Multiplexer, AC Series, 4-Func, 2 Line Input, 1 Line Output, Inverted Output, CMOS, CQCC20, CERAMIC, LCC-20
| 参数名称 | 属性值 |
| 包装说明 | QCCN, |
| Reach Compliance Code | unknow |
| 系列 | AC |
| JESD-30 代码 | S-CQCC-N20 |
| 长度 | 8.89 mm |
| 逻辑集成电路类型 | MULTIPLEXER |
| 功能数量 | 4 |
| 输入次数 | 2 |
| 输出次数 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | INVERTED |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 传播延迟（tpd） | 14 ns |
| 座面最大高度 | 2.54 mm |
| 最大供电电压 (Vsup) | 6 V |
| 最小供电电压 (Vsup) | 2 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 宽度 | 8.89 mm |
| Base Number Matches | 1 |
| 54AC258LM | 74ACT258PCQR | 74AC258PCQR | 74AC258SC | 74AC258SCQR | |
|---|---|---|---|---|---|
| 描述 | Multiplexer, AC Series, 4-Func, 2 Line Input, 1 Line Output, Inverted Output, CMOS, CQCC20, CERAMIC, LCC-20 | Multiplexer, ACT Series, 4-Func, 2 Line Input, 1 Line Output, Inverted Output, CMOS, PDIP16, PLASTIC, DIP-16 | Multiplexer, AC Series, 4-Func, 2 Line Input, 1 Line Output, Inverted Output, CMOS, PDIP16, PLASTIC, DIP-16 | Multiplexer, AC Series, 4-Func, 2 Line Input, 1 Line Output, Inverted Output, CMOS, PDSO16, SOIC-16 | Multiplexer, AC Series, 4-Func, 2 Line Input, 1 Line Output, Inverted Output, CMOS, PDSO16, SOIC-16 |
| 包装说明 | QCCN, | DIP, | DIP, | SOP, | SOP, |
| Reach Compliance Code | unknow | unknown | unknown | unknown | unknown |
| 系列 | AC | - | AC | AC | AC |
| JESD-30 代码 | S-CQCC-N20 | - | R-PDIP-T16 | R-PDSO-G16 | R-PDSO-G16 |
| 长度 | 8.89 mm | - | 19.05 mm | 9.9 mm | 9.9 mm |
| 逻辑集成电路类型 | MULTIPLEXER | - | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
| 功能数量 | 4 | - | 4 | 4 | 4 |
| 输入次数 | 2 | - | 2 | 2 | 2 |
| 输出次数 | 1 | - | 1 | 1 | 1 |
| 端子数量 | 20 | - | 16 | 16 | 16 |
| 最高工作温度 | 125 °C | - | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -55 °C | - | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | INVERTED | - | INVERTED | INVERTED | INVERTED |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCN | - | DIP | SOP | SOP |
| 封装形状 | SQUARE | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | - | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
| 传播延迟（tpd） | 14 ns | - | 13 ns | 13 ns | 13 ns |
| 座面最大高度 | 2.54 mm | - | 5.08 mm | 1.75 mm | 1.75 mm |
| 最大供电电压 (Vsup) | 6 V | - | 6 V | 6 V | 6 V |
| 最小供电电压 (Vsup) | 2 V | - | 2 V | 2 V | 2 V |
| 表面贴装 | YES | - | NO | YES | YES |
| 技术 | CMOS | - | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | NO LEAD | - | THROUGH-HOLE | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | - | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | - | DUAL | DUAL | DUAL |
| 宽度 | 8.89 mm | - | 7.62 mm | 3.9 mm | 3.9 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | - |
| 厂商名称 | - | Rochester Electronics | Rochester Electronics | - | Rochester Electronics |
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