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MT58L128L32D1F-6: 产品描述Cache SRAM, 128KX32, 3.5ns, CMOS, PBGA165, FBGA-165; 产品类别存储存储; 文件大小440KB，共26页; 制造商Micron Technology; 官网地址http://www.mdtic.com.tw/

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MT58L128L32D1F-6概述

Cache SRAM, 128KX32, 3.5ns, CMOS, PBGA165, FBGA-165

MT58L128L32D1F-6规格参数

参数名称	属性值
是否Rohs认证	不符合
厂商名称	Micron Technology
零件包装代码	BGA
包装说明	FBGA-165
针数	165
Reach Compliance Code	unknown
ECCN代码	3A991.B.2.A
Factory Lead Time	1 week
最长访问时间	3.5 ns
其他特性	PIPELINED ARCHITECTURE
最大时钟频率 (fCLK)	166 MHz
I/O 类型	COMMON
JESD-30 代码	R-PBGA-B165
JESD-609代码	e0
长度	15 mm
内存密度	4194304 bit
内存集成电路类型	CACHE SRAM
内存宽度	32
功能数量	1
端子数量	165
字数	131072 words
字数代码	128000
工作模式	SYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	128KX32
输出特性	3-STATE
封装主体材料	PLASTIC/EPOXY
封装代码	TBGA
封装等效代码	BGA165,11X15,40
封装形状	RECTANGULAR
封装形式	GRID ARRAY, THIN PROFILE
并行/串行	PARALLEL
电源	3.3 V
认证状态	Not Qualified
座面最大高度	1.2 mm
最大待机电流	0.01 A
最小待机电流	3.14 V
最大压摆率	0.475 mA
最大供电电压 (Vsup)	3.6 V
最小供电电压 (Vsup)	3.135 V
标称供电电压 (Vsup)	3.3 V
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL
端子面层	Tin/Lead (Sn/Pb)
端子形式	BALL
端子节距	1 mm
端子位置	BOTTOM
宽度	13 mm
Base Number Matches	1

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4Mb: 256K x 18, 128K x 32/36

3.3V I/O PIPELINED, DCD SYNCBURST SRAM

4Mb SYNCBURST

™

SRAM

FEATURES

• Fast clock and OE# access times

• Single +3.3V +0.3V/-0.165V power supply (V

)

• Separate +3.3V isolated output buffer supply

• SNOOZE MODE for reduced-power standby

• Common data inputs and data outputs

• Individual BYTE WRITE control and GLOBAL

WRITE

• Three chip enables for simple depth expansion and

address pipelining

• Clock-controlled and registered addresses, data

I/Os and control signals

• Internally self-timed WRITE cycle

• Burst control pin (interleaved or linear burst)

• Automatic power-down for portable applications

• 165-pin FBGA package

• 100-pin TQFP package

• Low capacitive bus loading

• x18, x32, and x36 versions available

MT58L256L18D1, MT58L128L32D1,

MT58L128L36D1

3.3V V

, 3.3V I/O, Pipelined, Double-

Cycle Deselect

100-Pin TQFP

165-Pin FBGA

OPTIONS

• Timing (Access/Cycle/MHz)

3.5ns/6ns/166 MHz

4.0ns/7.5ns/133 MHz

5ns/10ns/100 MHz

• Configurations

256K x 18

128K x 32

128K x 36

• Packages

100-pin TQFP

165-pin FBGA

• Operating Temperature Range

Commercial (0°C to +70°C)

Industrial (-40°C to +85°C)**

Part Number Example:

MARKING

-6

-7.5

-10

NOTE:

1. JEDEC-standard MS-026 BHA (LQFP).

MT58L256L18D1

MT58L128L32D1

MT58L128L36D1

None

GENERAL DESCRIPTION

The Micron

SyncBurst

™

SRAM family employs

high-speed, low-power CMOS designs that are fabri-

cated using an advanced CMOS process.

Micron’s 4Mb SyncBurst SRAMs integrate a 256K x

18, 128K x 32, or 128K x 36 SRAM core with advanced

synchronous peripheral circuitry and a 2-bit burst

counter. All synchronous inputs pass through registers

controlled by a positive-edge-triggered single clock

input (CLK). The synchronous inputs include all ad-

dresses, all data inputs, active LOW chip enable (CE#),

two additional chip enables for easy depth expansion

(CE2, CE2#), burst control inputs (ADSC#, ADSP#,

ADV#), byte write enables (BWx#) and global write

(GW#).

MT58L256L18D1T-6

* A Part Marking Guide for the FBGA devices can be found on Micron’s

Web site—http://www.micron.com/support/index.html.

** Industrial temperature range offered in specific speed grades and

configurations. Contact factory for more information.

4Mb: 256K x 18, 128K x 32/36 3.3V I/O Pipelined, DCD SyncBurst SRAM

MT58L256L18D1_E.p65 – Rev. 2/02

Micron Technology, Inc., reserves the right to change products or specifications without notice.

MT58L128L32D1F-6相似产品对比

	MT58L128L32D1F-6	MT58L256L18D1F-6	MT58L128L32D1F-10	MT58L128L32D1T-6	MT58L128L36D1T-10	MT58L256L18D1T-10	MT58L128L36D1F-10	MT58L256L18D1T-6	MT58L128L36D1T-6
描述	Cache SRAM, 128KX32, 3.5ns, CMOS, PBGA165, FBGA-165	Cache SRAM, 256KX18, 3.5ns, CMOS, PBGA165, FBGA-165	Cache SRAM, 128KX32, 5ns, CMOS, PBGA165, FBGA-165	Cache SRAM, 128KX32, 3.5ns, CMOS, PQFP100, PLASTIC, TQFP-100	Cache SRAM, 128KX36, 5ns, CMOS, PQFP100, PLASTIC, TQFP-100	Cache SRAM, 256KX18, 5ns, CMOS, PQFP100, PLASTIC, TQFP-100	Cache SRAM, 128KX36, 5ns, CMOS, PBGA165, FBGA-165	Cache SRAM, 256KX18, 3.5ns, CMOS, PQFP100, PLASTIC, TQFP-100	Cache SRAM, 128KX36, 3.5ns, CMOS, PQFP100, PLASTIC, TQFP-100
是否Rohs认证	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合
零件包装代码	BGA	BGA	BGA	QFP	QFP	QFP	BGA	QFP	QFP
包装说明	FBGA-165	FBGA-165	FBGA-165	PLASTIC, TQFP-100	PLASTIC, TQFP-100	PLASTIC, TQFP-100	FBGA-165	PLASTIC, TQFP-100	PLASTIC, TQFP-100
针数	165	165	165	100	100	100	165	100	100
Reach Compliance Code	unknown	_compli	unknown	unknown	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
ECCN代码	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
最长访问时间	3.5 ns	3.5 ns	5 ns	3.5 ns	5 ns	5 ns	5 ns	3.5 ns	3.5 ns
其他特性	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE
最大时钟频率 (fCLK)	166 MHz	166 MHz	100 MHz	166 MHz	100 MHz	100 MHz	100 MHz	166 MHz	166 MHz
I/O 类型	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 代码	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PBGA-B165	R-PQFP-G100	R-PQFP-G100
JESD-609代码	e0	e0	e0	e0	e0	e0	e0	e0	e0
长度	15 mm	15 mm	15 mm	20 mm	20 mm	20 mm	15 mm	20 mm	20 mm
内存密度	4194304 bit	4718592 bi	4194304 bit	4194304 bit	4718592 bit	4718592 bit	4718592 bit	4718592 bit	4718592 bit
内存集成电路类型	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM
内存宽度	32	18	32	32	36	18	36	18	36
功能数量	1	1	1	1	1	1	1	1	1
端子数量	165	165	165	100	100	100	165	100	100
字数	131072 words	262144 words	131072 words	131072 words	131072 words	262144 words	131072 words	262144 words	131072 words
字数代码	128000	256000	128000	128000	128000	256000	128000	256000	128000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
组织	128KX32	256KX18	128KX32	128KX32	128KX36	256KX18	128KX36	256KX18	128KX36
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	TBGA	TBGA	TBGA	LQFP	LQFP	LQFP	TBGA	LQFP	LQFP
封装等效代码	BGA165,11X15,40	BGA165,11X15,40	BGA165,11X15,40	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87	BGA165,11X15,40	QFP100,.63X.87	QFP100,.63X.87
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	GRID ARRAY, THIN PROFILE	GRID ARRAY, THIN PROFILE	GRID ARRAY, THIN PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	GRID ARRAY, THIN PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
电源	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.2 mm	1.2 mm	1.2 mm	1.6 mm	1.6 mm	1.6 mm	1.2 mm	1.6 mm	1.6 mm
最大待机电流	0.01 A	0.01 A	0.01 A	0.01 A	0.01 A	0.01 A	0.01 A	0.01 A	0.01 A
最小待机电流	3.14 V	3.14 V	3.14 V	3.14 V	3.14 V	3.14 V	3.14 V	3.14 V	3.14 V
最大压摆率	0.475 mA	0.475 mA	0.3 mA	0.475 mA	0.3 mA	0.3 mA	0.3 mA	0.475 mA	0.475 mA
最大供电电压 (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
最小供电电压 (Vsup)	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V
标称供电电压 (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子面层	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
端子形式	BALL	BALL	BALL	GULL WING	GULL WING	GULL WING	BALL	GULL WING	GULL WING
端子节距	1 mm	1 mm	1 mm	0.65 mm	0.65 mm	0.65 mm	1 mm	0.65 mm	0.65 mm
端子位置	BOTTOM	BOTTOM	BOTTOM	QUAD	QUAD	QUAD	BOTTOM	QUAD	QUAD
宽度	13 mm	13 mm	13 mm	14 mm	14 mm	14 mm	13 mm	14 mm	14 mm
Base Number Matches	1	-	1	1	1	1	1	1	1

MT58L128L32D1F-6

MT58L128L32D1F-6概述

MT58L128L32D1F-6规格参数

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MT58L128L32D1F-6相似产品对比

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