HCS573K/SAMPLE概述

Bus Driver, HC/UH Series, 1-Func, 8-Bit, True Output, CMOS, CDFP20

HCS573K/SAMPLE规格参数

参数名称	属性值
厂商名称	Harris
包装说明	,
Reach Compliance Code	unknown
其他特性	BROADSIDE VERSION OF 373
系列	HC/UH
JESD-30 代码	R-CDFP-F20
负载电容（CL）	50 pF
逻辑集成电路类型	BUS DRIVER
位数	8
功能数量	1
端口数量	2
端子数量	20
输出特性	3-STATE
输出极性	TRUE
封装主体材料	CERAMIC, METAL-SEALED COFIRED
封装形状	RECTANGULAR
封装形式	FLATPACK
传播延迟（tpd）	31 ns
认证状态	Not Qualified
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	4.5 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
端子形式	FLAT
端子位置	DUAL
Base Number Matches	1

文档预览

下载PDF文档

全文
预览

HCS573K/SAMPLE相似产品对比

	HCS573K/SAMPLE	5962R9579401VRC	5962R9579401VXC	HCS573HMSR	5962R9579401V9A	HCS573D/SAMPLE	HCS573DMSR
描述	Bus Driver, HC/UH Series, 1-Func, 8-Bit, True Output, CMOS, CDFP20	Bus Driver, HC/UH Series, 1-Func, 8-Bit, True Output, CMOS, CDIP20	Bus Driver, HC/UH Series, 1-Func, 8-Bit, True Output, CMOS, CDFP20, CERAMIC, DFP-20	Bus Driver, HC/UH Series, 1-Func, 8-Bit, True Output, CMOS	Bus Driver, HC/UH Series, 1-Func, 8-Bit, True Output, CMOS	Bus Driver, HC/UH Series, 1-Func, 8-Bit, True Output, CMOS, CDIP20	Bus Driver, HC/UH Series, 1-Func, 8-Bit, True Output, CMOS, CDIP20
Reach Compliance Code	unknown	unknow	unknown	unknown	unknown	unknown	unknown
其他特性	BROADSIDE VERSION OF 373	BROADSIDE VERSION OF 373	BROADSIDE VERSION OF 373	BROADSIDE VERSION OF 373	BROADSIDE VERSION OF 373	BROADSIDE VERSION OF 373	BROADSIDE VERSION OF 373
系列	HC/UH	HC/UH	HC/UH	HC/UH	HC/UH	HC/UH	HC/UH
JESD-30 代码	R-CDFP-F20	R-CDIP-T20	R-CDFP-F20	X-XUUC-N20	X-XUUC-N20	R-CDIP-T20	R-CDIP-T20
负载电容（CL）	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF
逻辑集成电路类型	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER
位数	8	8	8	8	8	8	8
功能数量	1	1	1	1	1	1	1
端口数量	2	2	2	2	2	2	2
端子数量	20	20	20	20	20	20	20
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
输出极性	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE
封装主体材料	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	UNSPECIFIED	UNSPECIFIED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	UNSPECIFIED	UNSPECIFIED	RECTANGULAR	RECTANGULAR
封装形式	FLATPACK	IN-LINE	FLATPACK	UNCASED CHIP	UNCASED CHIP	IN-LINE	IN-LINE
传播延迟（tpd）	31 ns	40 ns	40 ns	31 ns	31 ns	31 ns	40 ns
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	NO	YES	YES	YES	NO	NO
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
端子形式	FLAT	THROUGH-HOLE	FLAT	NO LEAD	NO LEAD	THROUGH-HOLE	THROUGH-HOLE
端子位置	DUAL	DUAL	DUAL	UPPER	UPPER	DUAL	DUAL
Base Number Matches	1	1	1	1	1	1	1
厂商名称	Harris	-	Harris	Harris	Harris	Harris	Harris
JESD-609代码	-	e4	e4	-	e0	-	e0
最高工作温度	-	125 °C	125 °C	125 °C	125 °C	-	125 °C
最低工作温度	-	-55 °C	-55 °C	-55 °C	-55 °C	-	-55 °C
温度等级	-	MILITARY	MILITARY	MILITARY	MILITARY	-	MILITARY
端子面层	-	GOLD	GOLD	-	TIN LEAD	-	Tin/Lead (Sn/Pb)
总剂量	-	100k Rad(Si) V	100k Rad(Si) V	-	100k Rad(Si) V	-	200k Rad(Si) V

推荐资源

器件捷径: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

热门器件

开源项目推荐更多

热门活动更多

热门文章更多

技术资料推荐更多