ESD Protection (All Pins, Human Body Model)...................Q2kV
Operating Temperature Range ........................ -40NC to +125NC
Junction Temperature .....................................................+150NC
Storage Temperature Range .......................... -65NC to +150NC
Lead Temperature (soldering, 10s) ...............................+300NC
Soldering Temperature (reflow) ......................................+260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TQFN
Junction-to-Ambient Thermal Resistance (B
JA
) ......36.0NC/W
Junction-to-Case Thermal Resistance (B
JC
) ..............3.0NC/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(V
CC
= +3.0V to +3.6V, T
A
= -40NC to +125NC, unless otherwise noted. Typical values are at V
CC
= +3.3V and T
A
= +25NC.) (Note 2)
PARAMETER
Supply Voltage
Standby Supply Current
Operating Current
Temperature Resolution
T
A
= +30NC to +85NC,
T
RJ
= +60NC to +100NC
V
CC
= 3.3V
T
A
, T
RJ
= -40NC to +125NC
T
A
= +30NC to +85NC,
T
RJ
= +100NC to +150NC
T
A
= +30NC to +85NC
V
CC
= 3.3V
T
A
= -40NC to +125NC
T
A
= 0NC to +150NC
T
A
= +30NC to +85NC,
T
RJ
= +60NC to +100NC
V
CC
= 3.3V
T
A
, T
RJ
= -40NC to +125NC
T
A
= +30NC to +85NC,
T
RJ
= +100NC to +125NC
T
A
= +30NC to +85NC
V
CC
= 3.3V
T
A
= -40NC to +125NC
T
A
= 0NC to +150NC
-0.85
-1.2
-2.5
-1
-2
-3
-1
-2
-2.75
-1.5
-2.5
-3.5
SYMBOL
V
CC
I
SS
I
CC1
I
CC2
SMBus static
During conversion, RC off
During conversion, RC on
CONDITIONS
MIN
3.0
4
500
550
11
0.125
+0.85
+1.2
+2.5
+1
+2
+3
+1
+2
+2.75
+1.5
+2.5
+3.5
Maxim Integrated
TYP
MAX
3.6
15
600
650
UNITS
V
FA
FA
Bits
NC
3-Sigma Temperature Accuracy
(Remote Channels 1–7)
NC
3-Sigma Temperature Accuracy
(Local)
NC
6-Sigma Temperature Accuracy
(Remote Channels 1–7)
NC
6-Sigma Temperature Accuracy
(Local)
NC
2
MAX6581
±1°C Accurate 8-Channel Temperature Sensor
ELECTRICAL CHARACTERISTICS (continued)
(V
CC
= +3.0V to +3.6V, T
A
= -40NC to +125NC, unless otherwise noted. Typical values are at V
CC
= +3.3V and T
A
= +25NC.) (Note 2)
PARAMETER
Supply Sensitivity of
Temperature Accuracy
Resistance cancellation mode off
Conversion Time per Channel
t
CONV
Resistance cancellation mode on or beta
compensation on
High level
Low level
Remote-Diode Source Current
I
RJ
High level
Low level
DXP_ and DXN_ Leakage Current
Undervoltage Lockout Threshold
Undervoltage Lockout Hysteresis
Power-On-Reset (POR)
Threshold
POR Threshold Hysteresis
ALERT
and
OVERT
Output Low Voltage
Input Leakage Current
SMBus INTERFACE,
STBY
Logic Input Low Voltage
Logic Input High Voltage
Input Leakage Current
Output Low Voltage
Input Capacitance
Serial-Clock Frequency
Bus Free Time Between STOP
and START Condition
START Condition Setup Time
Repeated START Condition
Setup Time
START Condition Hold Time
STOP Condition Setup Time
Clock Low Period
Clock High Period
Data-In Hold Time
Data-In Setup Time
t
SU:STA
t
HD:STA
t
SU:STO
t
LOW
t
HIGH
t
HD:DAT
t
SU:DAT
(Note 5)
V
OL
C
IN
f
SMBCLK
t
BUF
(Note 4)
f
SMBCLK
= 400kHz
f
SMBCLK
= 400kHz
90% of SMBCLK to 90% of SMBDATA,
f
SMBCLK
= 400kHz
10% of SMBDATA to 90% of SMBCLK,
f
SMBCLK
= 400kHz
90% of SMBCLK to 90% of SMBDATA,
f
SMBCLK
= 400kHz
10% to 10%, f
SMBCLK
= 400kHz
90% to 90%
1.6
0.6
50
0.6
0.6
1
0.6
0
100
0.9
I
SINK
= 6mA
5
400
V
OL
I
LEAK
V
IL
V
IH
V
CC
= 3.6V
V
CC
= 3.0V
2.2
-1
+1
0.1
I
SINK
= 1mA
I
SINK
= 6mA
-1
0.01
0.3
+1
0.8
V
FA
V
V
FA
V
pF
kHz
Fs
Fs
ns
Fs
Fs
Fs
Fs
us
ns
V
CC
falling edge
1.3
UVLO
Resistance cancellation
mode off
Resistance cancellation
mode on or beta
compensation on
95
190
80
8
160
16
2.25
SYMBOL
CONDITIONS
MIN
TYP
Q0.2
125
250
100
10
200
20
2.80
90
2.0
90
2.2
156
312
120
12
240
24
100
2.95
nA
V
mV
V
mV
FA
ms
MAX
UNITS
NC/V
Standby mode
Falling edge of V
CC
disables ADC
SMBus-COMPATIBLE TIMING (Figures 3 and 4) (Note 3)
Maxim Integrated
3
MAX6581
±1°C Accurate 8-Channel Temperature Sensor
ELECTRICAL CHARACTERISTICS (continued)
(V
CC
= +3.0V to +3.6V, T
A
= -40NC to +125NC, unless otherwise noted. Typical values are at V
CC
= +3.3V and T
A
= +25NC.) (Note 2)
PARAMETER
Receive SMBCLK/SMBDATA
Rise Time
Receive SMBCLK/SMBDATA Fall
Time
Data-Out Hold Time
Pulse Width of Spike Suppressed
SMBus Timeout
Note
Note
Note
Note
2:
3:
4:
5:
SYMBOL
t
R
t
F
t
DH
t
SP
t
TIMEOUT
SMBDATA low period for interface reset
50
0
25
37
50
45
CONDITIONS
MIN
TYP
MAX
300
300
UNITS
ns
ns
ns
ns
ms
All parameters are tested at T
A
= +85NC. Specifications over temperature are guaranteed by design.
Timing specifications are guaranteed by design.
The serial interface resets when SMBCLK is low for more than t
TIMEOUT
.
A transition must internally provide at least a hold time to bridge the undefined region (300ns max) of SMBCLK’s falling
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