AC SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, CDFP16, CERAMIC, DFP-16
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | DFP |
| 包装说明 | DFP, FL16,.3 |
| 针数 | 16 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| 系列 | AC |
| 输入调节 | STANDARD |
| JESD-30 代码 | R-CDFP-F16 |
| JESD-609代码 | e4 |
| 负载电容(CL) | 50 pF |
| 逻辑集成电路类型 | OTHER DECODER/DRIVER |
| 最大I(ol) | 0.008 A |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出极性 | INVERTED |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DFP |
| 封装等效代码 | FL16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 电源 | 5 V |
| Prop。Delay @ Nom-Su | 15 ns |
| 传播延迟(tpd) | 15 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-PRF-38535 Class V |
| 座面最大高度 | 2.92 mm |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | GOLD |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 总剂量 | 300k Rad(Si) V |
| 宽度 | 6.73 mm |
| Base Number Matches | 1 |

| 5962F9853401VXC | 5962F9853401VEC | ACS138K/SAMPLE-02 | ACS138D/SAMPLE-02 | |
|---|---|---|---|---|
| 描述 | AC SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, CDFP16, CERAMIC, DFP-16 | AC SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, CDIP16, SIDE BRAZED, CERAMIC, DIP-16 | AC SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, CDFP16 | AC SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, CDIP16 |
| 零件包装代码 | DFP | DIP | DFP | DIP |
| 包装说明 | DFP, FL16,.3 | DIP, DIP16,.3 | DFP, | DIP, |
| 针数 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | compli | compliant | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| 系列 | AC | AC | AC | AC |
| 输入调节 | STANDARD | STANDARD | STANDARD | STANDARD |
| JESD-30 代码 | R-CDFP-F16 | R-CDIP-T16 | R-CDFP-F16 | R-CDIP-T16 |
| 逻辑集成电路类型 | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 |
| 输出极性 | INVERTED | INVERTED | INVERTED | INVERTED |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DFP | DIP | DFP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | IN-LINE | FLATPACK | IN-LINE |
| 传播延迟(tpd) | 15 ns | 15 ns | 15 ns | 15 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.92 mm | 5.08 mm | 2.92 mm | 5.08 mm |
| 表面贴装 | YES | NO | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 端子形式 | FLAT | THROUGH-HOLE | FLAT | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 6.73 mm | 7.62 mm | 6.73 mm | 7.62 mm |
| Base Number Matches | 1 | 1 | 1 | - |
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