logic gates triple 3-input nand
| 参数名称 | 属性值 |
| Brand Name | NXP Semiconduc |
| 是否Rohs认证 | 符合 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | SSOP1 |
| 包装说明 | SSOP, SSOP14,.3 |
| 针数 | 14 |
| 制造商包装代码 | SOT337-1 |
| Reach Compliance Code | compli |
| 系列 | HCT |
| JESD-30 代码 | R-PDSO-G14 |
| JESD-609代码 | e4 |
| 长度 | 6.2 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | NAND GATE |
| 最大I（ol） | 0.004 A |
| 湿度敏感等级 | 1 |
| 功能数量 | 3 |
| 输入次数 | 3 |
| 端子数量 | 14 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SSOP |
| 封装等效代码 | SSOP14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH |
| 包装方法 | TUBE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 5 V |
| Prop。Delay @ Nom-Su | 36 ns |
| 传播延迟（tpd） | 36 ns |
| 认证状态 | Not Qualified |
| 施密特触发器 | NO |
| 座面最大高度 | 2 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | NICKEL PALLADIUM GOLD |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 5.3 mm |
| Base Number Matches | 1 |
| 74HCT10DB,112 | 74HC10DB,112 | 74HCT10PW,118 | 74HC10PW,118 | 74HCT10D,652 | 74HCT10D,653 | 74HCT10PW,112 | 74HC10D,653 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | logic gates triple 3-input nand | logic gates triple 3-input nand | logic gates triple 3-input nand | logic gates triple 3-input nand | logic gates triple 3-input nand | logic gates triple 3-input nand | logic gates triple 3-input nand | logic gates triple 3-input nand gate |
| Brand Name | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | SSOP1 | SSOP1 | TSSOP | TSSOP | SOIC | SOIC | TSSOP | SOIC |
| 包装说明 | SSOP, SSOP14,.3 | SSOP, SSOP14,.3 | TSSOP-14 | TSSOP, TSSOP14,.25 | SOP, SOP14,.25 | SOP, | TSSOP, TSSOP14,.25 | SO-14 |
| 针数 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| 制造商包装代码 | SOT337-1 | SOT337-1 | SOT402-1 | SOT402-1 | SOT108-1 | SOT108-1 | SOT402-1 | SOT108-1 |
| Reach Compliance Code | compli | compli | unknow | compli | compliant | compliant | compliant | compliant |
| 系列 | HCT | HC/UH | HCT | HC/UH | HCT | HCT | HCT | HC/UH |
| JESD-30 代码 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 |
| 长度 | 6.2 mm | 6.2 mm | 5 mm | 5 mm | 8.65 mm | 8.65 mm | 5 mm | 8.65 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| 输入次数 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| 端子数量 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SSOP | SSOP | TSSOP | TSSOP | SOP | SOP | TSSOP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
| 传播延迟（tpd） | 36 ns | 29 ns | 36 ns | 29 ns | 36 ns | 36 ns | 36 ns | 29 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2 mm | 2 mm | 1.1 mm | 1.1 mm | 1.75 mm | 1.75 mm | 1.1 mm | 1.75 mm |
| 最大供电电压 (Vsup) | 5.5 V | 6 V | 5.5 V | 6 V | 5.5 V | 5.5 V | 5.5 V | 6 V |
| 最小供电电压 (Vsup) | 4.5 V | 2 V | 4.5 V | 2 V | 4.5 V | 4.5 V | 4.5 V | 2 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL/PALLADIUM/GOLD (NI/PD/AU) | NICKEL PALLADIUM GOLD | NICKEL/PALLADIUM/GOLD (NI/PD/AU) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 1.27 mm | 1.27 mm | 0.65 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
| 宽度 | 5.3 mm | 5.3 mm | 4.4 mm | 4.4 mm | 3.9 mm | 3.9 mm | 4.4 mm | 3.9 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | - | e4 | - |
| 最大I（ol） | 0.004 A | 0.004 A | - | 0.004 A | 0.004 A | - | 0.004 A | 0.004 A |
| 封装等效代码 | SSOP14,.3 | SSOP14,.3 | - | TSSOP14,.25 | SOP14,.25 | - | TSSOP14,.25 | SOP14,.25 |
| 电源 | 5 V | 2/6 V | - | 2/6 V | 5 V | - | 5 V | 2/6 V |
| 施密特触发器 | NO | NO | - | NO | NO | - | NO | NO |
能源基础设施
DSP 与 ARM 处理器
DSP 与 ARM 处理器
PCB设计
微控制器 MCU
微控制器 MCU
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