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OP32B473M201LG

产品描述Ceramic Capacitor, Multilayer, Ceramic, 200V, 20% +Tol, 20% -Tol, X7R, 15% TC, 0.047uF, Surface Mount, 1210, CHIP, ROHS COMPLIANT
产品类别无源元件    电容器   
文件大小539KB,共10页
制造商Walsin_Technology_Corporation
标准  
下载文档 详细参数 全文预览

OP32B473M201LG概述

Ceramic Capacitor, Multilayer, Ceramic, 200V, 20% +Tol, 20% -Tol, X7R, 15% TC, 0.047uF, Surface Mount, 1210, CHIP, ROHS COMPLIANT

OP32B473M201LG规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
Objectid1247815163
包装说明, 1210
Reach Compliance Codecompliant
ECCN代码EAR99
电容0.047 µF
电容器类型CERAMIC CAPACITOR
介电材料CERAMIC
JESD-609代码e3
安装特点SURFACE MOUNT
多层Yes
负容差20%
端子数量2
最高工作温度125 °C
最低工作温度-55 °C
封装形状RECTANGULAR PACKAGE
包装方法TR, PLASTIC, 13 INCH
正容差20%
额定(直流)电压(URdc)200 V
尺寸代码1210
表面贴装YES
温度特性代码X7R
温度系数15% ppm/°C
端子面层Matte Tin (Sn) - with Nickel (Ni) barrier
端子形状WRAPAROUND

OP32B473M201LG文档预览

Approval sheet
Open Mode Series
MULTILAYER CERAMIC CAPACITORS
Open-Mode Series (100V to 500V)
0805 to 1812 Sizes
X7R Dielectric
RoHS Compliance
*Contents in this sheet are subject to change without prior notice.
Page 1 of 10
ASC_ Open Mode_012K_AS
Apr. 2011
Approval sheet
Open Mode Series
1. INTRODUCTION
WTC open-mode series MLCC is designed by a special internal electrode pattern, which can reduce voltage
concentrations by distributing voltage gradients throughout the entire capacitor. This special design also affords
open-mode pattern to prevent circuit leakage when focused to failure in a board flex situation.
2. FEATURES
b.
c.
d.
High voltage in a given case size.
Circuit open during product cracking.
High stability and reliability.
3. APPLICATIONS
a.
b.
c.
High current applications.
Power supply and related industries
The other mechanical stress concerned products.
4. HOW TO ORDER
OP
Series
OP=Open-mode
32
Size
21=0805
(2012)
31=1206
(3216)
32=1210
(3225)
43=1812
(4532)
B
Dielectric
B=X7R
103
Capacitance
K
Tolerance
201
Rated voltage
C
Termination
T
Packaging
T=7”
reeled
G=13”
reeled
Two significant
K=±10%
digits followed
M=±20%
by no. of zeros.
And R is in
place of
decimal point.
eg.:
102=10x10
2
=1000pF
Two significant
L=Ag/Ni/Sn
digits followed by
C=Cu/Ni/Sn
no. of zeros. And (Note 1)
R is in place of
decimal point.
101=100
VDC
201=200
VDC
251=250
VDC
501=500
VDC
Note 1: Please see below product range to find right termination code.
Page 2 of 10
ASC_ Open Mode_012K_AS
Apr. 2011
Approval sheet
Open Mode Series
5. EXTERNAL DIMENSIONS
Size
Inch (mm)
0805 (2012)
L (mm)
2.00±0.15
W (mm)
1.25±0.10
T (mm)/Symbol
0.80±0.10
1.25±0.10
0.80±0.10
0.95±0.10
1.25±0.10
1.60±0.20
0.95±0.10
1.25±0.10
1.60±0.20
2.50±0.30
1.25±0.10
2.00±0.20
B
D
B
C
D
G
C
D
G
M
D
K
Remark
M
B
(mm)
0.40±0.20
L
#
T
1206 (3216)
3.20±0.15
3.20±0.20
3.20±0.30
1.60±0.15
1.60±0.20
2.50±0.20
2.50±0.30
3.20±0.30
1210 (3225)
3.20±0.40
1812 (4532)
4.50+0.5/-0.3
#
#
#
#
#
#
#
#
0.50±0.20
M
B
M
B
W
Fig. 1 The outline of MLCC
0.50±0.25
0.60±0.25
# Reflow soldering only is recommended.
6. GENERAL ELECTRICAL DATA
Dielectric
Size
Capacitance*
Capacitance tolerance**
Rated voltage (WVDC)
Tan
δ*
Insulation resistance at Ur
Dielectric strength
Operating temperature
Capacitance characteristic
Termination
X7R
0805, 1206, 1210, 1812
100pF to 1µF
K (±10%), M (±20%)
100V, 200V, 250V, 500V
≤2.5%
≥10G
or RxC≥500 -F whichever is smaller
100V:
≥2.5
x WVDC
200V and 250V:
≥2
x WVDC
500V:
≥1.5
x WVDC
-55 to +125°
C
±15%
Ni/Sn (lead-free termination)
* Measured at 25° ambient temperature and 30~70% r elated humidity. Apply 1.0±0.2Vrms, 1.0kHz±10%.
C
** Preconditioning for Class II MLCC: Perform a heat treatment at 150±10° for 1 hour, then leave in a mbient condition for 24±2 hours
C
before measurement.
Page 3 of 10
ASC_ Open Mode_012K_AS
Apr. 2011
Approval sheet
Open Mode Series
7. CAPACITANCE RANGE
DIELECTRIC
SIZE
RATED VOLTAGE (VDC) 100
100pF (101)
B
120pF (121)
B
150pF (151)
B
180pF (181)
B
220pF (221)
B
270pF (271)
B
330pF (331)
B
390pF (391)
B
470pF (471)
B
560pF (561)
B
680pF (681)
B
820pF (821)
B
1,000pF (102)
B
1,200pF (122)
B
1,500pF (152)
B
1,800pF (182)
B
2,200pF (222)
B
2,700pF (272)
B
3,300pF (332)
B
3,900pF (392)
B
4,700pF (472)
B
5,600pF (562)
B
6,800pF (682)
B
8,200pF (822)
B
0.010µF (103)
B
0.012µF (123)
B
0.015µF (153)
B
0.018µF (183)
B
0.022µF (223)
B
0.027µF (273)
D
0.033µF (333)
D
0.039µF (393)
D
0.047µF (473)
D
0.056µF (563)
0.068µF (683)
0.082µF (823)
0.10µF (104)
0.12µF (124)
0.15µF (154)
0.18µF (184)
0.22µF (224)
0.27µF (274)
0.33µF (334)
0.39µF (394)
0.47µF (474)
0.56µF (564)
0.68µF (684)
0.82µF (824)
1.0µF (105)
Capacitance
X7R
0805
200 250
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
500
B^
B^
B^
B^
B^
B^
B^
B^
B^
B^
B^
B^
B^
B^
B^
B^
B^
B^
B^
100
1206
200 250
500
100
1210
200 250
500
100
1812
200 250
500
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
D
D
D
G
G
G
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
G
G
G
G
G
G
G
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
G
G
G
G
G
G
G
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
G
G
G
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
D
D
D
G
G
M
M
M
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
D
D
G
G
G
G
M
M
M
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
D
D
G
G
G
G
M
M
M
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
G
G
G
G
G
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
K
K
K
K
K
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
K
K
K
K
K
K
K
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
K
K
K
K
K
K
K
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
K
K
K
K
1. The letter in cell is expressed the symbol of product thickness.
2. The letter in cell with “^” mark is expressed product with Ag/Ni/Sn terminations.
Page 4 of 10
ASC_ Open Mode_012K_AS
Apr. 2011
Approval sheet
Open Mode Series
8. PACKAGING DIMENSION AND QUANTITY
Size
0805
Thickness (mm)/Symbol
0.80±0.10
1.25±0.10
0.80±0.10
1206
0.95±0.10
1.25±0.10
1.60±0.20
0.95±0.10
1210
1.25±0.10
1.60±0.20
2.50±0.30
1812
1.25±0.10
2.00±0.20
B
D
B
C
D
G
C
D
G
M
D
K
Paper tape
7” reel
4k
-
4k
-
-
-
-
-
-
-
-
-
13” reel
15k
-
15k
-
-
-
-
-
-
-
-
-
7” reel
-
3k
-
3k
3k
2k
3k
3k
2k
1k
1k
1k
Plastic tape
13” reel
-
10k
-
10k
10k
10k
10k
10k
-
-
-
-
Unit: pieces
9. INNER CONSTRUCTION OF OPEN-MODE DESIGN
M
B
CP
CP
M
B
Crack
Crack
Crack
Fig. 2 Normal design (CP<M
B
) –
circuit leakage during cracking.
Fig. 3 Open-mode design (CP>M
B
) –
circuit open during cracking.
Fig. 4 Floating design (one kind of
open-mode design)– circuit open
during cracking.
Page 5 of 10
ASC_ Open Mode_012K_AS
Apr. 2011
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