电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

2220Y0160275GRT

产品描述Ceramic Capacitor, Multilayer, Ceramic, 16V, 2% +Tol, 2% -Tol, BZ, 15% TC, 2.7uF, Surface Mount, 2220, CHIP, ROHS COMPLIANT
产品类别无源元件    电容器   
文件大小414KB,共3页
制造商Knowles
官网地址http://www.knowles.com
标准
下载文档 详细参数 全文预览

2220Y0160275GRT概述

Ceramic Capacitor, Multilayer, Ceramic, 16V, 2% +Tol, 2% -Tol, BZ, 15% TC, 2.7uF, Surface Mount, 2220, CHIP, ROHS COMPLIANT

2220Y0160275GRT规格参数

参数名称属性值
是否Rohs认证符合
Objectid1171989285
包装说明, 2220
Reach Compliance Codecompliant
Country Of OriginMainland China
ECCN代码EAR99
YTEOL6.82
电容2.7 µF
电容器类型CERAMIC CAPACITOR
介电材料CERAMIC
JESD-609代码e3
制造商序列号X7R
安装特点SURFACE MOUNT
多层Yes
负容差2%
端子数量2
最高工作温度125 °C
最低工作温度-55 °C
封装形状RECTANGULAR PACKAGE
包装方法TR, 7 INCH
正容差2%
额定(直流)电压(URdc)16 V
参考标准IECQ-CECC
尺寸代码2220
表面贴装YES
温度特性代码BZ
温度系数15% ppm/°C
端子面层Matte Tin (Sn) - with Nickel (Ni) barrier
端子形状WRAPAROUND

文档预览

下载PDF文档
Open Mode and Tandem capacitors
X7R
Speciality High Rel. and approved parts
IECQ-CECC ranges
Open Mode capacitors have been designed specifically
for use in applications where mechanical cracking is a
severe problem and short circuits due to cracking are
unacceptable.
Open Mode capacitors use inset electrode margins,
which prevent any mechanical cracks which may form
during board assembly from connecting to the internal
electrodes.
When combined with Syfer’s FlexiCap™ termination, Syfer
Open Mode capacitors provide a robust component with the
assurance that if a part becomes cracked, the crack will be
unlikely to result in short circuit failure.
A range of specialist high reliability MLCC’s for use in
critical or high reliability environments. All fully tested
/ approved and available with a range of suitable
termination options, including tin/lead plating and
Syfer Flexicap™.
Ranges include :-
1. Range tested and approved in accordance with
IECQ-CECC QC32100.
2. Range qualified to the requirements of AEC-Q200.
3. Range qualified to the requirements of ESCC 3009
European Space Specification.
Open Mode max capacitance
(X7R only)
0603 0805 1206 1210 1812 2220 2225
16V
25V
50/63V
100V
200/
250V
Open Mode capacitor -
IECQ-CECC - maximum capacitance values
Qualification included cracking the components by severe bend tests.
Following the bend tests cracked components were subjected to
endurance / humidity tests, with no failures evident due to short circuits.
Note: Depending on the severity of the crack, capacitance loss was
between 0% and 70%.
39nF
33nF
22nF
6.8nF
2.7nF
150nF
120nF
100nF
27nF
15nF
470nF
330nF
220nF
100nF
68nF
680nF
560nF
470nF
220nF
100nF
1.5µF
1.2µF
1.0µF
680nF
330nF
3.3µF
2.2µF
1.5µF
1.0µF
680nF
4.7µF
3.9µF
2.7µF
1.8µF
1.0µF
0603
16V
25V
50/63V
C0G/NP0
X7R
C0G/NP0
X7R
C0G/NP0
X7R
C0G/NP0
X7R
C0G/NP0
X7R
C0G/NP0
X7R
C0G/NP0
X7R
1.5nF
100nF
1.0nF
56nF
470pF
47nF
330pF
10nF
100pF
5.6nF
n/a
n/a
n/a
n/a
0805
6.8nF
330nF
4.7nF
220nF
2.7nF
220nF
1.8nF
47nF
680pF
27nF
330pF
8.2nF
n/a
n/a
1206
22nF
1.0µF
15nF
820nF
10nF
470nF
6.8nF
150nF
2.2nF
100nF
1.5nF
33nF
470pF
4.7nF
1210
33nF
1.5µF
22nF
1.2µF
18nF
1.0µF
12nF
470nF
4.7nF
220nF
3.3nF
100nF
1.0nF
15nF
1808
33nF
1.5µF
27nF
1.2µF
18nF
680nF
12nF
330nF
4.7nF
180nF
3.3nF
100nF
1.2nF
18nF
1812
100nF
3.3µF
68nF
2.2µF
33nF
1.5µF
27nF
1.0µF
12nF
470nF
10nF
270nF
3.3nF
56nF
2220
150nF
5.6µF
100nF
4.7µF
68nF
2.2µF
47nF
1.5µF
22nF
1.0µF
15nF
560nF
8.2nF
120nF
2225
220nF
6.8µF
150nF
5.6µF
100nF
3.3µF
68nF
1.5µF
27nF
1.0µF
22nF
820nF
10nF
150nF
Tandem Capacitors have been designed as a fail
safe range using a series section internal design, for
use in any application where short circuits would be
unacceptable.
When combined with Syfer’s FlexiCap™ termination, Syfer
Tandem capacitors provide an ultra robust and reliable
component, for use in the most demanding applications.
100V
200V
500V
Tandem max capacitance
(X7R only)
0603 0805 1206 1210 1812 2220 2225
16V
25V
50/63V
100V
200/
250V
1kV
1.2µF
1.0µF
680nF
470nF
220nF
1.5µF
1.2µF
1.0µF
680nF
330nF
Qualification included cracking the components by severe bend tests.
Following the bend tests cracked components were subjected to
endurance / humidity tests, with no failures evident due to short circuits.
Note: Depending on the severity of the crack, capacitance loss was
between 0% and 50%.
Chip
size
12nF
10nF
6.8nF
2.2nF
1.0nF
47nF
39nF
33nF
10nF
4.7nF
150nF
120nF
100nF
47nF
22nF
270nF
220nF
180nF
82nF
47nF
560nF
470nF
390nF
220nF
100nF
Tandem capacitor -
Ordering information - IECQ-CECC ranges
1210
Y
Termination
100
Voltage
0103
Capacitance in
picofarads (pF)
First digit is 0.
Second and third
digits are significant
figures of capacitance
code.
The fourth digit is
number of zeros
following
Example:
0103 = 10nF
J
Capacitance
tolerance
<10pF
B = ±0.1pF
C = ±0.25pF
D = ±0.5pF
> 10pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
D
Dielectric
Release codes
D
= X7R
(2R1) with IECQ-
CECC release
F
= C0G/NP0
(1B/NP0) with IECQ-
CECC release
B
= 2X1/
BX released in
accordance with
IECQ-CECC
R
= 2C1/
BZ released in
accordance with
IECQ-CECC
T
Packaging
___
Suffix
code
Used for
specific
customer
require-
ments
Y
= FlexiCap
TM
termination base with Ni
barrier (100% matte tin
plating). RoHS compliant.
H
= FlexiCap
TM
termination base with Ni
barrier (Tin/lead plating
with min. 10% lead).
F
= Silver Palladium. RoHS
compliant.
J
= Silver base with nickel
barrier (100% matte tin
plating). RoHS compliant.
A
= Silver base with nickel
barrier (Tin/lead plating
with min. 10% lead).
Ordering information - Open Mode and Tandem capacitors
1206
Chip
size
0603
0805
1206
1210
1812
2220
2225
Y
Termination
Y
= Polymer
Termination
FlexiCap™
050
Voltage
016 = 16V
025 = 25V
050 = 50V
063 = 63V
100 = 100V
200 = 200V
250 = 250V
0224
Capacitance in
picofarads (pF)
First digit is 0. Second
and third digits are
significant figures of
capacitance code.
The fourth digit is
number of zeros
following.
Example:
0224 = 220000pF
K
Capacitance
tolerance
K = ±10%
X
Dielectric
codes
X
= X7R
E
= X7R
(AEC-Q200
product)
T
Packaging
T
= 178mm
(7”) reel
R
= 330mm
(13”) reel
___
Suffix
M01
=
Syfer
Open Mode
capacitor
T01
=
Syfer
Tandem
capacitor
016 = 16V
025 = 25V
050 = 50V
063 = 63V
100 = 100V
200 = 200V
250 = 250V
500 = 500V
630 = 630V
1K0 = 1kV
T
= 178mm
(7”) reel
R
= 330mm
(13”) reel
B
= Bulk
pack - tubs
26
27
问个简单问题:如何生成可以烧录到nor flash里的bootloader目标代码?
我用的pb5.0. 有一个三星的s3c2410的bsp. 想编译连接生成可烧录到norflash里的目标代码,这样我可以使用eboot用网口下载系统映像. 关键是我不知道怎么去编译这个bsp. 哪位高人给说明一个. ......
mymehis 嵌入式系统
电流采样的几种方式
电流采样的几种方式 1.直接用采样电阻,ADC测量电阻上面的压降,不经过运放等处理电路 2.用采样电阻,ADC测量电阻上面的压降,经过运放等处理电路,比如差分放大、跟随器等 3.电表、智能 ......
QWE4562009 分立器件
陶瓷电容快速选型指南,这些你都知道吗?
陶瓷电容凭借耐热性能好、绝缘性能优良、结构简单、价格低廉等优点,应用日趋广泛,可是由于产品型号繁多,在选型时难免让人眼花缭乱。如何能够针对设计要求和应用场景,快速地锁定你想要的那颗 ......
eric_wang 综合技术交流
PCB设计进行噪声预算,你得搞懂电压容限
在高速pcb设计中,有很大一部分工作是进行噪声预算,规划系统各种噪声源产生噪声大小。这就涉及到一个非常基础但十分重要的概念:电压容限。 电压容限是指驱动器的输出与接收端输入在最坏情况 ......
jdbpcb00 PCB设计
各位高手,求高速整形芯片
各位高手,能否推荐一款高频整形芯片,输入是窄脉冲,要求输出时矩形波,74系列的整形芯片行不行?请高手指点~~多谢啦...
leizikobe FPGA/CPLD
QFN封装的组装和PCB布局指南
前言 双排或多排QFN封装是近似于芯片级塑封的封装,其基板上有铜引线框架。底部上面裸露的芯片粘附焊盘会有效地将热量传递给PCB,并且通过下面的键合提供 稳定的接地或通过导电芯片粘附材料形 ......
xiaoxin1 PCB设计

技术资料推荐更多

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1571  873  1953  2646  493  32  18  40  54  10 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved