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5962-8751508LA

产品描述UVPROM, 8KX8, 35ns, CMOS, CDIP24, 0.300 INCH, WINDOWED, CERDIP-24
产品类别存储    存储   
文件大小491KB,共14页
制造商Cypress(赛普拉斯)
下载文档 详细参数 选型对比 全文预览

5962-8751508LA概述

UVPROM, 8KX8, 35ns, CMOS, CDIP24, 0.300 INCH, WINDOWED, CERDIP-24

5962-8751508LA规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
零件包装代码DIP
包装说明0.300 INCH, WINDOWED, CERDIP-24
针数24
Reach Compliance Code_compli
ECCN代码EAR99
最长访问时间35 ns
I/O 类型COMMON
JESD-30 代码R-GDIP-T24
JESD-609代码e0
长度31.877 mm
内存密度65536 bi
内存集成电路类型UVPROM
内存宽度8
功能数量1
端子数量24
字数8192 words
字数代码8000
工作模式ASYNCHRONOUS
最高工作温度125 °C
最低工作温度-55 °C
组织8KX8
输出特性3-STATE
封装主体材料CERAMIC, GLASS-SEALED
封装代码WDIP
封装等效代码DIP24,.3
封装形状RECTANGULAR
封装形式IN-LINE, WINDOW
并行/串行PARALLEL
峰值回流温度(摄氏度)NOT SPECIFIED
电源5 V
认证状态Not Qualified
筛选级别38535Q/M;38534H;883B
座面最大高度5.08 mm
最大待机电流0.03 A
最大压摆率0.12 mA
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装NO
技术CMOS
温度等级MILITARY
端子面层Tin/Lead (Sn/Pb) - hot dipped
端子形式THROUGH-HOLE
端子节距2.54 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度7.62 mm
Base Number Matches1

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CY7C261
CY7C263/CY7C264
8K x 8 Power-Switched and Reprogrammable PROM
Features
• CMOS for optimum speed/power
• Windowed for reprogrammability
• High speed
— 20 ns (commercial)
— 25 ns (military)
• Low power
— 660 mW (commercial)
— 770 mW (military)
• Super low standby power (7C261)
— Less than 220 mW when deselected
— Fast access: 20 ns
EPROM technology 100% programmable
Slim 300-mil or standard 600-mil packaging available
5V
±
10% V
CC
, commercial and military
Capable of withstanding greater than 2001V static dis-
charge
TTL-compatible I/O
Direct replacement for bipolar PROMs
Functional Description
The CY7C261, CY7C263, and CY7C264 are high-perfor-
mance 8192-word by 8-bit CMOS PROMs. When deselected,
the 7C261 automatically powers down into a low-power stand-
by mode. It is packaged in a 300-mil-wide package. The 7C263
and 7C264 are packaged in 300-mil-wide and 600-mil-wide
packages respectively, and do not power down when deselect-
ed. The reprogrammable packages are equipped with an era-
sure window; when exposed to UV light, these PROMs are
erased and can then be reprogrammed. The memory cells uti-
lize proven EPROM floating-gate technology and byte-wide in-
telligent programming algorithms.
The CY7C261, CY7C263, and CY7C264 are plug-in replace-
ments for bipolar devices and offer the advantages of lower
power, superior performance and programming yield. The
EPROM cell requires only 12.5V for the supervoltage and low
current requirements allow for gang programming. The
EPROM cells allow for each memory location to be tested
100%, as each location is written into, erased, and repeatedly
exercised prior to encapsulation. Each PROM is also tested for
AC performance to guarantee that after customer program-
ming the product will meet DC and AC specification limits.
Read is accomplished by placing an active LOW signal on CS.
The contents of the memory location addressed by the ad-
dress line (A
0
−A
12
) will become available on the output lines
(O
0
−O
7
).
Logic Block Diagram
A
0
A
1
A
2
A
3
A
4
A
5
A
6
A
7
A
8
A
9
A
10
A
11
A
12
O
1
POWER DOWN
(7C261)
COLUMN
ADDRESS
O
3
ADDRESS
DECODER
O
4
O
5
ROW
ADDRESS
PROGRAM–
MABLE
ARRAY
COLUMN
MULTI–
PLEXER
O
7
Pin Configurations
DIP/Flatpack
Top View
A
7
A
6
A
5
A
4
A
3
A
2
A
1
A
0
O
0
O
1
O
2
GND
1
24
2
23
3
22
4
21
5
20
6
19
18
7
8 7C261 17
7C263
9 7C264 16
10
15
11
14
12
13
V
CC
A
8
A
9
A
10
CS
A
11
A
12
O
7
O
6
O
5
O
4
O
3
O
6
LCC/PLCC (OpaqueOnly)
Top View
4 3 2 1 28 27 26
25
5
24
6
23
7C261
7
22
8
7C263
21
9
20
10
19
11
12 1314151617 18
O1
O2
GND
NC
O3
O4
O5
C261-3
A5
A6
A7
NC
VCC
A8
A9
A
4
A
3
A
2
A
1
A
0
NC
O
0
A
10
CS
A
11
A
12
NC
O
7
O
6
O
2
C261-2
O
0
CS
C261-1
For an 8K x 8 Registered PROM, see theCY7C265.
Cypress Semiconductor Corporation
3901 North First Street
San Jose • CA 95134 • 408-943-2600
March 1986 – Revised December 1994

5962-8751508LA相似产品对比

5962-8751508LA 5962-87515073A 5962-8751506LA 5962-8751512LA 5962-8751505LA 5962-9080304MLA 5962-9080303MLA
描述 UVPROM, 8KX8, 35ns, CMOS, CDIP24, 0.300 INCH, WINDOWED, CERDIP-24 UVPROM, 8KX8, 35ns, CMOS, CQCC28, WINDOWED, CERAMIC, LCC-28 UVPROM, 8KX8, 55ns, CMOS, CDIP24, 0.300 INCH, WINDOWED, CERDIP-24 UVPROM, 8KX8, 25ns, CMOS, CDIP24, 0.300 INCH, WINDOWED, CERDIP-24 UVPROM, 8KX8, 45ns, CMOS, CDIP24, 0.300 INCH, WINDOWED, CERDIP-24 OTP ROM, 8KX8, 25ns, CMOS, CDIP24, CERAMIC, DIP-24 OTP ROM, 8KX8, 35ns, CMOS, CDIP24, CERAMIC, DIP-24
零件包装代码 DIP QLCC DIP DIP DIP DIP DIP
包装说明 0.300 INCH, WINDOWED, CERDIP-24 WQCCN, LCC28,.45SQ WDIP, DIP24,.3 WDIP, DIP24,.3 WDIP, DIP24,.3 CERAMIC, DIP-24 DIP, DIP24,.3
针数 24 28 24 24 24 24 24
Reach Compliance Code _compli compliant unknown unknown unknown not_compliant unknown
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
最长访问时间 35 ns 35 ns 55 ns 25 ns 45 ns 25 ns 35 ns
I/O 类型 COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 代码 R-GDIP-T24 S-CQCC-N28 R-GDIP-T24 R-GDIP-T24 R-GDIP-T24 R-GDIP-T24 R-GDIP-T24
JESD-609代码 e0 e0 e0 e0 e0 e0 e0
长度 31.877 mm 11.43 mm 31.877 mm 31.877 mm 31.877 mm 31.877 mm 31.877 mm
内存密度 65536 bi 65536 bit 65536 bit 65536 bit 65536 bit 65536 bit 65536 bit
内存集成电路类型 UVPROM UVPROM UVPROM UVPROM UVPROM OTP ROM OTP ROM
内存宽度 8 8 8 8 8 8 8
功能数量 1 1 1 1 1 1 1
端子数量 24 28 24 24 24 24 24
字数 8192 words 8192 words 8192 words 8192 words 8192 words 8192 words 8192 words
字数代码 8000 8000 8000 8000 8000 8000 8000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
组织 8KX8 8KX8 8KX8 8KX8 8KX8 8KX8 8KX8
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
封装主体材料 CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
封装代码 WDIP WQCCN WDIP WDIP WDIP DIP DIP
封装等效代码 DIP24,.3 LCC28,.45SQ DIP24,.3 DIP24,.3 DIP24,.3 DIP24,.3 DIP24,.3
封装形状 RECTANGULAR SQUARE RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 IN-LINE, WINDOW CHIP CARRIER, WINDOW IN-LINE, WINDOW IN-LINE, WINDOW IN-LINE, WINDOW IN-LINE IN-LINE
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
电源 5 V 5 V 5 V 5 V 5 V 5 V 5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
筛选级别 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B MIL-STD-883 MIL-STD-883
座面最大高度 5.08 mm 2.8956 mm 5.08 mm 5.08 mm 5.08 mm 5.08 mm 5.08 mm
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 NO YES NO NO NO NO NO
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
端子面层 Tin/Lead (Sn/Pb) - hot dipped TIN LEAD TIN LEAD TIN LEAD TIN LEAD Tin/Lead (Sn/Pb) TIN LEAD
端子形式 THROUGH-HOLE NO LEAD THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
端子节距 2.54 mm 1.27 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
端子位置 DUAL QUAD DUAL DUAL DUAL DUAL DUAL
宽度 7.62 mm 11.43 mm 7.62 mm 7.62 mm 7.62 mm 7.62 mm 7.62 mm
Base Number Matches 1 1 1 1 1 1 1
最大待机电流 0.03 A 0.03 A - 0.05 A - 0.05 A 0.03 A
最大压摆率 0.12 mA 0.12 mA - 0.14 mA - 0.14 mA 0.12 mA
其他特性 - POWER SWITCHED PROM POWER SWITCHED PROM POWER SWITCHED PROM POWER SWITCHED PROM POWER SWITCHED PROM POWER SWITCHED PROM
厂商名称 - - Cypress(赛普拉斯) Cypress(赛普拉斯) Cypress(赛普拉斯) Cypress(赛普拉斯) Cypress(赛普拉斯)

 
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