analog switch ics quad spst cmos ultra-low-leakage
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, SOP16,.25 |
| 针数 | 16 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| Factory Lead Time | 8 weeks |
| 模拟集成电路 - 其他类型 | SPST |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e3 |
| 长度 | 9.9 mm |
| 湿度敏感等级 | 1 |
| 标称负供电电压 (Vsup) | -15 V |
| 正常位置 | NC |
| 信道数量 | 1 |
| 功能数量 | 4 |
| 端子数量 | 16 |
| 标称断态隔离度 | 70 dB |
| 通态电阻匹配规范 | 75 Ω |
| 最大通态电阻 (Ron) | 3500 Ω |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出 | SEPARATE OUTPUT |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP16,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度(摄氏度) | 260 |
| 电源 | +-15 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.75 mm |
| 最大供电电流 (Isup) | 0.25 mA |
| 标称供电电压 (Vsup) | 15 V |
| 表面贴装 | YES |
| 最长断开时间 | 500 ns |
| 最长接通时间 | 1000 ns |
| 切换 | BREAK-BEFORE-MAKE |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 3.9 mm |
| MAX326ESE+T | MAX327ESE+T | MAX326CEE+T | MAX326CSE+T | MAX326CPE+ | MAX326ESE+ | MAX327CPE+ | MAX326CSE+ | |
|---|---|---|---|---|---|---|---|---|
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| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | SOIC | SOIC | SOIC | SOIC | DIP | SOIC | DIP | SOIC |
| 包装说明 | SOP, SOP16,.25 | SOP, SOP16,.25 | SSOP, SSOP16,.25 | SOP, SOP16,.25 | 0.300 INCH, PLASTIC, DIP-16 | SOP, SOP16,.25 | DIP, DIP16,.3 | SOP, SOP16,.25 |
| 针数 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | compli | compli | compli | compli | compli | compli | compli | compliant |
| Factory Lead Time | 8 weeks | 12 weeks | 6 weeks | 6 weeks | 6 weeks | 6 weeks | 6 weeks | 6 weeks |
| 模拟集成电路 - 其他类型 | SPST | SPST | SPST | SPST | SPST | SPST | SPST | SPST |
| JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDIP-T16 | R-PDSO-G16 | R-PDIP-T16 | R-PDSO-G16 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 9.9 mm | 9.9 mm | 4.9 mm | 9.9 mm | 19.175 mm | 9.9 mm | 19.175 mm | 9.9 mm |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
| 正常位置 | NC | NO | NC | NC | NC | NC | NO | NC |
| 信道数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 标称断态隔离度 | 70 dB | 70 dB | 70 dB | 70 dB | 70 dB | 70 dB | 70 dB | 70 dB |
| 通态电阻匹配规范 | 75 Ω | 75 Ω | 75 Ω | 75 Ω | 175 Ω | 75 Ω | 75 Ω | 75 Ω |
| 最大通态电阻 (Ron) | 3500 Ω | 3500 Ω | 3500 Ω | 3500 Ω | 3500 Ω | 3500 Ω | 3500 Ω | 3500 Ω |
| 最高工作温度 | 85 °C | 85 °C | 70 °C | 70 °C | 70 °C | 85 °C | 70 °C | 70 °C |
| 输出 | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | SSOP | SOP | DIP | SOP | DIP | SOP |
| 封装等效代码 | SOP16,.25 | SOP16,.25 | SSOP16,.25 | SOP16,.25 | DIP16,.3 | SOP16,.25 | DIP16,.3 | SOP16,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE |
| 峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
| 电源 | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 4.572 mm | 1.75 mm | 4.572 mm | 1.75 mm |
| 标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | YES | YES | YES | YES | NO | YES | NO | YES |
| 最长断开时间 | 500 ns | 500 ns | 500 ns | 500 ns | 500 ns | 500 ns | 500 ns | 500 ns |
| 最长接通时间 | 1000 ns | 1000 ns | 1000 ns | 1000 ns | 1000 ns | 1000 ns | 1000 ns | 1000 ns |
| 切换 | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Tin (Sn) | Tin (Sn) | Matte Tin (Sn) | Tin (Sn) | Matte Tin (Sn) | Tin (Sn) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING |
| 端子节距 | 1.27 mm | 1.27 mm | 0.635 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | NOT SPECIFIED | NOT SPECIFIED | 30 | 30 | NOT SPECIFIED | NOT SPECIFIED | 30 |
| 宽度 | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 7.62 mm | 3.9 mm | 7.62 mm | 3.9 mm |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | - | - | Maxim(美信半导体) | - |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最大供电电流 (Isup) | 0.25 mA | - | 0.25 mA | 0.25 mA | - | 0.25 mA | - | 0.25 mA |
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