LMBR120LFT1G Thru LMBR160LFT1G
Schottky Barrier Rectifiers
Reverse Voltage 20 to 60V Forward Current 1.0A
FEATURES
* Plastic package has Underwriters Laboratory
*
*
*
*
Flammability Classification 94V-0
Low power loss,high efficiency
For use in low voltage high frequency inverters,
free wheeling,and polarity protection applications
Guardring for over voltage protection
High temperature soldering guaranteed:
260°C/10 seconds at terminals
Mechanical Data
Case:
SOD123-FL/MINI SMA
molded plastic over sky die
Terminals:
Tin Plated, solderable per
MIL-STD-750, Method 2026
Polarity:
Color band denotes cathode end
Mounting Position
Any
:
Weight:
0.0155 g
Handling precautin
:None
We declare that the material of product is
Haloggen free (green epoxy compound)
1.Electrical Characteristic
Maximum & Thermal Characteristics Ratings
Parameter Symbol
device marking code
Maximum repetitive peak reverse
voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified
current at TC= 75°C
Peak forward surge current 8.3ms
single half sine-wave superimposed on
rated load (JEDEC Method)
Typical thermal resistance (Note 1)
Operating junction temperature range
storage temperature range
V
RRM
V
RMS
V
DC
I
F(AV)
symbol
12L
at 25°C ambient temperature unless otherwise specified.
LMBR140LFT1G
14L
LMBR160LFT1G
16L
LMBR120LFT1G
Unit
20
14
20
40
28
40
1.0
60
42
60
V
V
V
A
I
FSM
RθJ
A
RθJ
C
30
110
40
–55 to +125
–65 to +150
–55 to +150
A
°C/W
°C
°C
T
J
T
STG
Electrical Characteristics Ratings
at 25°C ambient temperature unless otherwise specified.
Parameter Symbol
Maximum instantaneous forward
voltage at(IF = 0.4 A, TJ = 25°C)
(IF = 1.0 A, TJ = 25°C)
Maximum DC reverse current at rated
DC blocking voltage TA = 25°C
Tj = 125°C
Typical junction capacitance at
4.0V, 1MHz
NOTES:
1. 8.0mm2 (.013mm thick) land areas
symbol
LMBR120LFT1G
LMBR140LFT1G
LMBR160LFT1G
Unit
V
F
0.34
0.45
0.10
10
-
0.5
0.03
10
160
-
0.58
V
I
R
C
J
mA
PF
LMBR120LFT1G Thru LMBR160LFT1G
2.Ratings and Characteristic Curves
( TA = 25°C unless otherwise noted )
Fig. 1
–
Forward Current Derating Curve
Average Forward Rectified Current (A)
Peak forward surge current (A)
60 Hz
Resistive or
Inductive Load
Fig. 2
–
Maximum Non-repetitive Peak
Forward Surge Current
TJ = TJ max
8.3ms Single Half
Sine-wave
(JEDEC Method)
1.0
30
0.5
15
0
0
25 50 75 100 125 150 175
CASE TEMPERATURE:Tc(°C)
Fig 3.
–
Typical Instantaneous Forward
Characteristics
Instantaneous Reverse Current (mA)
10
0
1
10
Number of Cycles at 60Hz
Fig 4.
–
Typical Reverse Characteristics
Tj=125
Instantaneous Forward Current (A)
100
10
1
1.0
TJ = 25°C
Pulse width = 300µs
1% Duty Cycle
0.1
0.1
0.01
Tj=25℃
0.01
0.2
0.4
0.6
0.8
1.0
1.2
Instantaneous Forward Voltage (V)
0.001
0
20
40
60
80
Percent of Rated Peak Reverse Voltage (%)
Fig 6.
–
Typical Junction Capacitance
1000
Junction Capacitance (pF)
TJ = 25°C
f = 1.0 MHz
Vsig =
50mVp p
Transient thermal impedance(
°
C/W)
100
Fig 5.
–typical
transient thermal
impedance
10
100
1.0
0.1
0.01
0.1
1.0
10
t,Pulse duration,sec
100
10
0.1
1
Reverse Voltage (V)
10
LMBR120LFT1G Thru LMBR160LFT1G
3. dimension:
SOD123-FL
DIM
A
B
C
D
E
H
J
K
MILLIMETERS
MIN
MAX
3.5
3.9
0.75
0.95
2.6
3.0
1.6
2.0
0.45Typ
0.9
1.2
0.12
0.22
0.8Typ
INCHES
MIN
MAX
0.138
0.159
0.029
0.037
0.103
0.119
0.063
0.079
0.018Typ
0.036
0.047
0.005
0.009
0.032Typ
Suggested solder pad layout
B
A
C
Dimensions in inches and (millimeters)
PACKAGE
SOD123-FL
A
0.044(1.10
B
0.040(1.00)
C
0.079(2.00)
LMBR120LFT1G Thru LMBR160LFT1G
Reel packing
INNER BOX
(mm)
183*183*123
REEL DIA.
(mm)
178
CARTON SIZE
(mm)
382*262*387
CARTON
(PCS)
240,000
APPOX.
GROSS WEIGHT
(kg)
8.7
5.Suggested thermal profile for soldering process
1. Storage environment：Temperature=5~40℃ Humidity=55±25%
2. Reflow soldering of surface-mount device
3. Reflow soldering
Profile Feature
Average ramp-up rate(T
L
to T
P
)
Preheat
- Temperature Min(Tsmin)
- Temperature Max(Tsmax)
- Time(min to max)(t
s
)
Tsmax to T
L
- Ramp-up Rate
Time maintained above:
- Temperature (T
L
)
- Time(t
L
)
Peak Temperature(T
P
)
Time within 5℃ of actual Peak
Temperature(T
P
)
Ramp-down Rate
Time 25℃ to Peak Temperature
217℃
60-260sec
255 -0/+5℃
10~30sec
<6℃/sec
<6minutes
<3sec
150℃
200℃
60~120sec
Soldering Condition
<3℃/sec
LMBR120LFT1G Thru LMBR160LFT1G
6.High reliability test capabilities
Item Test
Solder Resistance
Solderability
High Temperature Reverse Bias
Forward Operation Life
Condition
at 260±5℃ for 10±2sec immerse
body into solder 1/16" ± 1/32"
at 245±5℃ for 5 sec
V
R
=80% rate at T
j
=150℃ for 168hrs
Rated average rectifier current
T
A
=25℃ for 500hrs
T
A
=25℃，I
F
=I
O
On state:power on for 5 min.
Off state:power off for 5 min.
on and off for 500 cycles
15P
SIG
at T
A
=121℃ for 4hrs
Reference
MIL-STD-750D METHOD-2031
MIL-STD-202F METHOD-208
MIL-STD-750D METHOD-1038
MIL-STD-750D METHOD-1027
Intermittent Operation Life
MIL-STD-750D METHOD-1036
Pressure Cooker
JESD22-A102
Temperature Cycling
-55℃ to +125℃ dwelled for 30 min.
and transferred for 5min. Total 10 cycles
0℃ for 5min. Rise to 100℃ for 5min.
Total 10 cycles
8.3ms single half sine-wave
superimposed on rated load,one surge
at T
A
=85℃，R
H
=85% for 1000hrs
at 175℃ for 1000hrs
MIL-STD-750D METHOD-1051
Thermal Shock
MIL-STD-750D METHOD-1056
Forward Surge
Humidity
High Temperature Storage Life
MIL-STD-750D METHOD-4066-2
MIL-STD-750D METHOD-1021
MIL-STD-750D METHOD-1031
测试/测量
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