IC 8-BIT, UVPROM, 12 MHz, MICROCONTROLLER, CDIP24, CERAMIC, DIP-24, Microcontroller
| 参数名称 | 属性值 |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 24 |
| Reach Compliance Code | unknow |
| ECCN代码 | 3A001.A.2.C |
| 具有ADC | NO |
| 地址总线宽度 | 11 |
| 位大小 | 8 |
| 最大时钟频率 | 12 MHz |
| DAC 通道 | NO |
| DMA 通道 | NO |
| 外部数据总线宽度 | 8 |
| JESD-30 代码 | R-GDIP-T24 |
| JESD-609代码 | e0 |
| I/O 线路数量 | 19 |
| 端子数量 | 24 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| PWM 通道 | NO |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 认证状态 | Not Qualified |
| ROM可编程性 | UVPROM |
| 筛选级别 | MIL-STD-883 |
| 座面最大高度 | 5.08 mm |
| 速度 | 12 MHz |
| 最大压摆率 | 18.5 mA |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER |
| Base Number Matches | 1 |
| 5962-9156601MLA | 87C751/BLAOT | 87C751/BLA | 87C751-16/BLAOT | 87C751-16/BLA | |
|---|---|---|---|---|---|
| 描述 | IC 8-BIT, UVPROM, 12 MHz, MICROCONTROLLER, CDIP24, CERAMIC, DIP-24, Microcontroller | IC 8-BIT, OTPROM, MICROCONTROLLER, CDIP24, 0.300 INCH, SKINNY, CERAMIC, DIP-24, Microcontroller | IC 8-BIT, OTPROM, MICROCONTROLLER, CDIP24, 0.300 INCH, WINDOWED, CERAMIC, DIP-24, Microcontroller | IC 8-BIT, OTPROM, 16 MHz, MICROCONTROLLER, CDIP24, 0.300 INCH, SKINNY, CERAMIC, DIP-24, Microcontroller | IC 8-BIT, OTPROM, 16 MHz, MICROCONTROLLER, CDIP24, 0.300 INCH, WINDOWED, CERAMIC, DIP-24, Microcontroller |
| 零件包装代码 | DIP | DIP | DIP | DIP | DIP |
| 包装说明 | DIP, | DIP, | WDIP, | DIP, | WDIP, |
| 针数 | 24 | 24 | 24 | 24 | 24 |
| Reach Compliance Code | unknow | unknown | unknown | unknown | unknown |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| 具有ADC | NO | NO | NO | NO | NO |
| 地址总线宽度 | 11 | 11 | 11 | 11 | 11 |
| 位大小 | 8 | 8 | 8 | 8 | 8 |
| 最大时钟频率 | 12 MHz | 12 MHz | 12 MHz | 16 MHz | 16 MHz |
| DAC 通道 | NO | NO | NO | NO | NO |
| DMA 通道 | NO | NO | NO | NO | NO |
| 外部数据总线宽度 | 8 | 8 | 8 | 8 | 8 |
| JESD-30 代码 | R-GDIP-T24 | R-GDIP-T24 | R-GDIP-T24 | R-GDIP-T24 | R-GDIP-T24 |
| I/O 线路数量 | 19 | 19 | 19 | 19 | 19 |
| 端子数量 | 24 | 24 | 24 | 24 | 24 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| PWM 通道 | NO | NO | NO | NO | NO |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | DIP | WDIP | DIP | WDIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE, WINDOW | IN-LINE | IN-LINE, WINDOW |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| ROM可编程性 | UVPROM | OTPROM | OTPROM | OTPROM | OTPROM |
| 座面最大高度 | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm |
| 最大压摆率 | 18.5 mA | 18.5 mA | 18.5 mA | 22 mA | 22 mA |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 表面贴装 | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
| 速度 | 12 MHz | - | - | 16 MHz | 16 MHz |
| Base Number Matches | 1 | 1 | 1 | 1 | - |
| 厂商名称 | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
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