电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

74AUP1G175GM,115

产品描述flip flops 1.8V single schmitt
产品类别逻辑    逻辑   
文件大小218KB,共23页
制造商NXP(恩智浦)
官网地址https://www.nxp.com
标准
下载文档 详细参数 选型对比 全文预览

74AUP1G175GM,115概述

flip flops 1.8V single schmitt

74AUP1G175GM,115规格参数

参数名称属性值
Brand NameNXP Semiconduc
是否Rohs认证符合
零件包装代码SON
包装说明1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, SON-6
针数6
制造商包装代码SOT886
Reach Compliance Codecompli
系列AUP/ULP/V
JESD-30 代码R-PDSO-N6
JESD-609代码e3
长度1.45 mm
负载电容(CL)30 pF
逻辑集成电路类型D FLIP-FLOP
最大频率@ Nom-Su70000000 Hz
最大I(ol)0.0017 A
湿度敏感等级1
位数1
功能数量1
端子数量6
最高工作温度125 °C
最低工作温度-40 °C
输出极性TRUE
封装主体材料PLASTIC/EPOXY
封装代码VSON
封装等效代码SOLCC6,.04,20
封装形状RECTANGULAR
封装形式SMALL OUTLINE, VERY THIN PROFILE
包装方法TAPE AND REEL
峰值回流温度(摄氏度)260
电源1.2/3.3 V
Prop。Delay @ Nom-Su21 ns
传播延迟(tpd)21 ns
认证状态Not Qualified
座面最大高度0.5 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)0.8 V
标称供电电压 (Vsup)1.2 V
表面贴装YES
技术CMOS
温度等级AUTOMOTIVE
端子面层Tin (Sn)
端子形式NO LEAD
端子节距0.5 mm
端子位置DUAL
处于峰值回流温度下的最长时间40
触发器类型POSITIVE EDGE
宽度1 mm
最小 fmax410 MHz
Base Number Matches1

文档预览

下载PDF文档
74AUP1G175
Low-power D-type flip-flop with reset; positive-edge trigger
Rev. 5 — 3 July 2012
Product data sheet
1. General description
The 74AUP1G175 provides a low-power, low-voltage positive-edge triggered D-type
flip-flop with individual data (D) input, clock (CP) input, master reset (MR) input, and Q
output. The master reset (MR) is an asynchronous active LOW input and operates
independently of the clock input. Information on the data input is transferred to the
Q output on the LOW-to-HIGH transition of the clock pulse. The D input must be stable
one set-up time prior to the LOW-to-HIGH clock transition, for predictable operation.
Schmitt trigger action at all inputs makes the circuit tolerant to slower input rise and fall
times across the entire V
CC
range from 0.8 V to 3.6 V. This device ensures a very low
static and dynamic power consumption across the entire V
CC
range from 0.8 V to 3.6 V.
This device is fully specified for partial power-down applications using I
OFF
.
The I
OFF
circuitry disables the output, preventing the damaging backflow current through
the device when it is powered down.
2. Features and benefits
Wide supply voltage range from 0.8 V to 3.6 V
High noise immunity
Complies with JEDEC standards:
JESD8-12 (0.8 V to 1.3 V)
JESD8-11 (0.9 V to 1.65 V)
JESD8-7 (1.2 V to 1.95 V)
JESD8-5 (1.8 V to 2.7 V)
JESD8-B (2.7 V to 3.6 V)
ESD protection:
HBM JESD22-A114F Class 3A exceeds 5000 V
MM JESD22-A115-A exceeds 200 V
CDM JESD22-C101E exceeds 1000 V
Low static power consumption; I
CC
= 0.9
A
(maximum)
Latch-up performance exceeds 100 mA per JESD 78 Class II
Inputs accept voltages up to 3.6 V
Low noise overshoot and undershoot < 10 % of V
CC
I
OFF
circuitry provides partial Power-down mode operation
Multiple package options
Specified from
40 C
to +85
C
and
40 C
to +125
C

74AUP1G175GM,115相似产品对比

74AUP1G175GM,115 74AUP1G175GM,132 74AUP1G175GW,125 74AUP1G175GN,132 74AUP1G175GS,132 74AUP1G175GF,132
描述 flip flops 1.8V single schmitt flip flops flip flop D-type pos-edge 1-elem 6pin flip flops 1.8V single schmitt flip flops 3.6V 12ns xson6 flip flops 3.6V 12ns xson6 flip flops flip flop D-type pos-edge 1-elem 6pin
Brand Name NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconduc
是否Rohs认证 符合 符合 符合 符合 符合 符合
包装说明 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, SON-6 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, SON-6 SOT-363, SC-88, 6 PIN 0.90 X 1 MM, 0.35 MM HEIGHT, SOT-1115, SON-6 1 X 1 MM, 0.35 MM HEIGHT, SOT-1202, SON-6 1 X 1 MM, 0.50 MM HEIGHT, PLASTIC, SOT-891, SON-6
制造商包装代码 SOT886 SOT886 SOT363 SOT1115 SOT1202 SOT891
Reach Compliance Code compli compli compli compli compli compli
零件包装代码 SON SON TSSOP SON - SON
针数 6 6 6 6 - 6
系列 AUP/ULP/V AUP/ULP/V AUP/ULP/V - - AUP/ULP/V
JESD-30 代码 R-PDSO-N6 R-PDSO-N6 R-PDSO-G6 - - R-PDSO-N6
JESD-609代码 e3 e3 e3 - - e3
长度 1.45 mm 1.45 mm 2 mm - - 1 mm
负载电容(CL) 30 pF 30 pF 30 pF - - 30 pF
逻辑集成电路类型 D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP - - D FLIP-FLOP
最大频率@ Nom-Su 70000000 Hz 70000000 Hz 70000000 Hz - - 70000000 Hz
最大I(ol) 0.0017 A 0.0017 A 0.0017 A - - 0.0017 A
湿度敏感等级 1 1 1 - - 1
位数 1 1 1 - - 1
功能数量 1 1 1 - - 1
端子数量 6 6 6 - - 6
最高工作温度 125 °C 125 °C 125 °C - - 125 °C
最低工作温度 -40 °C -40 °C -40 °C - - -40 °C
输出极性 TRUE TRUE TRUE - - TRUE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - - PLASTIC/EPOXY
封装代码 VSON VSON TSSOP - - VSON
封装等效代码 SOLCC6,.04,20 SOLCC6,.04,20 TSSOP6,.08 - - SOLCC6,.04,14
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR - - RECTANGULAR
封装形式 SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - - SMALL OUTLINE, VERY THIN PROFILE
包装方法 TAPE AND REEL TAPE AND REEL TAPE AND REEL - - TAPE AND REEL
峰值回流温度(摄氏度) 260 260 260 - - 260
电源 1.2/3.3 V 1.2/3.3 V 1.2/3.3 V - - 1.2/3.3 V
Prop。Delay @ Nom-Su 21 ns 21 ns 21 ns - - 21 ns
传播延迟(tpd) 21 ns 21 ns 21 ns - - 21 ns
认证状态 Not Qualified Not Qualified Not Qualified - - Not Qualified
座面最大高度 0.5 mm 0.5 mm 1.1 mm - - 0.5 mm
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V - - 3.6 V
最小供电电压 (Vsup) 0.8 V 0.8 V 0.8 V - - 0.8 V
标称供电电压 (Vsup) 1.2 V 1.2 V 1.2 V - - 1.2 V
表面贴装 YES YES YES - - YES
技术 CMOS CMOS CMOS - - CMOS
温度等级 AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE - - AUTOMOTIVE
端子面层 Tin (Sn) Tin (Sn) Tin (Sn) - - Tin (Sn)
端子形式 NO LEAD NO LEAD GULL WING - - NO LEAD
端子节距 0.5 mm 0.5 mm 0.65 mm - - 0.35 mm
端子位置 DUAL DUAL DUAL - - DUAL
处于峰值回流温度下的最长时间 40 40 40 - - 40
触发器类型 POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE - - POSITIVE EDGE
宽度 1 mm 1 mm 1.25 mm - - 1 mm
最小 fmax 410 MHz 410 MHz 410 MHz - - 410 MHz
Base Number Matches 1 - 1 1 1 1

技术资料推荐更多

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 861  2093  221  2803  1232  20  39  12  27  11 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved