Bus Driver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, CDFP20, CERPACK-20
| 参数名称 | 属性值 |
| 零件包装代码 | DFP |
| 包装说明 | DFP, |
| 针数 | 20 |
| Reach Compliance Code | unknow |
| 其他特性 | IOH = 0.3MA @ VOH = 4.3V; IOL = 0.3MA @ VOL = 0.2V |
| 系列 | FCT |
| JESD-30 代码 | R-GDFP-F20 |
| JESD-609代码 | e0 |
| 逻辑集成电路类型 | BUS DRIVER |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 传播延迟（tpd） | 7.2 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.3368 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 6.9215 mm |
| Base Number Matches | 1 |
| 5962-8762802SX | IDT74FCT374SOT/R | 5962-8762802RX | 5962-87628022X | |
|---|---|---|---|---|
| 描述 | Bus Driver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, CDFP20, CERPACK-20 | Bus Driver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, PDSO20, SOIC-20 | Bus Driver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, CDIP20, 0.300 INCH, CERDIP-20 | Bus Driver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, CQCC20, LCC-20 |
| 零件包装代码 | DFP | SOIC | DIP | QLCC |
| 包装说明 | DFP, | SOP, SOP20,.4 | DIP, | QCCN, |
| 针数 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknow | not_compliant | unknown | unknown |
| 系列 | FCT | FCT | FCT | FCT |
| JESD-30 代码 | R-GDFP-F20 | R-PDSO-G20 | R-GDIP-T20 | S-CQCC-N20 |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 70 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | - | -55 °C | -55 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DFP | SOP | DIP | QCCN |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | FLATPACK | SMALL OUTLINE | IN-LINE | CHIP CARRIER |
| 传播延迟（tpd） | 7.2 ns | 10 ns | 7.2 ns | 7.2 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.3368 mm | 2.65 mm | 5.08 mm | 2.54 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.25 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.75 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | COMMERCIAL | MILITARY | MILITARY |
| 端子形式 | FLAT | GULL WING | THROUGH-HOLE | NO LEAD |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | QUAD |
| 宽度 | 6.9215 mm | 7.5 mm | 7.62 mm | 8.89 mm |
| Base Number Matches | 1 | 1 | 1 | 1 |
| JESD-609代码 | e0 | e0 | - | e0 |
| 端子面层 | TIN LEAD | Tin/Lead (Sn85Pb15) | - | TIN LEAD |
| 长度 | - | 12.8 mm | 25.3365 mm | 8.89 mm |
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