCLK Pulse-Width High
SCLK Pulse-Width Low
CS
Fall to SCLK Rise Time
DIN Hold Time
DIN Setup Time
Output Data Propagation Delay
DOUT Rise and Fall Times
CS
Hold Time
I
2
C TIMING (See Figure 4)
I
2
C Serial-Clock Frequency
Bus Free Time Between STOP
and START Conditions
t
EN
BW
THD + N
V
ISO
V
CT
T
SDW
T
HYST
t
CH +
t
CL
t
CH
t
CL
t
CSS
t
DH
t
DS
t
DO
t
FT
t
CSH
f
SCL
t
BUF
300
µs
MHz
%
dB
dB
ºC
ºC
ns
ns
ns
ns
ns
ns
ns
ns
ns
kHz
µs
SPI TIMING CHARACTERISTICS (See Figure 12)
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MAX14661
Beyond-the-Rails 16:2 Multiplexer
Electrical Characteristics (continued)
(V
CC
= +1.6V to +5.5V, T
A
= -40ºC to +85ºC, unless otherwise noted. Typical values are at V
CC
= +3.3V, T
A
= +25ºC, unless otherwise
noted.) (Note 2)
PARAMETER
START Condition
Setup Time
START Condition Hold Time
STOP Condition Setup Time
Clock Low Period
Clock High Period
Data Valid to SCL Rise Time
Data Hold Time to SCL Fall
DIGITAL I/O
Input Logic-High Voltage
Input Logic-Low Voltage
(DIN/SDA, SCLK/SCL,
CS/A0)
Input Logic-Low Voltage (DOUT/
A1
SD)
Input Leakage Current
SPI/I
2
C
I
2
C Threshold
SPI/I
2
C
SPI Threshold
Output Logic Low
(I
2
C mode)
SPI/I
2
C
SPI Supply Voltage
Output Logic-Low
(SPI Mode)
Output Logic-High
(SPI Mode)
ESD PROTECTION
All AB_ and COM_ Pins
All Others Pins
Note
Note
Note
Note
Note
Note
2:
3:
4:
5:
6:
7:
HBM
HBM
±10
±2
kV
kV
V
IH
V
IL_FAST
V
IL_SLOW
I
IN
V
I2C
V
SPI
V
OL_I2C
V
OVDD
V
OL_SPI
V
OH_SPI
I
SINK
= 200µA
I
SOURCE
= 200µA
I
SINK
= 3mA
1.5
1.5
0.4
5.5
0.15 x V
OVDD
0.85 x V
OVDD
-1
1.4
0.5
0.4
+1
0.4
V
V
V
µA
V
V
V
V
V
V
SYMBOL
t
SU:STA
t
HD:STA
t
SU:STO
t
LOW
t
HIGH
t
SU:DAT
t
HD:DAT
Write setup time
Write hold time
CONDITIONS
MIN
0.6
0.6
0.6
1.3
0.6
100
0
TYP
MAX
UNITS
µs
µs
µs
µs
µs
ns
ns
All devices are 100% production tested at T
A
= +25ºC. Specifications over temperature are guaranteed by design.
Guaranteed by design.
See the
Typical Operating Characteristics
Maximum Signal Amplitude vs. Supply Voltage for f > 500kHz for more details.
Test circuit
Figure 1.
Test circuit
Figure 2.
Supply voltage and signal amplitude can affect the frequency response of the device. See amplitude frequency stability in
the
Typical Operating Characteristics
for more details.
Note 8:
Test circuit
Figure 3.
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