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MT55L128L32P1T-10: 产品描述128KX32 ZBT SRAM, 5ns, PQFP100, PLASTIC, MS-026, TQFP-100; 产品类别存储存储; 文件大小1MB，共27页; 制造商Rochester Electronics; 官网地址https://www.rocelec.com/

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MT55L128L32P1T-10概述

128KX32 ZBT SRAM, 5ns, PQFP100, PLASTIC, MS-026, TQFP-100

MT55L128L32P1T-10规格参数

参数名称	属性值
厂商名称	Rochester Electronics
零件包装代码	QFP
包装说明	PLASTIC, MS-026, TQFP-100
针数	100
Reach Compliance Code	unknown
最长访问时间	5 ns
其他特性	PIPELINED ARCHITECTURE
JESD-30 代码	R-PQFP-G100
长度	20 mm
内存密度	4194304 bit
内存集成电路类型	ZBT SRAM
功能数量	1
端子数量	100
字数	131072 words
字数代码	128000
工作模式	SYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	128KX32
封装主体材料	PLASTIC/EPOXY
封装代码	LQFP
封装形状	RECTANGULAR
封装形式	FLATPACK, LOW PROFILE
并行/串行	PARALLEL
认证状态	COMMERCIAL
座面最大高度	1.6 mm
最大供电电压 (Vsup)	3.465 V
最小供电电压 (Vsup)	3.135 V
标称供电电压 (Vsup)	3.3 V
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL
端子形式	GULL WING
端子节距	0.65 mm
端子位置	QUAD
宽度	14 mm
Base Number Matches	1

MT55L128L32P1T-10相似产品对比

	MT55L128L32P1T-10	MT55L128L32P1T-6	MT55L256L18P1T-7.5	MT55L128V36P1T-7.5	MT55L256L18P1F-10	MT55L128V36P1T-10	MT55L128L36P1T-6	MT55L256V18P1T-10
描述	128KX32 ZBT SRAM, 5ns, PQFP100, PLASTIC, MS-026, TQFP-100	128KX32 ZBT SRAM, 3.5ns, PQFP100, PLASTIC, MS-026, TQFP-100	256KX18 ZBT SRAM, 4.2ns, PQFP100, PLASTIC, MS-026, TQFP-100	128KX36 ZBT SRAM, 4.2ns, PQFP100, PLASTIC, MS-026, TQFP-100	256K X 18 ZBT SRAM, 5 ns, PBGA165, FBGA-165	128KX36 ZBT SRAM, 5ns, PQFP100, PLASTIC, MS-026, TQFP-100	128KX36 ZBT SRAM, 3.5ns, PQFP100, PLASTIC, MS-026, TQFP-100	256KX18 ZBT SRAM, 5ns, PQFP100, PLASTIC, MS-026, TQFP-100
厂商名称	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics
零件包装代码	QFP	QFP	QFP	QFP	BGA	QFP	QFP	QFP
包装说明	PLASTIC, MS-026, TQFP-100	PLASTIC, MS-026, TQFP-100	PLASTIC, MS-026, TQFP-100	PLASTIC, MS-026, TQFP-100	TBGA,	PLASTIC, MS-026, TQFP-100	LQFP,	PLASTIC, MS-026, TQFP-100
针数	100	100	100	100	165	100	100	100
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
最长访问时间	5 ns	3.5 ns	4.2 ns	4.2 ns	5 ns	5 ns	3.5 ns	5 ns
其他特性	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE
JESD-30 代码	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PBGA-B165	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100
长度	20 mm	20 mm	20 mm	20 mm	15 mm	20 mm	20 mm	20 mm
内存密度	4194304 bit	4194304 bit	4718592 bit	4718592 bit	4718592 bit	4718592 bit	4718592 bit	4718592 bit
内存集成电路类型	ZBT SRAM	ZBT SRAM	ZBT SRAM	ZBT SRAM	ZBT SRAM	ZBT SRAM	ZBT SRAM	ZBT SRAM
功能数量	1	1	1	1	1	1	1	1
端子数量	100	100	100	100	165	100	100	100
字数	131072 words	131072 words	262144 words	131072 words	262144 words	131072 words	131072 words	262144 words
字数代码	128000	128000	256000	128000	256000	128000	128000	256000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
组织	128KX32	128KX32	256KX18	128KX36	256KX18	128KX36	128KX36	256KX18
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	LQFP	LQFP	LQFP	LQFP	TBGA	LQFP	LQFP	LQFP
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	GRID ARRAY, THIN PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
认证状态	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
座面最大高度	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.2 mm	1.6 mm	1.6 mm	1.6 mm
最大供电电压 (Vsup)	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V
最小供电电压 (Vsup)	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V
标称供电电压 (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子形式	GULL WING	GULL WING	GULL WING	GULL WING	BALL	GULL WING	GULL WING	GULL WING
端子节距	0.65 mm	0.65 mm	0.65 mm	0.65 mm	1 mm	0.65 mm	0.65 mm	0.65 mm
端子位置	QUAD	QUAD	QUAD	QUAD	BOTTOM	QUAD	QUAD	QUAD
宽度	14 mm	14 mm	14 mm	14 mm	13 mm	14 mm	14 mm	14 mm
内存宽度	-	-	18	36	18	36	36	18

MT55L128L32P1T-10

MT55L128L32P1T-10概述

MT55L128L32P1T-10规格参数

MT55L128L32P1T-10相似产品对比

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