IC Socket, SIP5, 5 Contact(s), 2.54mm Term Pitch, Solder
参数名称 | 属性值 |
厂商名称 | SMP Technology Inc |
Reach Compliance Code | unknown |
其他特性 | ROHS COMPLIANT |
主体深度 | 0.167 inch |
主体长度 | 0.5 inch |
联系完成配合 | AU ON NI |
联系完成终止 | TIN |
触点材料 | BE-CU |
触点样式 | RND PIN-SKT |
目前评级 | 3 A |
设备插槽类型 | IC SOCKET |
使用的设备类型 | SIP5 |
介电耐压 | 1000VAC V |
外壳材料 | GLASS FILLED POLYESTER |
绝缘电阻 | 1000000000 Ω |
制造商序列号 | B015 |
插接触点节距 | 0.1 inch |
安装方式 | STRAIGHT |
触点数 | 5 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
PCB接触模式 | RECTANGULAR |
端子节距 | 2.54 mm |
端接类型 | SOLDER |
Base Number Matches | 1 |
B015-0500-017-Z | B015-0300-017-Z | B015-0500-029-Z | VJ05006-BX223AMMMB | B015-0100-029-Z | B015-0200-029-Z | B015-0800-029-Z | B015-0900-029-Z | |
---|---|---|---|---|---|---|---|---|
描述 | IC Socket, SIP5, 5 Contact(s), 2.54mm Term Pitch, Solder | IC Socket, SIP3, 3 Contact(s), 2.54mm Term Pitch, Solder | IC Socket, SIP5, 5 Contact(s), 2.54mm Term Pitch, Solder | CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.022 uF, SURFACE MOUNT, 0805, CHIP, LEAD/ROHS COMPLIANT | IC Socket, SIP1, 1 Contact(s), 2.54mm Term Pitch, Solder | IC Socket, SIP2, 2 Contact(s), 2.54mm Term Pitch, Solder | IC Socket, SIP8, 8 Contact(s), 2.54mm Term Pitch, Solder | IC Socket, SIP9, 9 Contact(s), 2.54mm Term Pitch, Solder |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
制造商序列号 | B015 | B015 | B015 | VJ | B015 | B015 | B015 | B015 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
厂商名称 | SMP Technology Inc | SMP Technology Inc | SMP Technology Inc | - | SMP Technology Inc | SMP Technology Inc | - | - |
其他特性 | ROHS COMPLIANT | ROHS COMPLIANT | ROHS COMPLIANT | - | ROHS COMPLIANT | ROHS COMPLIANT | ROHS COMPLIANT | ROHS COMPLIANT |
主体深度 | 0.167 inch | 0.167 inch | 0.167 inch | - | 0.167 inch | 0.167 inch | 0.167 inch | 0.167 inch |
主体长度 | 0.5 inch | 0.3 inch | 0.5 inch | - | 0.1 inch | 0.2 inch | 0.8 inch | 0.9 inch |
联系完成配合 | AU ON NI | AU ON NI | AU ON NI | - | AU ON NI | AU ON NI | AU ON NI | AU ON NI |
联系完成终止 | TIN | TIN | TIN | - | TIN | TIN | TIN | TIN |
触点材料 | BE-CU | BE-CU | BE-CU | - | BE-CU | BE-CU | BE-CU | BE-CU |
触点样式 | RND PIN-SKT | RND PIN-SKT | RND PIN-SKT | - | RND PIN-SKT | RND PIN-SKT | RND PIN-SKT | RND PIN-SKT |
目前评级 | 3 A | 3 A | 3 A | - | 3 A | 3 A | 3 A | 3 A |
设备插槽类型 | IC SOCKET | IC SOCKET | IC SOCKET | - | IC SOCKET | IC SOCKET | IC SOCKET | IC SOCKET |
使用的设备类型 | SIP5 | SIP3 | SIP5 | - | SIP1 | SIP2 | SIP8 | SIP9 |
介电耐压 | 1000VAC V | 1000VAC V | 1000VAC V | - | 1000VAC V | 1000VAC V | 1000VAC V | 1000VAC V |
外壳材料 | GLASS FILLED POLYESTER | GLASS FILLED POLYESTER | GLASS FILLED POLYESTER | - | GLASS FILLED POLYESTER | GLASS FILLED POLYESTER | GLASS FILLED POLYESTER | GLASS FILLED POLYESTER |
绝缘电阻 | 1000000000 Ω | 1000000000 Ω | 1000000000 Ω | - | 1000000000 Ω | 1000000000 Ω | 1000000000 Ω | 1000000000 Ω |
插接触点节距 | 0.1 inch | 0.1 inch | 0.1 inch | - | 0.1 inch | 0.1 inch | 0.1 inch | 0.1 inch |
安装方式 | STRAIGHT | STRAIGHT | STRAIGHT | - | STRAIGHT | STRAIGHT | STRAIGHT | STRAIGHT |
触点数 | 5 | 3 | 5 | - | 1 | 2 | 8 | 9 |
PCB接触模式 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | - | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端接类型 | SOLDER | SOLDER | SOLDER | - | SOLDER | SOLDER | SOLDER | SOLDER |
ECCN代码 | - | - | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved