Regulator, 1 Output, CMOS,
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
Reach Compliance Code | unknow |
Is Samacsys | N |
可调性 | FIXED |
标称回动电压 1 | 0.1 V |
最大绝对输入电压 | 28 V |
JESD-609代码 | e0 |
最大负载调整率 | 0.1% |
输出次数 | 1 |
端子数量 | 3 |
最高工作温度 | 70 °C |
最低工作温度 | |
最大输出电流 1 | 0.03 A |
标称输出电压 1 | 3.6 V |
封装主体材料 | PLASTIC/EPOXY |
封装等效代码 | TO-243 |
认证状态 | Not Qualified |
表面贴装 | YES |
技术 | CMOS |
端子面层 | Tin/Lead (Sn/Pb) |
最大电压容差 | 5% |
Base Number Matches | 1 |
HT7136(SOT89) | HT71C0(TO92) | HT7133(SOT89) | HT7136(TO92) | HT71C0(SOT89) | HT71C0A | HT7150(SOT89) | HT7133(TO92) | HT7144(TO92) | |
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描述 | Regulator, 1 Output, CMOS, | Regulator, 1 Output, CMOS, | Regulator, 1 Output, CMOS, | Regulator, 1 Output, CMOS, | Regulator, 1 Output, CMOS, | Micro Peripheral IC | Regulator, 1 Output, CMOS, | Regulator, 1 Output, CMOS, | Micro Peripheral IC |
Reach Compliance Code | unknow | compliant | unknown | unknown | compliant | unknown | unknown | unknown | unknown |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | - | 不符合 | 不符合 | - |
可调性 | FIXED | FIXED | FIXED | FIXED | FIXED | - | FIXED | FIXED | - |
标称回动电压 1 | 0.1 V | 0.1 V | 0.1 V | 0.1 V | 0.1 V | - | 0.1 V | 0.1 V | - |
最大绝对输入电压 | 28 V | 28 V | 28 V | 28 V | 28 V | - | 28 V | 28 V | - |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | - | e0 | e0 | - |
最大负载调整率 | 0.1% | 0.15% | 0.1% | 0.1% | 0.15% | - | 0.1% | 0.1% | - |
输出次数 | 1 | 1 | 1 | 1 | 1 | - | 1 | 1 | - |
端子数量 | 3 | 3 | 3 | 3 | 3 | - | 3 | 3 | - |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | - | 70 °C | 70 °C | - |
最大输出电流 1 | 0.03 A | 0.03 A | 0.03 A | 0.03 A | 0.03 A | - | 0.03 A | 0.03 A | - |
标称输出电压 1 | 3.6 V | 12 V | 3.3 V | 3.6 V | 12 V | - | 5 V | 3.3 V | - |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
封装等效代码 | TO-243 | TO-243 | TO-243 | SIP3,.1,50 | TO-243 | - | TO-243 | SIP3,.1,50 | - |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | - |
表面贴装 | YES | YES | YES | NO | YES | - | YES | NO | - |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | - | CMOS | CMOS | - |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
最大电压容差 | 5% | 5% | 5% | 5% | 5% | - | 5% | 5% | - |
厂商名称 | - | Holtek(合泰) | Holtek(合泰) | Holtek(合泰) | Holtek(合泰) | Holtek(合泰) | Holtek(合泰) | Holtek(合泰) | Holtek(合泰) |
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